JPS6251249U - - Google Patents
Info
- Publication number
- JPS6251249U JPS6251249U JP14195085U JP14195085U JPS6251249U JP S6251249 U JPS6251249 U JP S6251249U JP 14195085 U JP14195085 U JP 14195085U JP 14195085 U JP14195085 U JP 14195085U JP S6251249 U JPS6251249 U JP S6251249U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- pressure
- transmission hole
- package
- hole formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000000007 visual effect Effects 0.000 claims 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図はこの考案の実施例に係る半導体圧力セ
ンサ及びこの半導体圧力センサが接合されるパツ
ケージの一部を示す斜視図、第２図はパツケージ
内に収納された半導体圧力センサの断面図、第３
図はパツケージ内に収納された半導体圧力センサ
の一従来例を示す断面図である。
（図の主要な部分を表わす符号の説明）、１…
…第１の基板、１１……ガラスリング、５……第
２の基板、１３……ガイド溝、７，１７……圧力
伝達孔。
1 is a perspective view showing a semiconductor pressure sensor according to an embodiment of the invention and a part of a package to which this semiconductor pressure sensor is joined; FIG. 2 is a sectional view of the semiconductor pressure sensor housed in the package; 3
The figure is a sectional view showing a conventional example of a semiconductor pressure sensor housed in a package. (Explanation of symbols representing main parts of the figure), 1...
...First substrate, 11...Glass ring, 5...Second substrate, 13...Guide groove, 7, 17...Pressure transmission hole.
Claims (1)
に受圧面が形成されたダイヤフラムを有する第１
の基板の前記受圧面が形成された面に接合され、
前記ダイヤフラムの受圧面への圧力伝達用溝及び
孔が形成された第２の基板が、外部からの測定さ
れる圧力を前記ダイヤフラムの受圧面に伝達する
圧力伝達用孔が形成されたパツケージに、前記第
２の基板に形成された圧力伝達用孔と前記パツケ
ージに形成された圧力伝達用孔とが連通するよう
収納された半導体圧力センサにおいて、前記第２
の基板が、この第２の基板と前記パツケージとの
間に間隙を形成する介装部材を介して前記パツケ
ージに接合されたことを特徴とする半導体圧力セ
ンサ。 (2) 前記介装部材は前記第２の基板に形成され
た圧力伝達用孔と前記パツケージに形成された圧
力伝達用孔が連通する端部を目視することができ
る材質で形成されたことを特徴する実用新案登録
請求の範囲第１項に記載の半導体圧力センサ。[Claims for Utility Model Registration] (1) A first device having a diaphragm with a diffusion resistance formed on one surface and a pressure receiving surface formed on the other surface.
is bonded to the surface on which the pressure receiving surface of the substrate is formed;
a second substrate formed with grooves and holes for transmitting pressure to the pressure receiving surface of the diaphragm; In the semiconductor pressure sensor housed so that a pressure transmission hole formed in the second substrate and a pressure transmission hole formed in the package communicate with each other, the second
A semiconductor pressure sensor characterized in that a second substrate is joined to the package via an intervening member that forms a gap between the second substrate and the package. (2) The intervening member is made of a material that allows visual observation of the end where the pressure transmission hole formed in the second substrate and the pressure transmission hole formed in the package communicate with each other. A semiconductor pressure sensor according to claim 1, characterized in that it is a utility model.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14195085U JPS6251249U (en) | 1985-09-19 | 1985-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14195085U JPS6251249U (en) | 1985-09-19 | 1985-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6251249U true JPS6251249U (en) | 1987-03-30 |
Family
ID=31050214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14195085U Pending JPS6251249U (en) | 1985-09-19 | 1985-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6251249U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014002150A1 (en) * | 2012-06-29 | 2014-01-03 | 株式会社デンソー | Pressure sensor |
-
1985
- 1985-09-19 JP JP14195085U patent/JPS6251249U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014002150A1 (en) * | 2012-06-29 | 2014-01-03 | 株式会社デンソー | Pressure sensor |
| JP2014010086A (en) * | 2012-06-29 | 2014-01-20 | Denso Corp | Pressure sensor |
| US9513182B2 (en) | 2012-06-29 | 2016-12-06 | Denso Corporation | Pressure sensor having multiple piezoresistive elements |
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