JPS6367267U - - Google Patents
Info
- Publication number
- JPS6367267U JPS6367267U JP16256586U JP16256586U JPS6367267U JP S6367267 U JPS6367267 U JP S6367267U JP 16256586 U JP16256586 U JP 16256586U JP 16256586 U JP16256586 U JP 16256586U JP S6367267 U JPS6367267 U JP S6367267U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- base
- semiconductor
- sensor chip
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Description
第１図は本考案の一実施例の構成説明図、第２
図は第１図の動作説明図、第３図は本考案の他の
実施例の構成説明図、第４図は本考案の別の実施
例の構成説明図、第５図は本考案の具体例、第６
図は第５図の説明図、第７図は従来より一般に使
用されている従来例の構成説明図、第８図は従来
より一般に使用されている他の従来例の構成説明
図である。
１……センサチツプ、１１……凹部、１２……
ダイアフラム部、１３……ピエゾ抵抗ゲージ、１
４……導圧室、４……ハウジング、５……ガラス
層、５１……導圧孔、７……ベース、８……半導
体基板、８１……連通孔、８２……段部、……
接合部、……接合部。
Figure 1 is an explanatory diagram of the configuration of one embodiment of the present invention;
1 is an explanatory diagram of the operation of FIG. 1, FIG. 3 is an explanatory diagram of the configuration of another embodiment of the present invention, FIG. 4 is an explanatory diagram of the configuration of another embodiment of the present invention, and FIG. Example, 6th
The drawings are an explanatory diagram of FIG. 5, FIG. 7 is an explanatory diagram of the configuration of a conventional example commonly used, and FIG. 8 is an explanatory diagram of the configuration of another conventional example commonly used. 1...sensor chip, 11...recess, 12...
Diaphragm section, 13...Piezo resistance gauge, 1
4...Pressure chamber, 4...Housing, 5...Glass layer, 51...Pressure hole, 7...Base, 8...Semiconductor substrate, 81...Communication hole, 82...Step part,...
Joint, ... joint.
Claims (1)
プにダイアフラムを形成する凹部と、前記ダイア
フラムに設けられたピエゾ抵抗ゲージと、前記セ
ンサチツプに一端側が取付けられ前記凹部と導圧
室を構成する半導体基板と、該半導体基板に設け
られ前記導圧室と連通する導圧孔と、前記半導体
基板の他端側に取付けられたベースと、該ベース
に設けられ一端が外部に開口し他端が前記導圧孔
に連通する連通孔とを具備する半導体圧力センサ
において、前記センサチツプと前記半導体基板と
の接合部の断面積が前記半導体基板と前記ベース
との接合部の断面積より大なるように構成された
ことを特徴とする半導体圧力センサ。 A sensor chip made of a semiconductor, a recess forming a diaphragm in the sensor chip, a piezoresistance gauge provided on the diaphragm, a semiconductor substrate having one end attached to the sensor chip and forming a pressure chamber with the recess, and the semiconductor substrate. a base attached to the other end side of the semiconductor substrate; and a base provided on the base with one end opening to the outside and the other end communicating with the pressure conduction hole. A semiconductor pressure sensor having a communication hole, characterized in that a cross-sectional area of a joint between the sensor chip and the semiconductor substrate is larger than a cross-sectional area of a joint between the semiconductor substrate and the base. Semiconductor pressure sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16256586U JPS6367267U (en) | 1986-10-23 | 1986-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16256586U JPS6367267U (en) | 1986-10-23 | 1986-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6367267U true JPS6367267U (en) | 1988-05-06 |
Family
ID=31089947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16256586U Pending JPS6367267U (en) | 1986-10-23 | 1986-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6367267U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013167468A (en) * | 2012-02-14 | 2013-08-29 | Alps Electric Co Ltd | Pressure sensor and method for manufacturing the same |
| JP2014134427A (en) * | 2013-01-09 | 2014-07-24 | Denso Corp | Physical quantity sensor and method for manufacturing the same |
-
1986
- 1986-10-23 JP JP16256586U patent/JPS6367267U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013167468A (en) * | 2012-02-14 | 2013-08-29 | Alps Electric Co Ltd | Pressure sensor and method for manufacturing the same |
| JP2014134427A (en) * | 2013-01-09 | 2014-07-24 | Denso Corp | Physical quantity sensor and method for manufacturing the same |