JPS62131453U - - Google Patents

Info

Publication number
JPS62131453U
JPS62131453U JP1986016824U JP1682486U JPS62131453U JP S62131453 U JPS62131453 U JP S62131453U JP 1986016824 U JP1986016824 U JP 1986016824U JP 1682486 U JP1682486 U JP 1682486U JP S62131453 U JPS62131453 U JP S62131453U
Authority
JP
Japan
Prior art keywords
pedestal
silicon
pressure sensor
fixed
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986016824U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986016824U priority Critical patent/JPS62131453U/ja
Publication of JPS62131453U publication Critical patent/JPS62131453U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す断面図、第２
図ないし第４図は本考案の他の実施例を示す図で
あり、第２図は陽極接合装置の構成図、第３図ａ
およびｂはシリコンダイヤフラムを構成するシリ
コンチツプを示す平面図および側面図、第４図は
台座を構成するガラス管を示す断面図である。 １，１１……シリコンダイヤフラム、２，１２
……陽極接合部、３，１３……台座。 Fig. 1 is a sectional view showing one embodiment of the present invention;
4 to 4 are diagrams showing other embodiments of the present invention, FIG. 2 is a configuration diagram of an anodic bonding apparatus, and FIG. 3 a
and b are a plan view and a side view showing a silicon chip constituting a silicon diaphragm, and FIG. 4 is a sectional view showing a glass tube constituting a pedestal. 1, 11...Silicon diaphragm, 2, 12
...Anode joint, 3,13...Pedestal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] シリコンに近似した熱膨張係数を有する材料か
らなる貫通孔を備えた台座と、この台座上に上記
貫通孔をふさぐように固着されたシリコンダイヤ
フラムからなる感圧半導体素子とを含む半導体圧
力センサにおいて、上記シリコンダイヤフラムは
、陽極接合によつて上記台座に固着されてなるこ
とを特徴とする半導体圧力センサ。 A semiconductor pressure sensor including a pedestal with a through hole made of a material having a coefficient of thermal expansion similar to silicon, and a pressure sensitive semiconductor element made of a silicon diaphragm fixed to the pedestal so as to close the through hole, A semiconductor pressure sensor characterized in that the silicon diaphragm is fixed to the pedestal by anodic bonding.
JP1986016824U 1986-02-10 1986-02-10 Pending JPS62131453U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986016824U JPS62131453U (en) 1986-02-10 1986-02-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986016824U JPS62131453U (en) 1986-02-10 1986-02-10

Publications (1)

Publication Number Publication Date
JPS62131453U true JPS62131453U (en) 1987-08-19

Family

ID=30809026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986016824U Pending JPS62131453U (en) 1986-02-10 1986-02-10

Country Status (1)

Country Link
JP (1) JPS62131453U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000506261A (en) * 1996-02-27 2000-05-23 ニフォテク・アーエス Pressure sensor
JP2007253323A (en) * 2006-03-24 2007-10-04 Infineon Technologies Sensonor As Integral pedestal mount for mems structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000506261A (en) * 1996-02-27 2000-05-23 ニフォテク・アーエス Pressure sensor
JP2007253323A (en) * 2006-03-24 2007-10-04 Infineon Technologies Sensonor As Integral pedestal mount for mems structure

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