JPS6244767B2 - - Google Patents

Info

Publication number
JPS6244767B2
JPS6244767B2 JP57076690A JP7669082A JPS6244767B2 JP S6244767 B2 JPS6244767 B2 JP S6244767B2 JP 57076690 A JP57076690 A JP 57076690A JP 7669082 A JP7669082 A JP 7669082A JP S6244767 B2 JPS6244767 B2 JP S6244767B2
Authority
JP
Japan
Prior art keywords
epoxy resin
bisphenol
type epoxy
agent
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57076690A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58194916A (ja
Inventor
Mitsuo Kakehi
Yukihisa Ikeda
Shinichi Tanimoto
Shigeru Koshibe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP7669082A priority Critical patent/JPS58194916A/ja
Publication of JPS58194916A publication Critical patent/JPS58194916A/ja
Publication of JPS6244767B2 publication Critical patent/JPS6244767B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
JP7669082A 1982-05-10 1982-05-10 エポキシ樹脂組成物 Granted JPS58194916A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7669082A JPS58194916A (ja) 1982-05-10 1982-05-10 エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7669082A JPS58194916A (ja) 1982-05-10 1982-05-10 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS58194916A JPS58194916A (ja) 1983-11-14
JPS6244767B2 true JPS6244767B2 (enrdf_load_stackoverflow) 1987-09-22

Family

ID=13612455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7669082A Granted JPS58194916A (ja) 1982-05-10 1982-05-10 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS58194916A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61138621A (ja) * 1984-12-11 1986-06-26 Sumitomo Bakelite Co Ltd エポキシ樹脂積層板の製造方法
JPS61246228A (ja) * 1985-04-24 1986-11-01 Shin Kobe Electric Mach Co Ltd 積層板用樹脂組成物
JP5003256B2 (ja) * 2007-04-09 2012-08-15 住友ベークライト株式会社 被研磨物保持材用積層板および被研磨物保持材
JP6620923B2 (ja) * 2015-06-05 2019-12-18 Dic株式会社 (メタ)アクリレート樹脂及びレジスト部材

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2844553A (en) * 1953-04-24 1958-07-22 Sherwin Williams Co Polyhydric phenol-aldehyde-epihalo-hydrin resins
BE528539A (enrdf_load_stackoverflow) * 1953-05-04
JPS5933125B2 (ja) * 1980-03-17 1984-08-14 信越化学工業株式会社 半導体装置封止用エポキシ樹脂組成物
JPS578220A (en) * 1980-06-18 1982-01-16 Toshiba Corp Epoxy resin composition and resin-sealed semiconductor device
JPS572329A (en) * 1980-06-05 1982-01-07 Toshiba Corp Epoxy resin type composition and semiconductor device of resin sealing type

Also Published As

Publication number Publication date
JPS58194916A (ja) 1983-11-14

Similar Documents

Publication Publication Date Title
JPS59230017A (ja) 新規ポリグリシジルエ−テル及びその製法
JPH047365B2 (enrdf_load_stackoverflow)
JPS5839677A (ja) 新規ポリエポキシ化合物
CN118063133B (zh) 一种含人造石树脂的耐高温建筑材料及其制备方法
JPS6244767B2 (enrdf_load_stackoverflow)
US4529790A (en) Epoxy resin composition
JPS6341527A (ja) 半導体封止用エポキシ樹脂組成物
JP3847360B2 (ja) 表面処理されたフィラーおよびそれを用いた樹脂組成物
JPS62290720A (ja) 電子部品封止用エポキシ樹脂成形材料
GB2212157A (en) Glycidyl ethers of phenolic compounds and epoxy resins derived therefrom
JPS58174416A (ja) 半導体封止用エポキシ樹脂組成物
JPS6248974B2 (enrdf_load_stackoverflow)
JPS6239607B2 (enrdf_load_stackoverflow)
JP2823056B2 (ja) エポキシ樹脂組成物及びその硬化物
JPH0593038A (ja) エポキシ樹脂組成物
JPH0730151B2 (ja) フェノール類ノボラック組成物の製造法
JPH0651780B2 (ja) 半導体封止用エポキシ樹脂組成物
JPH1129621A (ja) フェノール化合物,エポキシ化合物及び該化合物を含む樹脂組成物
JPS6316411B2 (enrdf_load_stackoverflow)
EP0122086A1 (en) A method for producing an encapsulated semiconductor using a curable epoxy resin composition
JPS6337128B2 (enrdf_load_stackoverflow)
JP3733608B2 (ja) 粉体塗料
JPH0311073A (ja) グリシジル化合物およびその製造方法ならびにグリシジル化合物含有組成物
JPS61103919A (ja) エポキシ樹脂
JPH07216052A (ja) エポキシ樹脂及びエポキシ樹脂組成物