JPS6259626A - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物

Info

Publication number
JPS6259626A
JPS6259626A JP19853585A JP19853585A JPS6259626A JP S6259626 A JPS6259626 A JP S6259626A JP 19853585 A JP19853585 A JP 19853585A JP 19853585 A JP19853585 A JP 19853585A JP S6259626 A JPS6259626 A JP S6259626A
Authority
JP
Japan
Prior art keywords
epoxy resin
less
parts
resin composition
ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19853585A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6325012B2 (enrdf_load_stackoverflow
Inventor
Tetsuo Yoshida
哲夫 吉田
Kazutoshi Tomiyoshi
富吉　和俊
Yoshio Fujimura
藤村　嘉夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP19853585A priority Critical patent/JPS6259626A/ja
Publication of JPS6259626A publication Critical patent/JPS6259626A/ja
Publication of JPS6325012B2 publication Critical patent/JPS6325012B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP19853585A 1985-09-10 1985-09-10 エポキシ樹脂組成物 Granted JPS6259626A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19853585A JPS6259626A (ja) 1985-09-10 1985-09-10 エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19853585A JPS6259626A (ja) 1985-09-10 1985-09-10 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6259626A true JPS6259626A (ja) 1987-03-16
JPS6325012B2 JPS6325012B2 (enrdf_load_stackoverflow) 1988-05-24

Family

ID=16392765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19853585A Granted JPS6259626A (ja) 1985-09-10 1985-09-10 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6259626A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63269555A (ja) * 1987-04-27 1988-11-07 Nitto Electric Ind Co Ltd 半導体装置
JPS63307763A (ja) * 1987-06-09 1988-12-15 Nitto Electric Ind Co Ltd 半導体装置
JPS6445463A (en) * 1987-08-13 1989-02-17 Shinetsu Chemical Co Addition type polyimide polymer composition
JPS6473652A (en) * 1987-09-14 1989-03-17 Nitto Denko Corp Semiconductor device
JPS6473749A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPS6473748A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPH01145824A (ja) * 1987-10-01 1989-06-07 General Electric Co <Ge> カプセル封止方法、それによって製造された超小形電子装置、および熱硬化性組成物
JPH01206656A (ja) * 1988-02-15 1989-08-18 Nitto Denko Corp 半導体装置
JPH0286148A (ja) * 1988-09-21 1990-03-27 Nitto Denko Corp 半導体装置
WO2012102336A1 (ja) * 2011-01-28 2012-08-02 住友ベークライト株式会社 封止用エポキシ樹脂組成物及び電子部品装置

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50158697A (enrdf_load_stackoverflow) * 1974-06-14 1975-12-22
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
JPS5521451A (en) * 1978-08-02 1980-02-15 Denki Kagaku Kogyo Kk Resin filler and its preparation
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS55165655A (en) * 1979-06-12 1980-12-24 Toshiba Corp Semiconductor device sealed up with resin
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5626926A (en) * 1979-08-10 1981-03-16 Toshiba Corp Epoxy resin molding material for sealing electronic part
JPS5672046A (en) * 1979-11-19 1981-06-16 Toshiba Corp Epoxy resin molding material
JPS56160056A (en) * 1980-05-15 1981-12-09 Toshiba Corp Resin sealing type semiconductor device
JPS56160054A (en) * 1980-05-15 1981-12-09 Toshiba Corp Resin sealing type semiconductor device
JPS5710255A (en) * 1980-06-20 1982-01-19 Toshiba Corp Epoxy resin composition and resin sealed type semiconductor device
JPS57212224A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS582322A (ja) * 1981-06-30 1983-01-07 Nitto Electric Ind Co Ltd 半導体封止用エポキシ樹脂組成物
JPS6012786A (ja) * 1983-07-01 1985-01-23 Hitachi Ltd 発光装置の製造方法
JPS6053516A (ja) * 1983-09-05 1985-03-27 Sumitomo Bakelite Co Ltd 高純度フエノ−ル樹脂の製造方法

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50158697A (enrdf_load_stackoverflow) * 1974-06-14 1975-12-22
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
JPS5521451A (en) * 1978-08-02 1980-02-15 Denki Kagaku Kogyo Kk Resin filler and its preparation
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS55165655A (en) * 1979-06-12 1980-12-24 Toshiba Corp Semiconductor device sealed up with resin
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5626926A (en) * 1979-08-10 1981-03-16 Toshiba Corp Epoxy resin molding material for sealing electronic part
JPS5672046A (en) * 1979-11-19 1981-06-16 Toshiba Corp Epoxy resin molding material
JPS56160056A (en) * 1980-05-15 1981-12-09 Toshiba Corp Resin sealing type semiconductor device
JPS56160054A (en) * 1980-05-15 1981-12-09 Toshiba Corp Resin sealing type semiconductor device
JPS5710255A (en) * 1980-06-20 1982-01-19 Toshiba Corp Epoxy resin composition and resin sealed type semiconductor device
JPS57212224A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS582322A (ja) * 1981-06-30 1983-01-07 Nitto Electric Ind Co Ltd 半導体封止用エポキシ樹脂組成物
JPS6012786A (ja) * 1983-07-01 1985-01-23 Hitachi Ltd 発光装置の製造方法
JPS6053516A (ja) * 1983-09-05 1985-03-27 Sumitomo Bakelite Co Ltd 高純度フエノ−ル樹脂の製造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63269555A (ja) * 1987-04-27 1988-11-07 Nitto Electric Ind Co Ltd 半導体装置
JPS63307763A (ja) * 1987-06-09 1988-12-15 Nitto Electric Ind Co Ltd 半導体装置
JPS6445463A (en) * 1987-08-13 1989-02-17 Shinetsu Chemical Co Addition type polyimide polymer composition
JPS6473652A (en) * 1987-09-14 1989-03-17 Nitto Denko Corp Semiconductor device
JPS6473749A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPS6473748A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPH01145824A (ja) * 1987-10-01 1989-06-07 General Electric Co <Ge> カプセル封止方法、それによって製造された超小形電子装置、および熱硬化性組成物
JPH01206656A (ja) * 1988-02-15 1989-08-18 Nitto Denko Corp 半導体装置
JPH0286148A (ja) * 1988-09-21 1990-03-27 Nitto Denko Corp 半導体装置
WO2012102336A1 (ja) * 2011-01-28 2012-08-02 住友ベークライト株式会社 封止用エポキシ樹脂組成物及び電子部品装置
JPWO2012102336A1 (ja) * 2011-01-28 2014-06-30 住友ベークライト株式会社 封止用エポキシ樹脂組成物及び電子部品装置
US8987355B2 (en) 2011-01-28 2015-03-24 Sumitomo Bakelite Co., Ltd. Epoxy resin composition for sealing, and electronic component device

Also Published As

Publication number Publication date
JPS6325012B2 (enrdf_load_stackoverflow) 1988-05-24

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