JPS6241277A - 異方導電性接着剤 - Google Patents

異方導電性接着剤

Info

Publication number
JPS6241277A
JPS6241277A JP60180350A JP18035085A JPS6241277A JP S6241277 A JPS6241277 A JP S6241277A JP 60180350 A JP60180350 A JP 60180350A JP 18035085 A JP18035085 A JP 18035085A JP S6241277 A JPS6241277 A JP S6241277A
Authority
JP
Japan
Prior art keywords
adhesive
thermoplastic elastomer
thermoplastic
vulcanized
synthetic rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60180350A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0410916B2 (enExample
Inventor
Toshiyuki Kawaguchi
利行 川口
Hideki Suzuki
秀樹 鈴木
Tsuneo Mada
恒夫 磨田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP60180350A priority Critical patent/JPS6241277A/ja
Priority to GB08619454A priority patent/GB2179357B/en
Priority to DE3627654A priority patent/DE3627654C2/de
Priority to US06/897,369 priority patent/US4701279A/en
Publication of JPS6241277A publication Critical patent/JPS6241277A/ja
Publication of JPH0410916B2 publication Critical patent/JPH0410916B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/24—Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP60180350A 1985-08-16 1985-08-16 異方導電性接着剤 Granted JPS6241277A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60180350A JPS6241277A (ja) 1985-08-16 1985-08-16 異方導電性接着剤
GB08619454A GB2179357B (en) 1985-08-16 1986-08-08 Anisotropically electroconductive adhesives
DE3627654A DE3627654C2 (de) 1985-08-16 1986-08-14 Elektrisch-anisotropes Haftmittel
US06/897,369 US4701279A (en) 1985-08-16 1986-08-15 Anisotropically electroconductive adhesives

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60180350A JPS6241277A (ja) 1985-08-16 1985-08-16 異方導電性接着剤

Publications (2)

Publication Number Publication Date
JPS6241277A true JPS6241277A (ja) 1987-02-23
JPH0410916B2 JPH0410916B2 (enExample) 1992-02-26

Family

ID=16081693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60180350A Granted JPS6241277A (ja) 1985-08-16 1985-08-16 異方導電性接着剤

Country Status (4)

Country Link
US (1) US4701279A (enExample)
JP (1) JPS6241277A (enExample)
DE (1) DE3627654C2 (enExample)
GB (1) GB2179357B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6386781A (ja) * 1986-09-30 1988-04-18 Sekisui Chem Co Ltd 異方導電性接着シ−ト
JPH048769A (ja) * 1990-04-27 1992-01-13 Dai Ichi Kogyo Seiyaku Co Ltd 帯電防止性及びイオン導伝性樹脂組成物
JPWO2014046014A1 (ja) * 2012-09-20 2016-08-18 株式会社クラレ 回路基板およびその製造方法

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5296074A (en) * 1987-03-30 1994-03-22 E. I. Du Pont De Nemours And Company Method for bonding small electronic components
JPH0291360U (enExample) * 1988-12-29 1990-07-19
JPH02310566A (ja) * 1989-05-26 1990-12-26 Canon Inc 電子写真用弾性部材
US5180523A (en) * 1989-11-14 1993-01-19 Poly-Flex Circuits, Inc. Electrically conductive cement containing agglomerate, flake and powder metal fillers
US5334330A (en) * 1990-03-30 1994-08-02 The Whitaker Corporation Anisotropically electrically conductive composition with thermal dissipation capabilities
JPH04245109A (ja) * 1991-01-31 1992-09-01 Shin Etsu Chem Co Ltd 異方性導電膜用組成物
JP2730357B2 (ja) * 1991-11-18 1998-03-25 松下電器産業株式会社 電子部品実装接続体およびその製造方法
US5286417A (en) * 1991-12-06 1994-02-15 International Business Machines Corporation Method and composition for making mechanical and electrical contact
DE69303645T2 (de) * 1992-03-25 1997-02-13 Molex Inc Modul mit gedruckter Schaltung
SE9201585L (sv) * 1992-05-19 1993-11-01 Gustavsson Magnus Peter M Elektriskt uppvärmt plagg eller liknande
US5620795A (en) * 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
US5439541A (en) * 1994-02-08 1995-08-08 The Board Of Trustees Of The University Of Illinois Method for producing and using crosslinked copolyesters
US5637176A (en) * 1994-06-16 1997-06-10 Fry's Metals, Inc. Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials
US5531942A (en) * 1994-06-16 1996-07-02 Fry's Metals, Inc. Method of making electroconductive adhesive particles for Z-axis application
US20010028953A1 (en) * 1998-11-16 2001-10-11 3M Innovative Properties Company Adhesive compositions and methods of use
WO1997003143A1 (en) 1995-07-10 1997-01-30 Minnesota Mining And Manufacturing Company Screen printable adhesive compositions
DE19528247A1 (de) * 1995-08-01 1997-02-06 Licentia Gmbh Flüssigkristallanzeige und Verfahren zu ihrer Herstellung
FI118127B (fi) * 1999-03-04 2007-07-13 Valtion Teknillinen Sähköä johtava termoplastinen elastomeeri ja siitä valmistettu tuote
KR100925361B1 (ko) * 1999-10-22 2009-11-09 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 저온 경화형 이방성 도전 접속재료
US20050208278A1 (en) * 2001-08-22 2005-09-22 Landi Vincent R Method for improving bonding of circuit substrates to metal and articles formed thereby
US20030075270A1 (en) * 2001-08-22 2003-04-24 Landi Vincent R. Method for improving bonding of circuit substrates to metal and articles formed thereby
JP2004051755A (ja) 2002-07-18 2004-02-19 Ricoh Co Ltd 弾性導電樹脂及び弾性導電接合構造
US20040142603A1 (en) * 2002-07-24 2004-07-22 Walker J. Thomas Attachable modular electronic systems
US6981879B2 (en) * 2004-03-18 2006-01-03 International Business Machines Corporation Land grid array (LGA) interposer with adhesive-retained contacts and method of manufacture
US20070227627A1 (en) * 2006-03-30 2007-10-04 Daewoong Suh Solder composition having dispersoid particles for increased creep resistance
WO2008004287A1 (en) * 2006-07-05 2008-01-10 Ablestik (Japan) Co., Ltd. Conductive adhesive
US20080081879A1 (en) * 2006-09-29 2008-04-03 Kim Balfour Crosslinked block copolymer composition and method
US20080081874A1 (en) * 2006-09-29 2008-04-03 Kim Balfour Poly(arylene ether) composition, method, and article
CN102559077A (zh) * 2007-10-15 2012-07-11 日立化成工业株式会社 粘接膜作为电路连接材料的用途以及粘接膜用于电路连接材料的制造的用途
WO2010093035A1 (ja) * 2009-02-16 2010-08-19 株式会社村田製作所 導電性樹脂組成物、それを用いた電子部品の製造方法、接合方法、接合構造、および電子部品
JP2018522954A (ja) 2015-05-01 2018-08-16 ロード コーポレイション ゴム接合用接着剤
CN112852342B (zh) * 2021-01-08 2021-09-28 深圳市维美德材料科技有限公司 一种用于5g频谱的超软导电胶及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492324A (enExample) * 1972-04-22 1974-01-10
JPS50135139A (enExample) * 1974-04-08 1975-10-27
JPS55774A (en) * 1979-05-01 1980-01-07 Seikosha Co Ltd Electrically conductive adhesive part and its use
JPS565840A (en) * 1979-06-28 1981-01-21 Shin Etsu Polymer Co Ltd Anisotropic pressure electrically-conductive elastomer molded article

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3567607A (en) * 1966-02-18 1971-03-02 Dow Chemical Co Irradiated metal-polymer compositions
GB1202891A (en) * 1967-01-06 1970-08-19 Glass Sealer Company Ltd Articles made from synthetic rubbers
US3862056A (en) * 1967-12-15 1975-01-21 Allied Chem Semiconductor polymer compositions comprising a grafted block copolymer of synthetic rubber and polyolefin and carbon black
US3806558A (en) * 1971-08-12 1974-04-23 Uniroyal Inc Dynamically partially cured thermoplastic blend of monoolefin copolymer rubber and polyolefin plastic
US4042534A (en) * 1974-02-28 1977-08-16 Andrianov Kuzma A Conducting anisotropic polymer material
JPS5964685A (ja) * 1982-10-05 1984-04-12 Shin Etsu Polymer Co Ltd 異方導電熱接着性フイルム
US4592861A (en) * 1984-06-08 1986-06-03 Uniroyal Chemical Company, Inc. Antistatic thermoplastic composition comprising a graft polymer, halogenated thermoplastic polymer and conductive carbon black
JPS6147760A (ja) * 1984-08-16 1986-03-08 Shin Etsu Polymer Co Ltd 異方導電接着剤

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492324A (enExample) * 1972-04-22 1974-01-10
JPS50135139A (enExample) * 1974-04-08 1975-10-27
JPS55774A (en) * 1979-05-01 1980-01-07 Seikosha Co Ltd Electrically conductive adhesive part and its use
JPS565840A (en) * 1979-06-28 1981-01-21 Shin Etsu Polymer Co Ltd Anisotropic pressure electrically-conductive elastomer molded article

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6386781A (ja) * 1986-09-30 1988-04-18 Sekisui Chem Co Ltd 異方導電性接着シ−ト
JPH048769A (ja) * 1990-04-27 1992-01-13 Dai Ichi Kogyo Seiyaku Co Ltd 帯電防止性及びイオン導伝性樹脂組成物
JPWO2014046014A1 (ja) * 2012-09-20 2016-08-18 株式会社クラレ 回路基板およびその製造方法

Also Published As

Publication number Publication date
GB2179357A (en) 1987-03-04
JPH0410916B2 (enExample) 1992-02-26
DE3627654A1 (de) 1987-04-09
GB8619454D0 (en) 1986-09-17
DE3627654C2 (de) 1995-01-05
US4701279A (en) 1987-10-20
GB2179357B (en) 1989-01-18

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees