JPS6262868U - - Google Patents

Info

Publication number
JPS6262868U
JPS6262868U JP1985153308U JP15330885U JPS6262868U JP S6262868 U JPS6262868 U JP S6262868U JP 1985153308 U JP1985153308 U JP 1985153308U JP 15330885 U JP15330885 U JP 15330885U JP S6262868 U JPS6262868 U JP S6262868U
Authority
JP
Japan
Prior art keywords
workpiece
case
coating device
gas
spinner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985153308U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0444216Y2 (forum.php
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985153308U priority Critical patent/JPH0444216Y2/ja
Priority to US06/914,328 priority patent/US4790262A/en
Publication of JPS6262868U publication Critical patent/JPS6262868U/ja
Application granted granted Critical
Publication of JPH0444216Y2 publication Critical patent/JPH0444216Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP1985153308U 1985-10-07 1985-10-07 Expired JPH0444216Y2 (forum.php)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1985153308U JPH0444216Y2 (forum.php) 1985-10-07 1985-10-07
US06/914,328 US4790262A (en) 1985-10-07 1986-10-01 Thin-film coating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985153308U JPH0444216Y2 (forum.php) 1985-10-07 1985-10-07

Publications (2)

Publication Number Publication Date
JPS6262868U true JPS6262868U (forum.php) 1987-04-18
JPH0444216Y2 JPH0444216Y2 (forum.php) 1992-10-19

Family

ID=15559642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985153308U Expired JPH0444216Y2 (forum.php) 1985-10-07 1985-10-07

Country Status (2)

Country Link
US (1) US4790262A (forum.php)
JP (1) JPH0444216Y2 (forum.php)

Families Citing this family (64)

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US5261566A (en) * 1981-02-16 1993-11-16 Tokyo Ohka Kogyo Co., Ltd. Solution-dropping nozzle device
US5755886A (en) * 1986-12-19 1998-05-26 Applied Materials, Inc. Apparatus for preventing deposition gases from contacting a selected region of a substrate during deposition processing
JPH0829287B2 (ja) * 1987-09-18 1996-03-27 東京応化工業株式会社 塗布方法及び装置
JPH01121114U (forum.php) * 1988-02-04 1989-08-16
KR970006206B1 (ko) * 1988-02-10 1997-04-24 도오교오 에레구토론 가부시끼가이샤 자동 도포 시스템
KR970011644B1 (ko) * 1988-04-08 1997-07-12 고다까 토시오 도포 처리 장치
US5395446A (en) * 1988-11-21 1995-03-07 Kabushiki Kaisha Toshiba Semiconductor treatment apparatus
JPH02249225A (ja) * 1989-03-22 1990-10-05 Fujitsu Ltd レジスト塗布装置
US5042421A (en) * 1989-07-25 1991-08-27 Manhattan R&D, Inc. Rotatable vacuum chuck with magnetic means
KR910007593A (ko) * 1989-10-17 1991-05-30 제임스 조셉 드롱 강제 유체대류에 의한 오염 입자 제거장치 및 방법
US5094885A (en) * 1990-10-12 1992-03-10 Genus, Inc. Differential pressure cvd chuck
JP3241058B2 (ja) * 1991-03-28 2001-12-25 大日本スクリーン製造株式会社 回転式塗布装置及び回転式塗布方法
JPH0734890B2 (ja) * 1991-10-29 1995-04-19 インターナショナル・ビジネス・マシーンズ・コーポレイション スピン・コーティング方法
US5395649A (en) * 1992-02-04 1995-03-07 Sony Corporation Spin coating apparatus for film formation over substrate
JP2654314B2 (ja) * 1992-06-04 1997-09-17 東京応化工業株式会社 裏面洗浄装置
US5378511A (en) * 1993-03-22 1995-01-03 International Business Machines Corporation Material-saving resist spinner and process
JP2907676B2 (ja) * 1993-03-30 1999-06-21 大日本スクリーン製造株式会社 回転式基板処理装置の処理液供給装置
US5427820A (en) * 1993-07-16 1995-06-27 Semiconductor Systems, Inc. Thermal control line for delivering liquid to a point of use in a photolithography system
US5371046A (en) * 1993-07-22 1994-12-06 Taiwan Semiconductor Manufacturing Company Method to solve sog non-uniformity in the VLSI process
US5608943A (en) * 1993-08-23 1997-03-11 Tokyo Electron Limited Apparatus for removing process liquid
US5695817A (en) * 1994-08-08 1997-12-09 Tokyo Electron Limited Method of forming a coating film
JPH08316190A (ja) * 1995-05-18 1996-11-29 Dainippon Screen Mfg Co Ltd 基板処理装置
US6113702A (en) * 1995-09-01 2000-09-05 Asm America, Inc. Wafer support system
US6053982A (en) * 1995-09-01 2000-04-25 Asm America, Inc. Wafer support system
US5725663A (en) * 1996-01-31 1998-03-10 Solitec Wafer Processing, Inc. Apparatus for control of contamination in spin systems
US5952050A (en) * 1996-02-27 1999-09-14 Micron Technology, Inc. Chemical dispensing system for semiconductor wafer processing
JP3476305B2 (ja) * 1996-03-18 2003-12-10 大日本スクリーン製造株式会社 回転式基板処理装置
US5985031A (en) * 1996-06-21 1999-11-16 Micron Technology, Inc. Spin coating spindle and chuck assembly
US5861061A (en) 1996-06-21 1999-01-19 Micron Technology, Inc. Spin coating bowl
US6350319B1 (en) 1998-03-13 2002-02-26 Semitool, Inc. Micro-environment reactor for processing a workpiece
US6264752B1 (en) 1998-03-13 2001-07-24 Gary L. Curtis Reactor for processing a microelectronic workpiece
US6413436B1 (en) * 1999-01-27 2002-07-02 Semitool, Inc. Selective treatment of the surface of a microelectronic workpiece
US5759273A (en) * 1996-07-16 1998-06-02 Micron Technology, Inc. Cross-section sample staining tool
US5884412A (en) * 1996-07-24 1999-03-23 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
US5960555A (en) * 1996-07-24 1999-10-05 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
JPH10209102A (ja) * 1997-01-17 1998-08-07 Dainippon Screen Mfg Co Ltd 基板処理装置
US6423642B1 (en) * 1998-03-13 2002-07-23 Semitool, Inc. Reactor for processing a semiconductor wafer
US20050217707A1 (en) * 1998-03-13 2005-10-06 Aegerter Brian K Selective processing of microelectronic workpiece surfaces
US6318385B1 (en) 1998-03-13 2001-11-20 Semitool, Inc. Micro-environment chamber and system for rinsing and drying a semiconductor workpiece
TW452828B (en) * 1998-03-13 2001-09-01 Semitool Inc Micro-environment reactor for processing a microelectronic workpiece
US6632292B1 (en) 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US6179924B1 (en) 1998-04-28 2001-01-30 Applied Materials, Inc. Heater for use in substrate processing apparatus to deposit tungsten
US6302960B1 (en) 1998-11-23 2001-10-16 Applied Materials, Inc. Photoresist coater
US6680253B2 (en) 1999-01-22 2004-01-20 Semitool, Inc. Apparatus for processing a workpiece
US6548411B2 (en) 1999-01-22 2003-04-15 Semitool, Inc. Apparatus and methods for processing a workpiece
US6492284B2 (en) 1999-01-22 2002-12-10 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US6511914B2 (en) 1999-01-22 2003-01-28 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US7217325B2 (en) * 1999-01-22 2007-05-15 Semitool, Inc. System for processing a workpiece
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
TWI226387B (en) 1999-04-13 2005-01-11 Semitool Inc Workpiece processor having processing chamber with improved processing fluid flow
JP3616732B2 (ja) * 1999-07-07 2005-02-02 東京エレクトロン株式会社 基板の処理方法及び処理装置
US6286231B1 (en) 2000-01-12 2001-09-11 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
WO2002004887A1 (en) 2000-07-08 2002-01-17 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US6878206B2 (en) * 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US20050061676A1 (en) * 2001-03-12 2005-03-24 Wilson Gregory J. System for electrochemically processing a workpiece
US7090751B2 (en) 2001-08-31 2006-08-15 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US20030168174A1 (en) 2002-03-08 2003-09-11 Foree Michael Todd Gas cushion susceptor system
KR100518788B1 (ko) * 2003-03-11 2005-10-05 삼성전자주식회사 감광액 도포 스핀 코팅 장치
JP4179276B2 (ja) * 2004-12-24 2008-11-12 セイコーエプソン株式会社 溶媒除去装置および溶媒除去方法
DE202005020274U1 (de) * 2005-12-23 2006-02-23 Bohnet, Saskia Beschichtungsanlage für Wafer
JP4985082B2 (ja) 2007-05-07 2012-07-25 東京エレクトロン株式会社 塗布膜形成装置、塗布膜形成装置の使用方法及び記憶媒体
US8092606B2 (en) 2007-12-18 2012-01-10 Asm Genitech Korea Ltd. Deposition apparatus
NL2017053B1 (en) * 2016-06-27 2018-01-05 Suss Microtec Lithography Gmbh Method for coating a substrate and also a coating system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49112159U (forum.php) * 1972-12-29 1974-09-25
JPS5441675A (en) * 1977-09-09 1979-04-03 Hitachi Ltd Photo resist coating unit

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US3695928A (en) * 1970-12-07 1972-10-03 Western Electric Co Selective coating
US3950184A (en) * 1974-11-18 1976-04-13 Texas Instruments Incorporated Multichannel drainage system
JPS5252068A (en) * 1975-10-22 1977-04-26 Nissan Motor Co Ltd Oil pressure regulator of automobile transmission
JPS5819350B2 (ja) * 1976-04-08 1983-04-18 富士写真フイルム株式会社 スピンコ−テイング方法
US4037830A (en) * 1976-09-07 1977-07-26 International Business Machines Corporation Wafer handler
JPS5372464A (en) * 1976-12-08 1978-06-27 Matsushita Electric Ind Co Ltd Method and apparatus for rotary coating
JPS54113265A (en) * 1978-02-23 1979-09-04 Mitsubishi Electric Corp Resistor developing equipement
US4183545A (en) * 1978-07-28 1980-01-15 Advanced Simiconductor Materials/America Rotary vacuum-chuck using no rotary union
JPS5927229B2 (ja) * 1979-09-19 1984-07-04 富士通株式会社 スピンナ−
JPS57107032A (en) * 1980-12-25 1982-07-03 Toshiba Corp Coating device for semiconductor substrate
JPS57135067A (en) * 1981-02-16 1982-08-20 Tokyo Denshi Kagaku Kabushiki Thin film-applying machine
JPS58114426A (ja) * 1981-12-28 1983-07-07 Oki Electric Ind Co Ltd レジスト塗布装置
JPS5990928A (ja) * 1982-11-16 1984-05-25 Dainippon Screen Mfg Co Ltd 回転式表面処理装置
JPS59195827A (ja) * 1983-04-21 1984-11-07 Toshiba Corp レジスト塗布装置
US4510176A (en) * 1983-09-26 1985-04-09 At&T Bell Laboratories Removal of coating from periphery of a semiconductor wafer
US4518678A (en) * 1983-12-16 1985-05-21 Advanced Micro Devices, Inc. Selective removal of coating material on a coated substrate
NL8403459A (nl) * 1984-11-13 1986-06-02 Philips Nv Werkwijze en inrichting voor het aanbrengen van een laag van fotogevoelig materiaal op een halfgeleiderschijf.

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49112159U (forum.php) * 1972-12-29 1974-09-25
JPS5441675A (en) * 1977-09-09 1979-04-03 Hitachi Ltd Photo resist coating unit

Also Published As

Publication number Publication date
JPH0444216Y2 (forum.php) 1992-10-19
US4790262A (en) 1988-12-13

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