JPS6244408B2 - - Google Patents

Info

Publication number
JPS6244408B2
JPS6244408B2 JP17485282A JP17485282A JPS6244408B2 JP S6244408 B2 JPS6244408 B2 JP S6244408B2 JP 17485282 A JP17485282 A JP 17485282A JP 17485282 A JP17485282 A JP 17485282A JP S6244408 B2 JPS6244408 B2 JP S6244408B2
Authority
JP
Japan
Prior art keywords
push pin
package
heat dissipation
heat
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17485282A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5963735A (ja
Inventor
Shiro Ooi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP17485282A priority Critical patent/JPS5963735A/ja
Publication of JPS5963735A publication Critical patent/JPS5963735A/ja
Publication of JPS6244408B2 publication Critical patent/JPS6244408B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP17485282A 1982-10-05 1982-10-05 半導体装置の製造方法 Granted JPS5963735A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17485282A JPS5963735A (ja) 1982-10-05 1982-10-05 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17485282A JPS5963735A (ja) 1982-10-05 1982-10-05 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5963735A JPS5963735A (ja) 1984-04-11
JPS6244408B2 true JPS6244408B2 (enrdf_load_stackoverflow) 1987-09-21

Family

ID=15985772

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17485282A Granted JPS5963735A (ja) 1982-10-05 1982-10-05 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5963735A (enrdf_load_stackoverflow)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02306639A (ja) * 1989-05-22 1990-12-20 Toshiba Corp 半導体装置の樹脂封入方法
JP2708084B2 (ja) * 1992-03-23 1998-02-04 ワイケイケイ株式会社 シートクッション材に面ファスナー止具を装着する方法および発泡成形金型
DE19642088A1 (de) * 1996-10-12 1998-04-16 Bosch Gmbh Robert Verfahren zur Herstellung eines mikrostrukturierten Körpers, eines Gußrahmens und eines integriert-optischen Bauteils
JP4519424B2 (ja) 2003-06-26 2010-08-04 ルネサスエレクトロニクス株式会社 樹脂モールド型半導体装置
DE102007020618B8 (de) 2007-04-30 2009-03-12 Danfoss Silicon Power Gmbh Verfahren zum Herstellen eines festen Leistungsmoduls und damit hergestelltes Transistormodul
CN102468190A (zh) * 2010-11-12 2012-05-23 三星半导体(中国)研究开发有限公司 一种封装模具及使用该模具的半导体封装工艺
DE102012222679A1 (de) * 2012-12-10 2014-06-12 Robert Bosch Gmbh Verfahren zur Herstellung eines Schaltmoduls und eines zugehörigen Gittermoduls sowie ein zugehöriges Gittermodul und korrespondierende elektronische Baugruppe
US9269597B2 (en) * 2013-01-23 2016-02-23 Microchip Technology Incorporated Open cavity plastic package
EP2927954B1 (de) 2014-04-02 2021-06-09 Brusa Elektronik AG Befestigungssystem für ein Leistungsmodul
JP6228904B2 (ja) * 2014-10-16 2017-11-08 新電元工業株式会社 半導体装置の製造方法、半導体装置、金型およびリードフレーム
JP6319399B2 (ja) * 2016-10-28 2018-05-09 株式会社デンソー インサート成形用金型
DE102020104220A1 (de) 2020-02-18 2021-08-19 Infineon Technologies Ag Transistor-Outline-Gehäuse und Transistor-Outline-Gehäuseanordnung
CN115023056A (zh) * 2022-05-30 2022-09-06 青岛歌尔微电子研究院有限公司 封装产品的选择性封装方法
CN117584359A (zh) * 2023-10-20 2024-02-23 敦南微电子（无锡）有限公司 用于半导体器件的塑封模具及塑封方法、顶压装置和器件

Also Published As

Publication number Publication date
JPS5963735A (ja) 1984-04-11

Similar Documents

Publication Publication Date Title
EP0063811B1 (en) A method for manufacturing a plastic encapsulated semiconductor device
US6611047B2 (en) Semiconductor package with singulation crease
EP1315605B1 (en) Mold and method for encapsulating an electronic device
JPS6244408B2 (enrdf_load_stackoverflow)
US6696753B2 (en) Enhancement of wire bondability in semiconductor device package
KR100309406B1 (ko) 옵토컴포넌트상의캡슐화재료의사출방법및장치
JPH01175250A (ja) リードフレーム及びそれを用いた半導体装置
JPS60128646A (ja) 絶縁型パワートランジスタの製造方法
JPH10116846A (ja) 樹脂封止型半導体装置の製造方法およびモールド金型
JP2755440B2 (ja) 樹脂モールド型半導体装置及び樹脂モールド装置
JP2752677B2 (ja) 半導体装置の製造方法
JP2002110716A (ja) 半導体装置の製造方法
JPH088375A (ja) 半導体装置およびその製造に使用されるリードフレーム並びに金型
JPH05226546A (ja) 半導体装置およびその製法
JP2965036B1 (ja) 樹脂封止形半導体装置用リードフレーム組立体及びその製造方法並びに樹脂封止形半導体装置の製造方法
JP3787131B2 (ja) Ｂｇａパッケージの製造に用いるモールド金型
JP3223634B2 (ja) 半導体装置
JP3008015B2 (ja) 半導体装置およびその製造方法
US20170040186A1 (en) Semiconductor device and method of manufacturing the same
JPH1022314A (ja) 半導体樹脂封止用金型
JP2522304B2 (ja) 半導体素子収納パッケ−ジの製造方法
JPS5926604Y2 (ja) 半導体装置
JPH0555410A (ja) 半導体装置
JPS607750A (ja) 絶縁型半導体装置
KR830000684Y1 (ko) 반도체 장치