JPS55104462A - Oxygen-free copper wire base material - Google Patents

Oxygen-free copper wire base material

Info

Publication number
JPS55104462A
JPS55104462A JP1090379A JP1090379A JPS55104462A JP S55104462 A JPS55104462 A JP S55104462A JP 1090379 A JP1090379 A JP 1090379A JP 1090379 A JP1090379 A JP 1090379A JP S55104462 A JPS55104462 A JP S55104462A
Authority
JP
Japan
Prior art keywords
wire
base material
oxygen
copper wire
enamel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1090379A
Other languages
Japanese (ja)
Other versions
JPS6053106B2 (en
Inventor
Hiroshi Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP1090379A priority Critical patent/JPS6053106B2/en
Publication of JPS55104462A publication Critical patent/JPS55104462A/en
Publication of JPS6053106B2 publication Critical patent/JPS6053106B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
  • Insulated Conductors (AREA)

Abstract

PURPOSE: To prevent wire rods from sticking to each other in annealing to be carried out prior to drawing and to enhance the adherence between the rod and enamel in enamel baking by forming an oxide film of a predetermined thickness on the surface of an oxygen-free copper wire base material.
CONSTITUTION: A core wire is passed through molten copper to deposition-solidify copper on the wire, rolled, and passed through an oxidation box in which air mixed with N2 and O2 is supplied. During the passage through the box a 100W5000Å thick oxide film is formed on the resulting oxygen-free copper wire base material on the core wire surface, and the film is air-cooled. Using the oxygen-free copper wire base material obtd. by this method, wire rods are prevented from sticking to each other in annealing to be carried out prior to drawing. In manufacture of an enameled wire using this material, the adherence between a copper wire and enamel can be made about equal to that between a tough pitch copper wire and enamel.
COPYRIGHT: (C)1980,JPO&Japio
JP1090379A 1979-02-01 1979-02-01 Oxygen-free copper wire material Expired JPS6053106B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1090379A JPS6053106B2 (en) 1979-02-01 1979-02-01 Oxygen-free copper wire material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1090379A JPS6053106B2 (en) 1979-02-01 1979-02-01 Oxygen-free copper wire material

Publications (2)

Publication Number Publication Date
JPS55104462A true JPS55104462A (en) 1980-08-09
JPS6053106B2 JPS6053106B2 (en) 1985-11-22

Family

ID=11763248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1090379A Expired JPS6053106B2 (en) 1979-02-01 1979-02-01 Oxygen-free copper wire material

Country Status (1)

Country Link
JP (1) JPS6053106B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57115715A (en) * 1981-01-12 1982-07-19 Furukawa Electric Co Ltd Method of producing compound superconductor
JPS57170529U (en) * 1981-04-22 1982-10-27
JPS609865A (en) * 1983-06-28 1985-01-18 Sumitomo Electric Ind Ltd Drawing method of niti alloy
JPS6230359A (en) * 1985-07-31 1987-02-09 Mitsubishi Metal Corp Bonding wire for semiconductor device
WO1998027243A1 (en) * 1996-12-18 1998-06-25 Messer Griesheim Gmbh Method of annealing nonferrous metal parts without stickers
US6682824B1 (en) * 2000-04-11 2004-01-27 Mitsubishi Materials Corporation Adhesion-resistant oxygen-free roughly drawn copper wire and method and apparatus for making the same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57115715A (en) * 1981-01-12 1982-07-19 Furukawa Electric Co Ltd Method of producing compound superconductor
JPH0470721B2 (en) * 1981-01-12 1992-11-11 Furukawa Electric Co Ltd
JPS57170529U (en) * 1981-04-22 1982-10-27
JPS609865A (en) * 1983-06-28 1985-01-18 Sumitomo Electric Ind Ltd Drawing method of niti alloy
JPH0116303B2 (en) * 1983-06-28 1989-03-23 Sumitomo Electric Industries
JPS6230359A (en) * 1985-07-31 1987-02-09 Mitsubishi Metal Corp Bonding wire for semiconductor device
JPS6356303B2 (en) * 1985-07-31 1988-11-08 Mitsubishi Metal Corp
WO1998027243A1 (en) * 1996-12-18 1998-06-25 Messer Griesheim Gmbh Method of annealing nonferrous metal parts without stickers
US6159307A (en) * 1996-12-18 2000-12-12 Messer Griesheim Gmbh Method of annealing nonferrous metal parts without stickers
US6682824B1 (en) * 2000-04-11 2004-01-27 Mitsubishi Materials Corporation Adhesion-resistant oxygen-free roughly drawn copper wire and method and apparatus for making the same

Also Published As

Publication number Publication date
JPS6053106B2 (en) 1985-11-22

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