JPS61192460U - - Google Patents

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Publication number
JPS61192460U
JPS61192460U JP7584585U JP7584585U JPS61192460U JP S61192460 U JPS61192460 U JP S61192460U JP 7584585 U JP7584585 U JP 7584585U JP 7584585 U JP7584585 U JP 7584585U JP S61192460 U JPS61192460 U JP S61192460U
Authority
JP
Japan
Prior art keywords
covered
pressure sensor
piezoresistive element
silicon
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7584585U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7584585U priority Critical patent/JPS61192460U/ja
Publication of JPS61192460U publication Critical patent/JPS61192460U/ja
Pending legal-status Critical Current

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  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の要部構成説明図、
第2図は第1図の平面図、第3図は第1図の工程
図、第4図は本考案の他の実施例の要部構成説明
図、第5図は本考案の別の実施例の要部構成説明
図、第6図は従来より一般に使用されている従来
例の構成説明図、第7図は第6図の平面図、第8
図は第6図の要部詳細図である。 1…支持台、2…ダイアフラム、21…基準室
、3…剪断形ゲージ、31…パシベーシヨン膜、
311…酸化シリコン膜、312…窒化膜、31
3…PSG膜、314…コンタクト穴、315…
ポリシリコン膜、32…電極、33…低抵抗層。
FIG. 1 is an explanatory diagram of the main part configuration of an embodiment of the present invention,
Fig. 2 is a plan view of Fig. 1, Fig. 3 is a process diagram of Fig. 1, Fig. 4 is an explanatory diagram of the main part configuration of another embodiment of the present invention, and Fig. 5 is another embodiment of the present invention. FIG. 6 is an explanatory diagram of the configuration of the main part of the example, FIG. 6 is an explanatory diagram of the configuration of the conventional example commonly used, FIG.
The figure is a detailed view of the main part of FIG. 6. DESCRIPTION OF SYMBOLS 1... Support stand, 2... Diaphragm, 21... Reference chamber, 3... Shear type gauge, 31... Passivation membrane,
311...Silicon oxide film, 312...Nitride film, 31
3...PSG film, 314...contact hole, 315...
Polysilicon film, 32...electrode, 33...low resistance layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] シリコン半導体基板にピエゾ抵抗素子が形成さ
れ外表面が酸化シリコン膜で覆われた半導体圧力
センサにおいて、前記ピエゾ抵抗素子が設けられ
ている側の前記シリコン半導体表面がPSG膜で
覆われたことを特徴とする半導体圧力センサ。
A semiconductor pressure sensor in which a piezoresistive element is formed on a silicon semiconductor substrate and the outer surface is covered with a silicon oxide film, characterized in that the silicon semiconductor surface on the side where the piezoresistive element is provided is covered with a PSG film. Semiconductor pressure sensor.
JP7584585U 1985-05-22 1985-05-22 Pending JPS61192460U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7584585U JPS61192460U (en) 1985-05-22 1985-05-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7584585U JPS61192460U (en) 1985-05-22 1985-05-22

Publications (1)

Publication Number Publication Date
JPS61192460U true JPS61192460U (en) 1986-11-29

Family

ID=30617443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7584585U Pending JPS61192460U (en) 1985-05-22 1985-05-22

Country Status (1)

Country Link
JP (1) JPS61192460U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001281085A (en) * 2000-03-28 2001-10-10 Toyoda Mach Works Ltd Semiconductor, pressure sensor and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001281085A (en) * 2000-03-28 2001-10-10 Toyoda Mach Works Ltd Semiconductor, pressure sensor and manufacturing method thereof

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