JPS57178352A - Manufacture of resin sealing type semiconductor device and lead frame employed thereon - Google Patents
Manufacture of resin sealing type semiconductor device and lead frame employed thereonInfo
- Publication number
- JPS57178352A JPS57178352A JP6489381A JP6489381A JPS57178352A JP S57178352 A JPS57178352 A JP S57178352A JP 6489381 A JP6489381 A JP 6489381A JP 6489381 A JP6489381 A JP 6489381A JP S57178352 A JPS57178352 A JP S57178352A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- fine
- lead frame
- pinched
- molds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 title abstract 3
- 238000007789 sealing Methods 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 239000011800 void material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6489381A JPS57178352A (en) | 1981-04-28 | 1981-04-28 | Manufacture of resin sealing type semiconductor device and lead frame employed thereon |
US06/367,809 US4451973A (en) | 1981-04-28 | 1982-04-13 | Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor |
DE198282103521T DE63811T1 (de) | 1981-04-28 | 1982-04-26 | Verfahren zum herstellen einer in kunststoff verkapselten halbleiteranordnung und ein leitergitter dafuer. |
DE8282103521T DE3270561D1 (en) | 1981-04-28 | 1982-04-26 | A method for manufacturing a plastic encapsulated semiconductor device |
EP19820103521 EP0063811B1 (en) | 1981-04-28 | 1982-04-26 | A method for manufacturing a plastic encapsulated semiconductor device |
CA000401752A CA1200623A (en) | 1981-04-28 | 1982-04-27 | Plastic encapsulated semiconductor device and a lead frame therefor |
US06/581,251 US4589010A (en) | 1981-04-28 | 1984-02-17 | Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor |
CA000480771A CA1209721A (en) | 1981-04-28 | 1985-05-03 | Plastic encapsulated semiconductor device and lead frame therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6489381A JPS57178352A (en) | 1981-04-28 | 1981-04-28 | Manufacture of resin sealing type semiconductor device and lead frame employed thereon |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57178352A true JPS57178352A (en) | 1982-11-02 |
JPS6244815B2 JPS6244815B2 (ja) | 1987-09-22 |
Family
ID=13271210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6489381A Granted JPS57178352A (en) | 1981-04-28 | 1981-04-28 | Manufacture of resin sealing type semiconductor device and lead frame employed thereon |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57178352A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59119040U (ja) * | 1983-01-31 | 1984-08-11 | 日本電気ホームエレクトロニクス株式会社 | 樹脂封止形半導体装置 |
JPS60172346U (ja) * | 1984-04-23 | 1985-11-15 | 新電元工業株式会社 | 樹脂密封型半導体装置 |
JPS6194349A (ja) * | 1984-10-16 | 1986-05-13 | Sanken Electric Co Ltd | 樹脂封止形半導体装置の製造方法及びその製造方法に使用するリ−ドフレ−ム |
JPH02129952A (ja) * | 1988-11-09 | 1990-05-18 | Fuji Electric Co Ltd | 樹脂封止形半導体装置の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3431092A (en) * | 1965-10-22 | 1969-03-04 | Motorola Inc | Lead frame members for semiconductor devices |
US3716764A (en) * | 1963-12-16 | 1973-02-13 | Texas Instruments Inc | Process for encapsulating electronic components in plastic |
JPS5082967A (ja) * | 1973-10-19 | 1975-07-04 | ||
JPS538635A (en) * | 1976-07-14 | 1978-01-26 | Ichikoh Industries Ltd | Method of fixing gasket |
JPS5487474A (en) * | 1977-12-23 | 1979-07-11 | Nec Corp | Semiconductor device |
JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
-
1981
- 1981-04-28 JP JP6489381A patent/JPS57178352A/ja active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3716764A (en) * | 1963-12-16 | 1973-02-13 | Texas Instruments Inc | Process for encapsulating electronic components in plastic |
US3431092A (en) * | 1965-10-22 | 1969-03-04 | Motorola Inc | Lead frame members for semiconductor devices |
JPS5082967A (ja) * | 1973-10-19 | 1975-07-04 | ||
JPS538635A (en) * | 1976-07-14 | 1978-01-26 | Ichikoh Industries Ltd | Method of fixing gasket |
JPS5487474A (en) * | 1977-12-23 | 1979-07-11 | Nec Corp | Semiconductor device |
JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59119040U (ja) * | 1983-01-31 | 1984-08-11 | 日本電気ホームエレクトロニクス株式会社 | 樹脂封止形半導体装置 |
JPS60172346U (ja) * | 1984-04-23 | 1985-11-15 | 新電元工業株式会社 | 樹脂密封型半導体装置 |
JPS6194349A (ja) * | 1984-10-16 | 1986-05-13 | Sanken Electric Co Ltd | 樹脂封止形半導体装置の製造方法及びその製造方法に使用するリ−ドフレ−ム |
JPH0472389B2 (ja) * | 1984-10-16 | 1992-11-18 | Sanken Electric Co Ltd | |
JPH02129952A (ja) * | 1988-11-09 | 1990-05-18 | Fuji Electric Co Ltd | 樹脂封止形半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6244815B2 (ja) | 1987-09-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS57147260A (en) | Manufacture of resin-sealed semiconductor device and lead frame used therefor | |
EP0179577A3 (en) | Method for making a semiconductor device having conductor pins | |
EP0037876A3 (en) | Electrochemical eroding process for semiconductors and semiconductor manufactured thereby | |
JPS57178352A (en) | Manufacture of resin sealing type semiconductor device and lead frame employed thereon | |
JPS5363979A (en) | Sealing method of semiconductor element and lead frame used for the same | |
JPS5380969A (en) | Manufacture of resin shield type semiconductor device and lead frame used for the said process | |
JPS5739561A (en) | Cutting device for hanging pin of lead frame | |
JPS5717138A (en) | Resin sealing device for semiconductor device | |
JPS5775434A (en) | Resin sealing metal mold for semiconductor device | |
JPS57197844A (en) | Semiconductor device | |
JPS5788752A (en) | Lead frame and semiconductor device prepared by using the same | |
JPS5522873A (en) | Manufacturing method of resin sealing semiconductor device | |
JPS53104171A (en) | Mold for semiconductor device | |
JPS5214359A (en) | Process for sealing of the semiconductor and lead-frame used in this method | |
JPS57202745A (en) | Manufacture of semiconductor device | |
JPS5718370A (en) | Cutting method for semiconductor pressure sensor | |
JPS53108368A (en) | Manufacture for resin seal type semiconductor device and its lead frame for its manufacture | |
JPS55157235A (en) | Manufacture of semiconductor integrated circuit | |
JPS5630732A (en) | Mounting method of semiconductor pellet | |
JPS55143077A (en) | Manufacturing method of semiconductor distortion detecting element for displacement transducer | |
JPS56118343A (en) | Preparation apparatus for semiconductor device | |
JPS6473754A (en) | Manufacture of lead frame for semiconductor device | |
JPS5792843A (en) | Semiconductor device | |
JPS5368574A (en) | Production of glass sealed semiconductor device | |
JPS574132A (en) | Manufacture of semiconductor device |