JPS6258548B2 - - Google Patents

Info

Publication number
JPS6258548B2
JPS6258548B2 JP56054089A JP5408981A JPS6258548B2 JP S6258548 B2 JPS6258548 B2 JP S6258548B2 JP 56054089 A JP56054089 A JP 56054089A JP 5408981 A JP5408981 A JP 5408981A JP S6258548 B2 JPS6258548 B2 JP S6258548B2
Authority
JP
Japan
Prior art keywords
plating
lead frame
alloy
semiconductor
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56054089A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57169265A (en
Inventor
Ryozo Yamagishi
Osamu Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP56054089A priority Critical patent/JPS57169265A/ja
Publication of JPS57169265A publication Critical patent/JPS57169265A/ja
Publication of JPS6258548B2 publication Critical patent/JPS6258548B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/457—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H10W72/073—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/884—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP56054089A 1981-04-10 1981-04-10 Lead frame for semiconductor Granted JPS57169265A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56054089A JPS57169265A (en) 1981-04-10 1981-04-10 Lead frame for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56054089A JPS57169265A (en) 1981-04-10 1981-04-10 Lead frame for semiconductor

Publications (2)

Publication Number Publication Date
JPS57169265A JPS57169265A (en) 1982-10-18
JPS6258548B2 true JPS6258548B2 (enExample) 1987-12-07

Family

ID=12960887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56054089A Granted JPS57169265A (en) 1981-04-10 1981-04-10 Lead frame for semiconductor

Country Status (1)

Country Link
JP (1) JPS57169265A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5835984A (ja) * 1981-08-28 1983-03-02 Hitachi Ltd ツエナ−ダイオ−ド
US6140703A (en) * 1996-08-05 2000-10-31 Motorola, Inc. Semiconductor metallization structure

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792854A (en) * 1980-11-29 1982-06-09 Toshiba Corp Plastic molded type semiconductor device

Also Published As

Publication number Publication date
JPS57169265A (en) 1982-10-18

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