JPS58166748A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58166748A
JPS58166748A JP57049135A JP4913582A JPS58166748A JP S58166748 A JPS58166748 A JP S58166748A JP 57049135 A JP57049135 A JP 57049135A JP 4913582 A JP4913582 A JP 4913582A JP S58166748 A JPS58166748 A JP S58166748A
Authority
JP
Japan
Prior art keywords
film
semiconductor
rigid
substrate
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57049135A
Other languages
English (en)
Inventor
Koichiro Satonaka
里中　孝一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57049135A priority Critical patent/JPS58166748A/ja
Publication of JPS58166748A publication Critical patent/JPS58166748A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3192—Multilayer coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05624—Aluminium [Al] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 本発明は樹脂封止形半導体装置における保護膜に関する
。
自動車用電子製品に使用される樹脂封止形半導体集積回
路装置においては高耐湿性等の高信頼度型の保護膜で覆
うことが要求される。
このような要求をみたすために本願出願人において現在
使われている半導体装置保護膜構造として、第１図で示
すように、半導体Ｓｉ基板１０表面酸化膜（ＳｊＯ，＠
）のよＫＡＪ電極３を設け、その上をＰＳＧ（リンシリ
ケートガラス）のごとき金属イオントラップにすぐれた
不純物入り無機ガラス４で被覆し、さらに高ち轡性硬質
のプラズマ・ナイトライド（ｓｉ、　Ｎ４）膜５でパッ
シペイシ冒ンし、これをエポキシ系樹脂等の樹脂封止体
６で覆った構造がある。
しかし上記構造において、パッシベイシ璽ンのプラズｉ
・ナイトライド膜Ｓと外側の樹脂６とは相互に接着性が
わるく、高熱ストレスをかけた時。
同図で示すようにナイトライド膜５と樹脂体６との界面
が剥れ易く、この界面の線間７にそって水分が進入し、
ワイヤボンディング８したＡＪバッド３を腐食し、電極
不良等の製品の信ＩＩＩＩ［を低下する原因となった。
このための一つの対策としてポンディングパッド部分を
シリコン樹脂等の耐湯性樹脂で覆うことも提案されてい
るが、そのための工程数が増える割に効果がそれはとで
もなかった。
本発明は上記の問題を解決したもので、その目的とする
ところは工程数を増やすことない高信頼性の半導体装置
を提供するととにある。
以下実施例に基づき本発明の内容を詳述する。
第２図は本発明による樹脂對止蓋半導体集積回路装置の
一例を要部の断面図により示すものである。
同図において、１は半導体Ｓｌ基板であってその主表面
には公知の不純物選択拡散により半導体素子を構成する
半導体領域が形成される。２は表藺酸化属で一部は選択
拡散時のマスクとして使用され、その上に形成したＡ１
電極やＡＪ配線の絶縁下地膜として使用される。３はＡ
Ｊ、電極（又は配線）でその′一部はワイヤボンディン
グのためのパッド部として使用される。５は高ち密性か
つ硬質のａ縁膜で、例えばプラズマ放電を用いて析出し
た８１．Ｎ、（ナイトライド）膜を１μｍ＠変の厚さに
形成したものである。４は最終パッシベイシ璽ン膜とし
て形成したＰＳＧ（リン含有シリケートガラス）膜を１
μｍ〜０．２μｍ）１１度の厚さに形成したものである
。６は樹脂成形体となるエポキシ系樹脂であろう 以上実施例で述べた本発明によれば下記の理由で前記発
明の目的が達成できる。
最終パッシペイシ冒ン膜として形成したＰＥＧ膜は樹脂
との間の接着性が真好であるため、高熱ストレス試験（
例えば耐半田熱ストレス又はプレッシャークツカル試験
）により界面に隙間等が生じることなくポンディングパ
ッド部のＡＪの腐食は大幅に減少する。一方、内部のＡ
４配線は高ち密性のプラズマ働ナイトライド膜で保膜さ
れる。
本発明によれば工程数は増えることがないから製造コス
トが上ることもなく製品の高信頼性を保持できる。
本発明は前記実施例に限定されず１例えば最終バッシベ
イシ嘗ン膜としてＰＥＧの代りにポリイミド系樹脂を回
転塗布法により形成した被膜を用いても良い。
本発明は高信頼性の製品、特に自動車用の樹脂封止半導
体製品に適用して有効である。
【図面の簡単な説明】
第１図はこれまでの技術の例を示す半導体装置の一部縦
断面図、第２図は本発明による半導体装置の一部縦断面
図である。 ｌ・・・半導体基板、２・・・表面酸化膜、３・・・Ａ
ノミ極（配線）、４・・・ＰＥＧ膜、５・・・プラズマ
・ナイトライド膜、６・・・樹脂封止体、７・・・隙間
、８・・・ボンディングワイヤ。 代理人　弁理士　　薄　１）利　幸１゜第　　１　　図 、了 第　　２　　図 ゲ

Claims (1)

  1. 【特許請求の範囲】 １、主表面に半導体素子を形成した半導体基板の周辺部
    にアルミニウム・ポンディングパッドを配置し樹脂成形
    体により封止した半導体装置において、表面保護膜と［
    、て高ち密硬質膜で基板表面を覆うとともに樹脂成形体
    と高ち密硬質膜との間に両者のいずれに対しても接着性
    の良い物質の膜を介在させることを特徴とする半導体装
    置。 ２、上記高ち密硬質膜と樹脂成形体とのいずれに対して
    も接着のよい物質としてシリケート系無機ガラス又はポ
    リイミド系樹脂を使用する特許請求の範Ｓ第１項に記載
    の半導体装置。
JP57049135A 1982-03-29 1982-03-29 半導体装置 Pending JPS58166748A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57049135A JPS58166748A (ja) 1982-03-29 1982-03-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57049135A JPS58166748A (ja) 1982-03-29 1982-03-29 半導体装置

Publications (1)

Publication Number Publication Date
JPS58166748A true JPS58166748A (ja) 1983-10-01

Family

ID=12822619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57049135A Pending JPS58166748A (ja) 1982-03-29 1982-03-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS58166748A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03133161A (ja) * 1989-10-19 1991-06-06 Toshiba Corp 半導体装置
US5045918A (en) * 1986-12-19 1991-09-03 North American Philips Corp. Semiconductor device with reduced packaging stress
US5171716A (en) * 1986-12-19 1992-12-15 North American Philips Corp. Method of manufacturing semiconductor device with reduced packaging stress
EP0589678A3 (en) * 1992-09-23 1995-04-12 Dow Corning Hermetic protection for integrated circuits.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045918A (en) * 1986-12-19 1991-09-03 North American Philips Corp. Semiconductor device with reduced packaging stress
US5171716A (en) * 1986-12-19 1992-12-15 North American Philips Corp. Method of manufacturing semiconductor device with reduced packaging stress
JPH03133161A (ja) * 1989-10-19 1991-06-06 Toshiba Corp 半導体装置
EP0589678A3 (en) * 1992-09-23 1995-04-12 Dow Corning Hermetic protection for integrated circuits.
US5825078A (en) * 1992-09-23 1998-10-20 Dow Corning Corporation Hermetic protection for integrated circuits

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