JPS6244690B2 - - Google Patents

Info

Publication number
JPS6244690B2
JPS6244690B2 JP54168378A JP16837879A JPS6244690B2 JP S6244690 B2 JPS6244690 B2 JP S6244690B2 JP 54168378 A JP54168378 A JP 54168378A JP 16837879 A JP16837879 A JP 16837879A JP S6244690 B2 JPS6244690 B2 JP S6244690B2
Authority
JP
Japan
Prior art keywords
film
resin
semiconductor device
nitride film
polyimide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54168378A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5691453A (en
Inventor
Takeo Yoshimi
Hideo Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16837879A priority Critical patent/JPS5691453A/ja
Publication of JPS5691453A publication Critical patent/JPS5691453A/ja
Publication of JPS6244690B2 publication Critical patent/JPS6244690B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/137
    • H10W74/147
    • H10W70/60
    • H10W72/07551
    • H10W72/50
    • H10W72/59
    • H10W72/90
    • H10W72/934
    • H10W72/983
    • H10W74/00
    • H10W90/756

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP16837879A 1979-12-26 1979-12-26 Manufacturing of semiconductor device Granted JPS5691453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16837879A JPS5691453A (en) 1979-12-26 1979-12-26 Manufacturing of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16837879A JPS5691453A (en) 1979-12-26 1979-12-26 Manufacturing of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5691453A JPS5691453A (en) 1981-07-24
JPS6244690B2 true JPS6244690B2 (Direct) 1987-09-22

Family

ID=15866982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16837879A Granted JPS5691453A (en) 1979-12-26 1979-12-26 Manufacturing of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5691453A (Direct)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0177562A4 (en) * 1984-03-22 1987-06-03 Mostek Corp NITRIDE COMPOSITE LAYER.
CA2074809A1 (en) * 1990-01-29 1991-07-30 Marc J. Madou Passivated silicon substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146073A (Direct) * 1974-10-18 1976-04-20 Nippon Electric Co
JPS5258372A (en) * 1975-11-10 1977-05-13 Hitachi Ltd Semiconductor device and its production

Also Published As

Publication number Publication date
JPS5691453A (en) 1981-07-24

Similar Documents

Publication Publication Date Title
KR940008373B1 (ko) 반도체 장치의 제조방법
US5300461A (en) Process for fabricating sealed semiconductor chip using silicon nitride passivation film
JPS6221266B2 (Direct)
US4933305A (en) Process of wire bonding for semiconductor device
KR870000350B1 (ko) 다측 배선(多重配線)구조를 가진 전자장치(電子裝置)
JPS6244690B2 (Direct)
JP2579142B2 (ja) 樹脂封止型半導体装置
JPH03133131A (ja) 半導体装置
JP2668043B2 (ja) 保護絶縁膜を有する半導体装置,その製造方法およびその製造装置
JP2727605B2 (ja) 半導体装置及びその製造方法
JPS5852331B2 (ja) 半導体装置およびその製法
JPS58166748A (ja) 半導体装置
JPS628034B2 (Direct)
JPS5974651A (ja) 半導体装置
JPS615562A (ja) 半導体装置
JPS6025902B2 (ja) 樹脂封止型半導体装置
JP3498619B2 (ja) 半導体装置とその製法
JPH01283855A (ja) 半導体装置
JPS6322462B2 (Direct)
JP2771475B2 (ja) 半導体装置
JPS62219541A (ja) 半導体装置
JPS59172258A (ja) 半導体装置
JPS60198837A (ja) 半導体装置の製造方法
JPS58219741A (ja) 半導体装置
JPS59210645A (ja) 樹脂封止型半導体装置の製法