JPS62168235U - - Google Patents
Info
- Publication number
- JPS62168235U JPS62168235U JP5705786U JP5705786U JPS62168235U JP S62168235 U JPS62168235 U JP S62168235U JP 5705786 U JP5705786 U JP 5705786U JP 5705786 U JP5705786 U JP 5705786U JP S62168235 U JPS62168235 U JP S62168235U
- Authority
- JP
- Japan
- Prior art keywords
- fitting groove
- sealing member
- width
- substrate
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 2
Landscapes
- Jigs For Machine Tools (AREA)
Description
第１図乃至第３図は本考案の一実施例を示し、
第１図はチヤツクの嵌合溝にＯリングが圧入嵌合
された状態を示す断面図、第２図は嵌合溝を示す
断面図、第３図は半導体基板のチヤツク装置を示
す縦断面図、第４図は従来例を示す断面図である
。
Ｋ…半導体基板、１２ａ…載置部、１２…チヤ
ツク、１３…嵌合溝、１４…Ｏリング（シール部
材）。
1 to 3 show an embodiment of the present invention,
Fig. 1 is a sectional view showing the O-ring press-fitted into the fitting groove of the chuck, Fig. 2 is a sectional view showing the fitting groove, and Fig. 3 is a longitudinal sectional view showing the chuck device of the semiconductor substrate. , FIG. 4 is a sectional view showing a conventional example. K...Semiconductor substrate, 12a...Placement part, 12...Chuck, 13...Fitting groove, 14...O ring (sealing member).
Claims (1)
の基板に真空圧を供給してこれを真空チヤツクす
るものにおいて、前記基板チエツクの載置面にそ
の外周縁部に沿つて形成された嵌合溝と、この嵌
合溝の入口側の幅寸法より肉厚寸法を大とし前記
嵌合溝内に弾性変形されて圧入嵌合されたシール
部材とを具備してなることを特徴とする真空チヤ
ツク装置。 (2) 嵌合溝はその内底部側の幅寸法を入口側の
幅寸法より大とし、この内底部側でシール部材を
脹らませたことを特徴とする実用新案登録請求の
範囲第１項記載の真空チヤツク装置。 (3) シール部材はＯリングであることを特徴と
する実用新案登録請求の範囲第１項または第２項
記載の真空チヤツク装置。[Claims for Utility Model Registration] (1) In a device that places a substrate on the placement surface of a substrate chuck and vacuum chucks it by supplying vacuum pressure to the substrate, A fitting groove formed along the outer peripheral edge, and a sealing member having a wall thickness larger than the width on the entrance side of the fitting groove and elastically deformed and press-fitted into the fitting groove. A vacuum chuck device comprising: (2) The fitting groove has a width on the inner bottom side that is larger than the width on the entrance side, and the sealing member is swollen on the inner bottom side, Claim 1 Vacuum chuck device as described. (3) The vacuum chuck device according to claim 1 or 2, wherein the sealing member is an O-ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5705786U JPS62168235U (en) | 1986-04-16 | 1986-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5705786U JPS62168235U (en) | 1986-04-16 | 1986-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62168235U true JPS62168235U (en) | 1987-10-26 |
Family
ID=30886414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5705786U Pending JPS62168235U (en) | 1986-04-16 | 1986-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62168235U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016502112A (en) * | 2012-12-26 | 2016-01-21 | ベンタナ メディカル システムズ， インコーポレイテッド | Specimen processing system and method for holding glass slide |
-
1986
- 1986-04-16 JP JP5705786U patent/JPS62168235U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016502112A (en) * | 2012-12-26 | 2016-01-21 | ベンタナ メディカル システムズ， インコーポレイテッド | Specimen processing system and method for holding glass slide |