JPS62197036U

JPS62197036U -

Info

Publication number: JPS62197036U
Application number: JP8644386U
Authority: JP
Priority date: 1986-06-06
Filing date: 1986-06-06
Publication date: 1987-12-15

Description

[Brief explanation of the drawing]

第１図は本考案の一実施例を示すもので、イは
第１のシリコンウエハの平面図、ロは第２のシリ
コンウエハの平面図、ハはイとロを接合し圧力セ
ンサを構成した断面図、第２図は他の実施例を示
す断面図イおよびＸ視図ロ、第３図イ，ロ、第４
図イ，ロは従来例を示す図である。１……第１のシリコンウエハ、２……第２のシ
リコンウエハ、３……穴、４……ダイアフラム、
５……導圧溝、６……導圧孔、８……導圧管。 Figure 1 shows an embodiment of the present invention, in which A is a plan view of the first silicon wafer, B is a plan view of the second silicon wafer, and C is a pressure sensor formed by joining A and B. 2 is a sectional view A and an X view B showing other embodiments; FIGS. 3 A and B;
Figures A and B show conventional examples. 1... First silicon wafer, 2... Second silicon wafer, 3... Hole, 4... Diaphragm,
5... Pressure guiding groove, 6... Pressure guiding hole, 8... Pressure guiding pipe.

Claims

[Scope of utility model registration request]

It consists of a first silicon wafer having a diaphragm at the bottom of the hole, and a second silicon wafer having the same material and the same thickness as the first silicon wafer, and at least one of the first and second silicon wafers. . A silicon pressure sensor comprising a pressure guiding groove for introducing pressure into the hole.