JPS6451844U - - Google Patents
Info
- Publication number
- JPS6451844U JPS6451844U JP14791487U JP14791487U JPS6451844U JP S6451844 U JPS6451844 U JP S6451844U JP 14791487 U JP14791487 U JP 14791487U JP 14791487 U JP14791487 U JP 14791487U JP S6451844 U JPS6451844 U JP S6451844U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- silicon
- sensor chip
- fixing portion
- fixing part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 230000000704 physical effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は本考案の１実施例の構成を示す縦断面
図、第２図は第１図に示す実施例の効果を説明す
る特性図、第３図は本考案の第２の実施例の構成
を示す縦断面図、第４図は従来の半導体圧力セン
サの構成を示す構成図、第５図は第４図に示す半
導体圧力センサの持つ問題点を説明する説明図で
ある。
１，１２，２２…センサチツプ、２，１３…凹
部、３，１４…起歪部、４，１５，２３…固定部
、６，１９，２１…基板、７…剪断形ゲージ、１
６，２０…応力緩和溝、１７…ゲージ。
Fig. 1 is a vertical sectional view showing the configuration of one embodiment of the present invention, Fig. 2 is a characteristic diagram explaining the effects of the embodiment shown in Fig. 1, and Fig. 3 is a diagram of the second embodiment of the invention. FIG. 4 is a configuration diagram showing the configuration of a conventional semiconductor pressure sensor, and FIG. 5 is an explanatory diagram illustrating problems with the semiconductor pressure sensor shown in FIG. 4. DESCRIPTION OF SYMBOLS 1, 12, 22... Sensor chip, 2, 13... Recessed part, 3, 14... Strain generating part, 4, 15, 23... Fixing part, 6, 19, 21... Substrate, 7... Shear type gauge, 1
6, 20... Stress relaxation groove, 17... Gauge.
Claims (1)
の薄くなつた起歪部を持つセンサチツプと、この
センサチツプの固定部と接合されるシリコン或い
はシリコンと物性値の近似したガラスからなる基
板と、前記固定部或いはこの固定部と対向する前
記基板の接合面に前記基板への応力集中を緩和す
る応力緩和溝を設けたことを特徴とする半導体圧
力センサ。 A sensor chip having a strain-generating part in which a recess is formed inside the fixing part and the thickness of a single crystal is reduced, and a substrate made of silicon or glass having physical properties similar to silicon, which is bonded to the fixing part of the sensor chip. . A semiconductor pressure sensor, characterized in that a stress relief groove is provided on the fixing portion or on the bonding surface of the substrate facing the fixing portion to relieve stress concentration on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14791487U JPS6451844U (en) | 1987-09-28 | 1987-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14791487U JPS6451844U (en) | 1987-09-28 | 1987-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6451844U true JPS6451844U (en) | 1989-03-30 |
Family
ID=31418762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14791487U Pending JPS6451844U (en) | 1987-09-28 | 1987-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6451844U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009041465A1 (en) * | 2007-09-25 | 2009-04-02 | Alps Electric Co., Ltd. | Semiconductor pressure sensor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57190242A (en) * | 1981-05-20 | 1982-11-22 | Hitachi Ltd | Pressure sensor |
-
1987
- 1987-09-28 JP JP14791487U patent/JPS6451844U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57190242A (en) * | 1981-05-20 | 1982-11-22 | Hitachi Ltd | Pressure sensor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009041465A1 (en) * | 2007-09-25 | 2009-04-02 | Alps Electric Co., Ltd. | Semiconductor pressure sensor |