JPS6244815B2 - - Google Patents

Info

Publication number
JPS6244815B2
JPS6244815B2 JP56064893A JP6489381A JPS6244815B2 JP S6244815 B2 JPS6244815 B2 JP S6244815B2 JP 56064893 A JP56064893 A JP 56064893A JP 6489381 A JP6489381 A JP 6489381A JP S6244815 B2 JPS6244815 B2 JP S6244815B2
Authority
JP
Japan
Prior art keywords
strip
common connection
resin
substrate support
connection strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56064893A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57178352A (en
Inventor
Kenichi Tateno
Masami Yokozawa
Hiroyuki Fujii
Mikio Nishikawa
Mikio Kato
Fujio Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP6489381A priority Critical patent/JPS57178352A/ja
Priority to US06/367,809 priority patent/US4451973A/en
Priority to DE8282103521T priority patent/DE3270561D1/de
Priority to DE198282103521T priority patent/DE63811T1/de
Priority to EP19820103521 priority patent/EP0063811B1/de
Priority to CA000401752A priority patent/CA1200623A/en
Publication of JPS57178352A publication Critical patent/JPS57178352A/ja
Priority to US06/581,251 priority patent/US4589010A/en
Priority to CA000480771A priority patent/CA1209721A/en
Publication of JPS6244815B2 publication Critical patent/JPS6244815B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP6489381A 1981-04-28 1981-04-28 Manufacture of resin sealing type semiconductor device and lead frame employed thereon Granted JPS57178352A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP6489381A JPS57178352A (en) 1981-04-28 1981-04-28 Manufacture of resin sealing type semiconductor device and lead frame employed thereon
US06/367,809 US4451973A (en) 1981-04-28 1982-04-13 Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
DE8282103521T DE3270561D1 (en) 1981-04-28 1982-04-26 A method for manufacturing a plastic encapsulated semiconductor device
DE198282103521T DE63811T1 (de) 1981-04-28 1982-04-26 Verfahren zum herstellen einer in kunststoff verkapselten halbleiteranordnung und ein leitergitter dafuer.
EP19820103521 EP0063811B1 (de) 1981-04-28 1982-04-26 Verfahren zum Herstellen einer in Kunststoff verkapselten Halbleiteranordnung
CA000401752A CA1200623A (en) 1981-04-28 1982-04-27 Plastic encapsulated semiconductor device and a lead frame therefor
US06/581,251 US4589010A (en) 1981-04-28 1984-02-17 Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
CA000480771A CA1209721A (en) 1981-04-28 1985-05-03 Plastic encapsulated semiconductor device and lead frame therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6489381A JPS57178352A (en) 1981-04-28 1981-04-28 Manufacture of resin sealing type semiconductor device and lead frame employed thereon

Publications (2)

Publication Number Publication Date
JPS57178352A JPS57178352A (en) 1982-11-02
JPS6244815B2 true JPS6244815B2 (de) 1987-09-22

Family

ID=13271210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6489381A Granted JPS57178352A (en) 1981-04-28 1981-04-28 Manufacture of resin sealing type semiconductor device and lead frame employed thereon

Country Status (1)

Country Link
JP (1) JPS57178352A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119040U (ja) * 1983-01-31 1984-08-11 日本電気ホームエレクトロニクス株式会社 樹脂封止形半導体装置
JPS60172346U (ja) * 1984-04-23 1985-11-15 新電元工業株式会社 樹脂密封型半導体装置
JPS6194349A (ja) * 1984-10-16 1986-05-13 Sanken Electric Co Ltd 樹脂封止形半導体装置の製造方法及びその製造方法に使用するリ−ドフレ−ム
JPH0777248B2 (ja) * 1988-11-09 1995-08-16 富士電機株式会社 樹脂封止形半導体装置及びその製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3431092A (en) * 1965-10-22 1969-03-04 Motorola Inc Lead frame members for semiconductor devices
US3716764A (en) * 1963-12-16 1973-02-13 Texas Instruments Inc Process for encapsulating electronic components in plastic
JPS5082967A (de) * 1973-10-19 1975-07-04
JPS538635A (en) * 1976-07-14 1978-01-26 Ichikoh Industries Ltd Method of fixing gasket
JPS5487474A (en) * 1977-12-23 1979-07-11 Nec Corp Semiconductor device
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3716764A (en) * 1963-12-16 1973-02-13 Texas Instruments Inc Process for encapsulating electronic components in plastic
US3431092A (en) * 1965-10-22 1969-03-04 Motorola Inc Lead frame members for semiconductor devices
JPS5082967A (de) * 1973-10-19 1975-07-04
JPS538635A (en) * 1976-07-14 1978-01-26 Ichikoh Industries Ltd Method of fixing gasket
JPS5487474A (en) * 1977-12-23 1979-07-11 Nec Corp Semiconductor device
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor

Also Published As

Publication number Publication date
JPS57178352A (en) 1982-11-02

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