JPS6244817B2 - - Google Patents
Info
- Publication number
- JPS6244817B2 JPS6244817B2 JP56030997A JP3099781A JPS6244817B2 JP S6244817 B2 JPS6244817 B2 JP S6244817B2 JP 56030997 A JP56030997 A JP 56030997A JP 3099781 A JP3099781 A JP 3099781A JP S6244817 B2 JPS6244817 B2 JP S6244817B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- alloy
- lead frame
- layer
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/457—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/5363—
-
- H10W72/884—
-
- H10W90/736—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56030997A JPS57145352A (en) | 1981-03-04 | 1981-03-04 | Lead frame for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56030997A JPS57145352A (en) | 1981-03-04 | 1981-03-04 | Lead frame for semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57145352A JPS57145352A (en) | 1982-09-08 |
| JPS6244817B2 true JPS6244817B2 (enExample) | 1987-09-22 |
Family
ID=12319226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56030997A Granted JPS57145352A (en) | 1981-03-04 | 1981-03-04 | Lead frame for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57145352A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57192057A (en) * | 1981-05-22 | 1982-11-26 | Hitachi Ltd | Semiconductor device |
| JPS5914658A (ja) * | 1982-07-16 | 1984-01-25 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム |
| JPS59149042A (ja) * | 1983-02-15 | 1984-08-25 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム |
| JP2008124097A (ja) * | 2006-11-09 | 2008-05-29 | Shinko Electric Ind Co Ltd | 半導体装置用パッケージ及びその作製方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5373969A (en) * | 1976-12-14 | 1978-06-30 | Toshiba Corp | Lead frame for semicinductor |
-
1981
- 1981-03-04 JP JP56030997A patent/JPS57145352A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57145352A (en) | 1982-09-08 |
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