JPS55104462A - Oxygen-free copper wire base material - Google Patents
Oxygen-free copper wire base materialInfo
- Publication number
- JPS55104462A JPS55104462A JP1090379A JP1090379A JPS55104462A JP S55104462 A JPS55104462 A JP S55104462A JP 1090379 A JP1090379 A JP 1090379A JP 1090379 A JP1090379 A JP 1090379A JP S55104462 A JPS55104462 A JP S55104462A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- base material
- oxygen
- copper wire
- enamel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
- Insulated Conductors (AREA)
Abstract
PURPOSE: To prevent wire rods from sticking to each other in annealing to be carried out prior to drawing and to enhance the adherence between the rod and enamel in enamel baking by forming an oxide film of a predetermined thickness on the surface of an oxygen-free copper wire base material.
CONSTITUTION: A core wire is passed through molten copper to deposition-solidify copper on the wire, rolled, and passed through an oxidation box in which air mixed with N2 and O2 is supplied. During the passage through the box a 100W5000Å thick oxide film is formed on the resulting oxygen-free copper wire base material on the core wire surface, and the film is air-cooled. Using the oxygen-free copper wire base material obtd. by this method, wire rods are prevented from sticking to each other in annealing to be carried out prior to drawing. In manufacture of an enameled wire using this material, the adherence between a copper wire and enamel can be made about equal to that between a tough pitch copper wire and enamel.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1090379A JPS6053106B2 (en) | 1979-02-01 | 1979-02-01 | Oxygen-free copper wire material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1090379A JPS6053106B2 (en) | 1979-02-01 | 1979-02-01 | Oxygen-free copper wire material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55104462A true JPS55104462A (en) | 1980-08-09 |
JPS6053106B2 JPS6053106B2 (en) | 1985-11-22 |
Family
ID=11763248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1090379A Expired JPS6053106B2 (en) | 1979-02-01 | 1979-02-01 | Oxygen-free copper wire material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6053106B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57115715A (en) * | 1981-01-12 | 1982-07-19 | Furukawa Electric Co Ltd | Method of producing compound superconductor |
JPS57170529U (en) * | 1981-04-22 | 1982-10-27 | ||
JPS609865A (en) * | 1983-06-28 | 1985-01-18 | Sumitomo Electric Ind Ltd | Drawing method of niti alloy |
JPS6230359A (en) * | 1985-07-31 | 1987-02-09 | Mitsubishi Metal Corp | Bonding wire for semiconductor device |
WO1998027243A1 (en) * | 1996-12-18 | 1998-06-25 | Messer Griesheim Gmbh | Method of annealing nonferrous metal parts without stickers |
US6682824B1 (en) * | 2000-04-11 | 2004-01-27 | Mitsubishi Materials Corporation | Adhesion-resistant oxygen-free roughly drawn copper wire and method and apparatus for making the same |
-
1979
- 1979-02-01 JP JP1090379A patent/JPS6053106B2/en not_active Expired
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57115715A (en) * | 1981-01-12 | 1982-07-19 | Furukawa Electric Co Ltd | Method of producing compound superconductor |
JPH0470721B2 (en) * | 1981-01-12 | 1992-11-11 | Furukawa Electric Co Ltd | |
JPS57170529U (en) * | 1981-04-22 | 1982-10-27 | ||
JPS609865A (en) * | 1983-06-28 | 1985-01-18 | Sumitomo Electric Ind Ltd | Drawing method of niti alloy |
JPH0116303B2 (en) * | 1983-06-28 | 1989-03-23 | Sumitomo Electric Industries | |
JPS6230359A (en) * | 1985-07-31 | 1987-02-09 | Mitsubishi Metal Corp | Bonding wire for semiconductor device |
JPS6356303B2 (en) * | 1985-07-31 | 1988-11-08 | Mitsubishi Metal Corp | |
WO1998027243A1 (en) * | 1996-12-18 | 1998-06-25 | Messer Griesheim Gmbh | Method of annealing nonferrous metal parts without stickers |
US6159307A (en) * | 1996-12-18 | 2000-12-12 | Messer Griesheim Gmbh | Method of annealing nonferrous metal parts without stickers |
US6682824B1 (en) * | 2000-04-11 | 2004-01-27 | Mitsubishi Materials Corporation | Adhesion-resistant oxygen-free roughly drawn copper wire and method and apparatus for making the same |
Also Published As
Publication number | Publication date |
---|---|
JPS6053106B2 (en) | 1985-11-22 |
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