JPS6243542B2 - - Google Patents

Info

Publication number
JPS6243542B2
JPS6243542B2 JP56148701A JP14870181A JPS6243542B2 JP S6243542 B2 JPS6243542 B2 JP S6243542B2 JP 56148701 A JP56148701 A JP 56148701A JP 14870181 A JP14870181 A JP 14870181A JP S6243542 B2 JPS6243542 B2 JP S6243542B2
Authority
JP
Japan
Prior art keywords
tray
die
drive motor
direction drive
dies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56148701A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5850751A (ja
Inventor
Noboru Fujino
Masayuki Shimura
Kazuhiro Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP14870181A priority Critical patent/JPS5850751A/ja
Publication of JPS5850751A publication Critical patent/JPS5850751A/ja
Publication of JPS6243542B2 publication Critical patent/JPS6243542B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP14870181A 1981-09-22 1981-09-22 ダイ詰め換え方法 Granted JPS5850751A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14870181A JPS5850751A (ja) 1981-09-22 1981-09-22 ダイ詰め換え方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14870181A JPS5850751A (ja) 1981-09-22 1981-09-22 ダイ詰め換え方法

Publications (2)

Publication Number Publication Date
JPS5850751A JPS5850751A (ja) 1983-03-25
JPS6243542B2 true JPS6243542B2 (de) 1987-09-14

Family

ID=15458659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14870181A Granted JPS5850751A (ja) 1981-09-22 1981-09-22 ダイ詰め換え方法

Country Status (1)

Country Link
JP (1) JPS5850751A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6123333A (ja) * 1984-07-11 1986-01-31 Hitachi Yonezawa Denshi Kk 電子部品の測定方法
JPH0392034U (de) * 1989-12-29 1991-09-19
KR20010055252A (ko) * 1999-12-10 2001-07-04 마이클 디. 오브라이언 반도체패키지 제조용 싱귤레이션 장비의 오프 로더
KR20130054787A (ko) * 2011-11-17 2013-05-27 삼성전자주식회사 반도체 테스트 장비

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553608A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Supplying method for plurality of article
JPS5570041A (en) * 1978-11-21 1980-05-27 Toshiba Corp Apparatus for fabricating semiconductor device
JPS55165641A (en) * 1979-06-11 1980-12-24 Hitachi Ltd Device for bonding pellet

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553608A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Supplying method for plurality of article
JPS5570041A (en) * 1978-11-21 1980-05-27 Toshiba Corp Apparatus for fabricating semiconductor device
JPS55165641A (en) * 1979-06-11 1980-12-24 Hitachi Ltd Device for bonding pellet

Also Published As

Publication number Publication date
JPS5850751A (ja) 1983-03-25

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