JPS6251501B2 - - Google Patents
Info
- Publication number
- JPS6251501B2 JPS6251501B2 JP4031981A JP4031981A JPS6251501B2 JP S6251501 B2 JPS6251501 B2 JP S6251501B2 JP 4031981 A JP4031981 A JP 4031981A JP 4031981 A JP4031981 A JP 4031981A JP S6251501 B2 JPS6251501 B2 JP S6251501B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- package
- semiconductor device
- present
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 238000005452 bending Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4031981A JPS57155758A (en) | 1981-03-23 | 1981-03-23 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4031981A JPS57155758A (en) | 1981-03-23 | 1981-03-23 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57155758A JPS57155758A (en) | 1982-09-25 |
| JPS6251501B2 true JPS6251501B2 (enrdf_load_stackoverflow) | 1987-10-30 |
Family
ID=12577286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4031981A Granted JPS57155758A (en) | 1981-03-23 | 1981-03-23 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57155758A (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58169948A (ja) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | 樹脂封止型半導体装置 |
| JPS58184746A (ja) * | 1982-04-22 | 1983-10-28 | Toshiba Corp | 外囲器 |
| JPS5980955A (ja) * | 1982-10-29 | 1984-05-10 | Matsushita Electronics Corp | 電子部品装置 |
| JPS59104544U (ja) * | 1982-12-29 | 1984-07-13 | 松下電器産業株式会社 | 集積回路装置 |
| JPS59189662A (ja) * | 1983-04-13 | 1984-10-27 | Fujitsu Ltd | 樹脂封止型半導体装置 |
| JPS6088561U (ja) * | 1983-11-22 | 1985-06-18 | 日本電気株式会社 | 半導体装置 |
| JPS6116556A (ja) * | 1984-07-03 | 1986-01-24 | Matsushita Electronics Corp | 樹脂封止型半導体装置 |
| JPS6132490A (ja) * | 1984-07-24 | 1986-02-15 | 富士通株式会社 | フラツトリ−ドパツケ−ジ型電子部品の取付け構造 |
| JPS6398640U (enrdf_load_stackoverflow) * | 1986-12-16 | 1988-06-25 |
-
1981
- 1981-03-23 JP JP4031981A patent/JPS57155758A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57155758A (en) | 1982-09-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5860565A (ja) | 集積回路用キヤリア | |
| JPS634950B2 (enrdf_load_stackoverflow) | ||
| KR19980032479A (ko) | 표면 설치 to-220 패키지 및 그의 제조 공정 | |
| JPS6251501B2 (enrdf_load_stackoverflow) | ||
| JP2955842B2 (ja) | 半導体パッケージ | |
| JPH06177282A (ja) | 半導体パッケージ | |
| JPS63296252A (ja) | 樹脂封止型半導体装置 | |
| KR100338225B1 (ko) | 반도체장치 | |
| JPS60109337U (ja) | 集積回路パツケージ | |
| JP3159950B2 (ja) | 半導体パッケージ実装用ソケット | |
| KR960002496B1 (ko) | 반도체 패키지 | |
| JPH0419806Y2 (enrdf_load_stackoverflow) | ||
| JPH01169958A (ja) | 半導体パッケージ | |
| JPS59189662A (ja) | 樹脂封止型半導体装置 | |
| KR970001139Y1 (ko) | 비엘피(blp)용 리드 프레임 | |
| KR100321149B1 (ko) | 칩사이즈 패키지 | |
| KR100342811B1 (ko) | 복수개의칩이내장된에어리어어레이범프드반도체패키지 | |
| KR100645191B1 (ko) | 반도체 패키지 | |
| KR0129196B1 (ko) | 별도의 실장용 리드를 갖는 반도체 패키지 | |
| KR100253298B1 (ko) | 솔더조인트신뢰성이개선된반도체패키지및그를이용한디바이스 | |
| JPH03190270A (ja) | 半導体装置 | |
| KR20000009885A (ko) | 볼 그리드 어레이 타입의 반도체 패키지 | |
| KR200168502Y1 (ko) | 반도체 패키지 | |
| KR200241482Y1 (ko) | 에스·비·지·에이 패키지의 구조 | |
| JPH0656863B2 (ja) | 半導体チツプ搭載用ソケツト |