JPS625340B2 - - Google Patents
Info
- Publication number
- JPS625340B2 JPS625340B2 JP55132538A JP13253880A JPS625340B2 JP S625340 B2 JPS625340 B2 JP S625340B2 JP 55132538 A JP55132538 A JP 55132538A JP 13253880 A JP13253880 A JP 13253880A JP S625340 B2 JPS625340 B2 JP S625340B2
- Authority
- JP
- Japan
- Prior art keywords
- tape carrier
- semiconductor device
- tape
- horizontal portion
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 8
- 238000005452 bending Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55132538A JPS5758346A (en) | 1980-09-24 | 1980-09-24 | Tape carrier for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55132538A JPS5758346A (en) | 1980-09-24 | 1980-09-24 | Tape carrier for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5758346A JPS5758346A (en) | 1982-04-08 |
| JPS625340B2 true JPS625340B2 (enrdf_load_stackoverflow) | 1987-02-04 |
Family
ID=15083613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55132538A Granted JPS5758346A (en) | 1980-09-24 | 1980-09-24 | Tape carrier for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5758346A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0238995U (enrdf_load_stackoverflow) * | 1988-09-06 | 1990-03-15 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4721992A (en) * | 1986-06-26 | 1988-01-26 | National Semiconductor Corporation | Hinge tape |
| JPH0754813B2 (ja) * | 1986-08-29 | 1995-06-07 | 株式会社東芝 | フイルムキヤリア基板 |
| JPH0444148U (enrdf_load_stackoverflow) * | 1990-08-20 | 1992-04-15 | ||
| JP2857492B2 (ja) * | 1990-11-28 | 1999-02-17 | シャープ株式会社 | Ｔａｂパッケージ |
-
1980
- 1980-09-24 JP JP55132538A patent/JPS5758346A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0238995U (enrdf_load_stackoverflow) * | 1988-09-06 | 1990-03-15 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5758346A (en) | 1982-04-08 |