JPS6161705B2 - - Google Patents

Info

Publication number
JPS6161705B2
JPS6161705B2 JP55178497A JP17849780A JPS6161705B2 JP S6161705 B2 JPS6161705 B2 JP S6161705B2 JP 55178497 A JP55178497 A JP 55178497A JP 17849780 A JP17849780 A JP 17849780A JP S6161705 B2 JPS6161705 B2 JP S6161705B2
Authority
JP
Japan
Prior art keywords
carrier
tape carrier
unit
tape
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55178497A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57102063A (en
Inventor
Tsutomu Taoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP55178497A priority Critical patent/JPS57102063A/ja
Publication of JPS57102063A publication Critical patent/JPS57102063A/ja
Publication of JPS6161705B2 publication Critical patent/JPS6161705B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP55178497A 1980-12-17 1980-12-17 Lead-tape Granted JPS57102063A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55178497A JPS57102063A (en) 1980-12-17 1980-12-17 Lead-tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55178497A JPS57102063A (en) 1980-12-17 1980-12-17 Lead-tape

Publications (2)

Publication Number Publication Date
JPS57102063A JPS57102063A (en) 1982-06-24
JPS6161705B2 true JPS6161705B2 (enrdf_load_stackoverflow) 1986-12-26

Family

ID=16049483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55178497A Granted JPS57102063A (en) 1980-12-17 1980-12-17 Lead-tape

Country Status (1)

Country Link
JP (1) JPS57102063A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7073268B1 (en) 2002-04-18 2006-07-11 Black & Decker Inc. Level apparatus
US7137327B2 (en) 2002-10-31 2006-11-21 Black & Decker Inc. Riving knife assembly for a dual bevel table saw
US7243440B2 (en) 2004-10-06 2007-07-17 Black & Decker Inc. Gauge for use with power tools
US7290474B2 (en) 2003-04-29 2007-11-06 Black & Decker Inc. System for rapidly stopping a spinning table saw blade
US7346847B2 (en) 2002-04-18 2008-03-18 Black & Decker Inc. Power tool control system user interface
US7359762B2 (en) 2002-04-18 2008-04-15 Black & Decker Inc. Measurement and alignment device including a display system
US7369916B2 (en) 2002-04-18 2008-05-06 Black & Decker Inc. Drill press

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5113620B2 (enrdf_load_stackoverflow) * 1972-07-26 1976-05-01
JPS521067U (enrdf_load_stackoverflow) * 1976-06-18 1977-01-06
JPS5337459U (enrdf_load_stackoverflow) * 1976-09-07 1978-04-01

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7073268B1 (en) 2002-04-18 2006-07-11 Black & Decker Inc. Level apparatus
US7346847B2 (en) 2002-04-18 2008-03-18 Black & Decker Inc. Power tool control system user interface
US7359762B2 (en) 2002-04-18 2008-04-15 Black & Decker Inc. Measurement and alignment device including a display system
US7369916B2 (en) 2002-04-18 2008-05-06 Black & Decker Inc. Drill press
US7137327B2 (en) 2002-10-31 2006-11-21 Black & Decker Inc. Riving knife assembly for a dual bevel table saw
US7290474B2 (en) 2003-04-29 2007-11-06 Black & Decker Inc. System for rapidly stopping a spinning table saw blade
US7243440B2 (en) 2004-10-06 2007-07-17 Black & Decker Inc. Gauge for use with power tools

Also Published As

Publication number Publication date
JPS57102063A (en) 1982-06-24

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