JPS6228780Y2 - - Google Patents

Info

Publication number
JPS6228780Y2
JPS6228780Y2 JP1980061788U JP6178880U JPS6228780Y2 JP S6228780 Y2 JPS6228780 Y2 JP S6228780Y2 JP 1980061788 U JP1980061788 U JP 1980061788U JP 6178880 U JP6178880 U JP 6178880U JP S6228780 Y2 JPS6228780 Y2 JP S6228780Y2
Authority
JP
Japan
Prior art keywords
lead frame
heat sink
pad
support piece
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980061788U
Other languages
English (en)
Japanese (ja)
Other versions
JPS56164562U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980061788U priority Critical patent/JPS6228780Y2/ja
Publication of JPS56164562U publication Critical patent/JPS56164562U/ja
Application granted granted Critical
Publication of JPS6228780Y2 publication Critical patent/JPS6228780Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/5449

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1980061788U 1980-05-08 1980-05-08 Expired JPS6228780Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980061788U JPS6228780Y2 (enExample) 1980-05-08 1980-05-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980061788U JPS6228780Y2 (enExample) 1980-05-08 1980-05-08

Publications (2)

Publication Number Publication Date
JPS56164562U JPS56164562U (enExample) 1981-12-07
JPS6228780Y2 true JPS6228780Y2 (enExample) 1987-07-23

Family

ID=29656159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980061788U Expired JPS6228780Y2 (enExample) 1980-05-08 1980-05-08

Country Status (1)

Country Link
JP (1) JPS6228780Y2 (enExample)

Also Published As

Publication number Publication date
JPS56164562U (enExample) 1981-12-07

Similar Documents

Publication Publication Date Title
JP2004516654A (ja) リードフレームパッドから張り出しているダイを有する半導体装置パッケージおよびリードフレーム
JPH1056124A (ja) リードフレーム及びボトムリード型半導体パッケージ
JPH04233244A (ja) 集積回路アセンブリ
JPS6228780Y2 (enExample)
JPS622628A (ja) 半導体装置
EP0448713A4 (en) Semiconductor device.
JPS6143436A (ja) ボンデイング方法
JPS6050346B2 (ja) 半導体装置の製造方法
JPS62235763A (ja) 半導体装置用リ−ドフレ−ム
JP2587722Y2 (ja) 半導体装置
JPS642440Y2 (enExample)
JPH0364934A (ja) 樹脂封止型半導体装置
JPS63283053A (ja) 半導体装置のリ−ドフレ−ム
JPH0423330Y2 (enExample)
KR930009028A (ko) 인터컨넥트 리드를 이용한 반도체 패키지 및 그 제조방법
JPS622626A (ja) 半導体装置
JPS5847709Y2 (ja) 樹脂封止形半導体素子
JPS63160262A (ja) リ−ドフレ−ムおよびそれを用いた半導体装置
JPH073646Y2 (ja) 半導体装置の構造
JPH01173747A (ja) 樹脂封止形半導体装置
JPS6244531Y2 (enExample)
JPS61127139A (ja) 半導体装置
JPS6427236A (en) Wire bonding method
JPH0513658A (ja) 半導体装置用リードフレーム
JPS6081852A (ja) 半導体装置