JPS6230514B2 - - Google Patents

Info

Publication number
JPS6230514B2
JPS6230514B2 JP54076126A JP7612679A JPS6230514B2 JP S6230514 B2 JPS6230514 B2 JP S6230514B2 JP 54076126 A JP54076126 A JP 54076126A JP 7612679 A JP7612679 A JP 7612679A JP S6230514 B2 JPS6230514 B2 JP S6230514B2
Authority
JP
Japan
Prior art keywords
metal
forming
film
thin film
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54076126A
Other languages
English (en)
Japanese (ja)
Other versions
JPS561593A (en
Inventor
Kazufumi Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7612679A priority Critical patent/JPS561593A/ja
Publication of JPS561593A publication Critical patent/JPS561593A/ja
Publication of JPS6230514B2 publication Critical patent/JPS6230514B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
JP7612679A 1979-06-15 1979-06-15 Method of fabricating circuit board Granted JPS561593A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7612679A JPS561593A (en) 1979-06-15 1979-06-15 Method of fabricating circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7612679A JPS561593A (en) 1979-06-15 1979-06-15 Method of fabricating circuit board

Publications (2)

Publication Number Publication Date
JPS561593A JPS561593A (en) 1981-01-09
JPS6230514B2 true JPS6230514B2 (enrdf_load_stackoverflow) 1987-07-02

Family

ID=13596225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7612679A Granted JPS561593A (en) 1979-06-15 1979-06-15 Method of fabricating circuit board

Country Status (1)

Country Link
JP (1) JPS561593A (enrdf_load_stackoverflow)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5212542B2 (enrdf_load_stackoverflow) * 1973-11-15 1977-04-07
JPS519578A (en) * 1974-07-12 1976-01-26 Sharp Kk Handotaisochino seizoho
JPS5133565A (en) * 1974-09-13 1976-03-22 Sharp Kk Handotaisochi no bondeinguhoho
JPS5213268A (en) * 1975-07-21 1977-02-01 Hitachi Ltd Intermittent, individualizing feed apparatus
JPS5353766A (en) * 1976-10-26 1978-05-16 Suwa Seikosha Kk Tape carrier tape

Also Published As

Publication number Publication date
JPS561593A (en) 1981-01-09

Similar Documents

Publication Publication Date Title
KR100614548B1 (ko) 반도체 소자 실장용 배선 기판의 제조 방법 및 반도체 장치
JPH03148846A (ja) Ｉｃ搭載用可撓性回路基板及びその製造法
JP3003624B2 (ja) 半導体装置
JPH02162746A (ja) 高密度集積回路の支持体とその製造方法
KR20020026849A (ko) 범프가 부착된 배선회로 기판 및 그 제조방법
JPH02253628A (ja) 半導体装置の製造方法
JP2000114412A (ja) 回路基板の製造方法
JPS6230514B2 (enrdf_load_stackoverflow)
JPS6035543A (ja) 半導体装置の製造方法
JPH10126056A (ja) プリント配線基板の製造方法
JP2727870B2 (ja) フィルムキャリアテープ及びその製造方法
JP3002307B2 (ja) 回路部品試験用可撓性回路基板の製造法
JPH11186344A (ja) デバイスホール内ダミーパターンの改善
JP2705263B2 (ja) Ｔａｂ用テープキャリアの製造方法
JPS62241345A (ja) バンプ付フィルムキャリヤの製造法
JPH04102341A (ja) Ｔａｂテープの製造方法
JP2024003147A (ja) 半導体装置用基板およびその製造方法、半導体装置
JP2779853B2 (ja) インナーリードと電子部品との接続中間体の製造方法
JPH0450760B2 (enrdf_load_stackoverflow)
JPH0795556B2 (ja) テープキャリアの製造方法
JPH03191542A (ja) フィルムキャリアテープの製造方法
JPH0327588A (ja) 回路基板の製造方法
JPH0736411B2 (ja) バンプ付テープキャリヤの製造法
JPH06140560A (ja) リードフレームおよびその製造方法
JPH067552B2 (ja) バンプ金属の形成方法およびその方法に用いるバンプ基板