JPS6236296Y2 - - Google Patents

Info

Publication number
JPS6236296Y2
JPS6236296Y2 JP9321982U JP9321982U JPS6236296Y2 JP S6236296 Y2 JPS6236296 Y2 JP S6236296Y2 JP 9321982 U JP9321982 U JP 9321982U JP 9321982 U JP9321982 U JP 9321982U JP S6236296 Y2 JPS6236296 Y2 JP S6236296Y2
Authority
JP
Japan
Prior art keywords
mold
punch
air
lead frame
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9321982U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58195433U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9321982U priority Critical patent/JPS58195433U/ja
Publication of JPS58195433U publication Critical patent/JPS58195433U/ja
Application granted granted Critical
Publication of JPS6236296Y2 publication Critical patent/JPS6236296Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9321982U 1982-06-22 1982-06-22 金型 Granted JPS58195433U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9321982U JPS58195433U (ja) 1982-06-22 1982-06-22 金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9321982U JPS58195433U (ja) 1982-06-22 1982-06-22 金型

Publications (2)

Publication Number Publication Date
JPS58195433U JPS58195433U (ja) 1983-12-26
JPS6236296Y2 true JPS6236296Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-09-16

Family

ID=30223914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9321982U Granted JPS58195433U (ja) 1982-06-22 1982-06-22 金型

Country Status (1)

Country Link
JP (1) JPS58195433U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPS58195433U (ja) 1983-12-26

Similar Documents

Publication Publication Date Title
JP2003142641A (ja) 半導体装置の樹脂封止後におけるタイバーの除去装置及び方法、並びに半導体装置の製造方法
KR100244966B1 (ko) 공기 유입구가 형성된 절단 펀치를 포함하는 게이트 잔여물절단 장치
JPS6236296Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH1056120A (ja) リードフレーム製造用プレス加工金型
JP2527573Y2 (ja) 半導体装置用タイバー切断金型
KR0185358B1 (ko) 반도체패키지 제조용 자동몰딩프레스의 디컬링장치
JP3564300B2 (ja) リード切断方法およびその方法に用いられる金型
CN216729304U (zh) 一种封装器件引脚的修剪工装
CN212707205U (zh) 一种用于电子元件高效分切的装置
JPH10135390A (ja) リード成形装置における粉塵除去装置
KR0131608Y1 (ko) 리이드 프레임의 테이프 전단 및 부착장치
JP2587191Y2 (ja) プレス成形装置
JP2606736B2 (ja) リードフレームの製造方法
JPH02307626A (ja) 打ち抜き装置
JPH1079463A (ja) 半導体装置製造用切断装置
JPH03159140A (ja) バリ取り装置
JPS6333133A (ja) 切断装置
KR100208473B1 (ko) 반도체패키지 제조용 자동몰딩프레스의 디컬링 장치
KR200306076Y1 (ko) 반도체패키지의댐바절단장치
JP2003124417A (ja) 半導体パッケージの製造装置及び製造方法
KR970000968B1 (ko) 반도체 팩키지의 분리장치
KR100193138B1 (ko) 복 수개의 공기 흡착 구멍을 갖는 다이 네스트 및 그를 이용한 절단 장치
JPH0464256A (ja) 半導体装置の製造方法
JP4533372B2 (ja) 半導体装置のリード切断金型、リード切断方法および半導体装置の製造方法
JPH0342687Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)