JPS6230359A - 半導体装置用ボンデイングワイヤ - Google Patents

半導体装置用ボンデイングワイヤ

Info

Publication number
JPS6230359A
JPS6230359A JP60169240A JP16924085A JPS6230359A JP S6230359 A JPS6230359 A JP S6230359A JP 60169240 A JP60169240 A JP 60169240A JP 16924085 A JP16924085 A JP 16924085A JP S6230359 A JPS6230359 A JP S6230359A
Authority
JP
Japan
Prior art keywords
wires
bonding
wire
oxide film
layer thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60169240A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6356303B2 (https=
Inventor
Hiroshi Ikeda
博 池田
Naoyuki Hosoda
細田　直之
Toshiaki Ono
敏昭 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP60169240A priority Critical patent/JPS6230359A/ja
Publication of JPS6230359A publication Critical patent/JPS6230359A/ja
Publication of JPS6356303B2 publication Critical patent/JPS6356303B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/553—Materials of bond wires not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP60169240A 1985-07-31 1985-07-31 半導体装置用ボンデイングワイヤ Granted JPS6230359A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60169240A JPS6230359A (ja) 1985-07-31 1985-07-31 半導体装置用ボンデイングワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60169240A JPS6230359A (ja) 1985-07-31 1985-07-31 半導体装置用ボンデイングワイヤ

Publications (2)

Publication Number Publication Date
JPS6230359A true JPS6230359A (ja) 1987-02-09
JPS6356303B2 JPS6356303B2 (https=) 1988-11-08

Family

ID=15882837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60169240A Granted JPS6230359A (ja) 1985-07-31 1985-07-31 半導体装置用ボンデイングワイヤ

Country Status (1)

Country Link
JP (1) JPS6230359A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010114880A (ja) * 2008-11-04 2010-05-20 Samsung Electronics Co Ltd 表面弾性波素子、表面弾性波装置、及びこれらの製造方法
DE102024204844A1 (de) * 2024-05-27 2025-11-27 Robert Bosch Gesellschaft mit beschränkter Haftung Halbleiterbauelement und Schaltungsanordnung

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55104462A (en) * 1979-02-01 1980-08-09 Mitsubishi Metal Corp Oxygen-free copper wire base material

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55104462A (en) * 1979-02-01 1980-08-09 Mitsubishi Metal Corp Oxygen-free copper wire base material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010114880A (ja) * 2008-11-04 2010-05-20 Samsung Electronics Co Ltd 表面弾性波素子、表面弾性波装置、及びこれらの製造方法
DE102024204844A1 (de) * 2024-05-27 2025-11-27 Robert Bosch Gesellschaft mit beschränkter Haftung Halbleiterbauelement und Schaltungsanordnung

Also Published As

Publication number Publication date
JPS6356303B2 (https=) 1988-11-08

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