JPS5353766A - Tape carrier tape - Google Patents

Tape carrier tape

Info

Publication number
JPS5353766A
JPS5353766A JP12854776A JP12854776A JPS5353766A JP S5353766 A JPS5353766 A JP S5353766A JP 12854776 A JP12854776 A JP 12854776A JP 12854776 A JP12854776 A JP 12854776A JP S5353766 A JPS5353766 A JP S5353766A
Authority
JP
Japan
Prior art keywords
tape
carrier
carrier tape
tape carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12854776A
Inventor
Toshio Kano
Original Assignee
Suwa Seikosha Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suwa Seikosha Kk filed Critical Suwa Seikosha Kk
Priority to JP12854776A priority Critical patent/JPS5353766A/en
Publication of JPS5353766A publication Critical patent/JPS5353766A/en
Application status is Pending legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
JP12854776A 1976-10-26 1976-10-26 Tape carrier tape Pending JPS5353766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12854776A JPS5353766A (en) 1976-10-26 1976-10-26 Tape carrier tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12854776A JPS5353766A (en) 1976-10-26 1976-10-26 Tape carrier tape

Publications (1)

Publication Number Publication Date
JPS5353766A true JPS5353766A (en) 1978-05-16

Family

ID=14987445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12854776A Pending JPS5353766A (en) 1976-10-26 1976-10-26 Tape carrier tape

Country Status (1)

Country Link
JP (1) JPS5353766A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561593A (en) * 1979-06-15 1981-01-09 Matsushita Electric Ind Co Ltd Method of fabricating circuit board
JPS62171134A (en) * 1986-01-23 1987-07-28 Fuji Xerox Co Ltd Film carrier and manufacture of semiconductor device using the filmcarrier
WO1991006977A1 (en) * 1989-11-06 1991-05-16 Nippon Mektron, Ltd. Flexible circuit board for mounting ic and method of producing the same
JPH0621142A (en) * 1992-03-04 1994-01-28 American Teleph & Telegr Co <Att> Method for bonding semiconductor chip and semiconductor integrated circuit device
JPH07321157A (en) * 1994-05-25 1995-12-08 Nec Corp Felxible film and semiconductor device equipped with it
WO2001015216A1 (en) * 1999-08-25 2001-03-01 Hitachi, Ltd. Semiconductor device and method of manufacture thereof

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561593A (en) * 1979-06-15 1981-01-09 Matsushita Electric Ind Co Ltd Method of fabricating circuit board
JPS6230514B2 (en) * 1979-06-15 1987-07-02 Matsushita Electric Ind Co Ltd
JPS62171134A (en) * 1986-01-23 1987-07-28 Fuji Xerox Co Ltd Film carrier and manufacture of semiconductor device using the filmcarrier
WO1991006977A1 (en) * 1989-11-06 1991-05-16 Nippon Mektron, Ltd. Flexible circuit board for mounting ic and method of producing the same
EP0452506B1 (en) * 1989-11-06 1996-03-13 Nippon Mektron, Ltd. METHOD OF PRODUCING A FLEXIBLE CIRCUIT BOARD FOR MOUNTING IC's
JPH0621142A (en) * 1992-03-04 1994-01-28 American Teleph & Telegr Co <Att> Method for bonding semiconductor chip and semiconductor integrated circuit device
JPH07321157A (en) * 1994-05-25 1995-12-08 Nec Corp Felxible film and semiconductor device equipped with it
US5905303A (en) * 1994-05-25 1999-05-18 Nec Corporation Method for manufacturing bump leaded film carrier type semiconductor device
WO2001015216A1 (en) * 1999-08-25 2001-03-01 Hitachi, Ltd. Semiconductor device and method of manufacture thereof

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