JPS6133647Y2 - - Google Patents
Info
- Publication number
- JPS6133647Y2 JPS6133647Y2 JP1980158993U JP15899380U JPS6133647Y2 JP S6133647 Y2 JPS6133647 Y2 JP S6133647Y2 JP 1980158993 U JP1980158993 U JP 1980158993U JP 15899380 U JP15899380 U JP 15899380U JP S6133647 Y2 JPS6133647 Y2 JP S6133647Y2
- Authority
- JP
- Japan
- Prior art keywords
- tape carrier
- guide
- tape
- semiconductor
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 26
- 238000005452 bending Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980158993U JPS6133647Y2 (enrdf_load_stackoverflow) | 1980-11-06 | 1980-11-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980158993U JPS6133647Y2 (enrdf_load_stackoverflow) | 1980-11-06 | 1980-11-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5780842U JPS5780842U (enrdf_load_stackoverflow) | 1982-05-19 |
JPS6133647Y2 true JPS6133647Y2 (enrdf_load_stackoverflow) | 1986-10-01 |
Family
ID=29518031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980158993U Expired JPS6133647Y2 (enrdf_load_stackoverflow) | 1980-11-06 | 1980-11-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6133647Y2 (enrdf_load_stackoverflow) |
-
1980
- 1980-11-06 JP JP1980158993U patent/JPS6133647Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5780842U (enrdf_load_stackoverflow) | 1982-05-19 |
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