JPH0166046U - - Google Patents
Info
- Publication number
- JPH0166046U JPH0166046U JP1987161169U JP16116987U JPH0166046U JP H0166046 U JPH0166046 U JP H0166046U JP 1987161169 U JP1987161169 U JP 1987161169U JP 16116987 U JP16116987 U JP 16116987U JP H0166046 U JPH0166046 U JP H0166046U
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- substrate
- pressure
- sensor chip
- strain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 238000009792 diffusion process Methods 0.000 claims 1
- 238000005468 ion implantation Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は本考案の一実施例の要部構成説明図、
第２図は第１図の製作説明図、第３図は本考案の
他の実施例の要部構成説明図、第４図は本考案の
別の実施例の要部構成説明図、第５図は本考案の
他の実施例の要部構成説明図、第６図は従来より
一般に使用されている従来例の構成説明図である
。
１……センサアセンブリ、１１……センサチツ
プ、１１１……感圧部、１１１１……薄肉起歪部
、１１１２…ゲージ、１１１３……アンプ部、３
……基板部、３１……基板、３１１……導圧孔、
３２……金属薄膜、３３……ガラス薄膜、４１…
…ガラス層、４２……シリコンチツプ。
FIG. 1 is an explanatory diagram of the main part of an embodiment of the present invention.
Fig. 2 is an explanatory diagram of the production of Fig. 1, Fig. 3 is an explanatory diagram of the main part configuration of another embodiment of the present invention, Fig. 4 is an explanatory diagram of the main part composition of another embodiment of the present invention, and Fig. 5 is an explanatory diagram of the main part composition of another embodiment of the present invention. The figure is an explanatory diagram of the main part configuration of another embodiment of the present invention, and FIG. 6 is an explanatory diagram of the configuration of a conventional example that has been generally used. DESCRIPTION OF SYMBOLS 1... Sensor assembly, 11... Sensor chip, 111... Pressure sensitive part, 1111... Thin strain generating part, 1112... Gauge, 1113... Amplifier part, 3
... Board part, 31 ... Board, 311 ... Pressure conducting hole,
32...Metal thin film, 33...Glass thin film, 41...
...Glass layer, 42...Silicon chip.
Claims (1)
該薄肉起歪部の表面近くに熱拡散あるいはイオン
注入により作成されたゲージとよりなる感圧部を
備える半導体からなるセンサチツプと、該センサ
チツプと熱膨張係数が近くセラミツクスよりなる
基板と該基板の一面に設けられた金属薄膜と該金
属薄膜表面に形成されたガラス薄板とからなり該
ガラス薄膜を介して前記センサチツプに陽極接合
により接合される基板部とを具備してなる半導体
圧力センサ。 A sensor chip made of a semiconductor, comprising a thin strain-generating part that generates stress in response to measurement pressure, and a pressure-sensitive part made of a gauge made by thermal diffusion or ion implantation near the surface of the thin-walled strain-generating part; A substrate comprising a substrate made of ceramics having a close coefficient of thermal expansion, a metal thin film provided on one surface of the substrate, and a glass thin plate formed on the surface of the metal thin film, and bonded to the sensor chip by anodic bonding via the glass thin film. A semiconductor pressure sensor comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161169U JPH0166046U (en) | 1987-10-21 | 1987-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161169U JPH0166046U (en) | 1987-10-21 | 1987-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0166046U true JPH0166046U (en) | 1989-04-27 |
Family
ID=31443885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161169U Pending JPH0166046U (en) | 1987-10-21 | 1987-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0166046U (en) |
-
1987
- 1987-10-21 JP JP1987161169U patent/JPH0166046U/ja active Pending
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