JPS6227727B2 - - Google Patents
Info
- Publication number
- JPS6227727B2 JPS6227727B2 JP55171304A JP17130480A JPS6227727B2 JP S6227727 B2 JPS6227727 B2 JP S6227727B2 JP 55171304 A JP55171304 A JP 55171304A JP 17130480 A JP17130480 A JP 17130480A JP S6227727 B2 JPS6227727 B2 JP S6227727B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- impurity
- film
- impurity region
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/3115—Doping the insulating layers
- H01L21/31155—Doping the insulating layers by ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
- H01L21/2255—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Formation Of Insulating Films (AREA)
- Thyristors (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55171304A JPS5795625A (en) | 1980-12-04 | 1980-12-04 | Manufacture of semiconductor device |
DE19813147535 DE3147535A1 (de) | 1980-12-04 | 1981-12-01 | Verfahren zum herstellen einer halbleitervorrichtung |
US06/327,190 US4426234A (en) | 1980-12-04 | 1981-12-03 | Method of forming reproducible impurity zone of gallium or aluminum in a wafer by implanting through composite layers and diffusion annealing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55171304A JPS5795625A (en) | 1980-12-04 | 1980-12-04 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5795625A JPS5795625A (en) | 1982-06-14 |
JPS6227727B2 true JPS6227727B2 (en, 2012) | 1987-06-16 |
Family
ID=15920793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55171304A Granted JPS5795625A (en) | 1980-12-04 | 1980-12-04 | Manufacture of semiconductor device |
Country Status (3)
Country | Link |
---|---|
US (1) | US4426234A (en, 2012) |
JP (1) | JPS5795625A (en, 2012) |
DE (1) | DE3147535A1 (en, 2012) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6427458A (en) * | 1987-07-22 | 1989-01-30 | Cubic Eng Kk | Healthy drink |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4804634A (en) * | 1981-04-24 | 1989-02-14 | National Semiconductor Corporation | Integrated circuit lateral transistor structure |
JPS58125823A (ja) * | 1982-01-22 | 1983-07-27 | Hitachi Ltd | 半導体装置の製造方法 |
JPS5935425A (ja) * | 1982-08-23 | 1984-02-27 | Toshiba Corp | 半導体装置の製造方法 |
JPS6215864A (ja) * | 1985-07-15 | 1987-01-24 | Hitachi Ltd | 太陽電池の製造方法 |
JPS6393153A (ja) * | 1986-10-07 | 1988-04-23 | Toshiba Corp | 半導体装置の製造方法 |
JPS63144517A (ja) * | 1986-12-09 | 1988-06-16 | Nec Corp | 半導体装置の製造方法 |
US6352940B1 (en) * | 1998-06-26 | 2002-03-05 | Intel Corporation | Semiconductor passivation deposition process for interfacial adhesion |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2427103A1 (de) * | 1974-06-05 | 1975-12-18 | Idn Invention Dev Novelties | Behaelter zur aufbewahrung von magnetbandkassetten |
DE2449688C3 (de) | 1974-10-18 | 1980-07-10 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung einer dotierten Zone eines Leitfähigkeitstyps in einem Halbleiterkörper |
JPS5950113B2 (ja) | 1975-11-05 | 1984-12-06 | 株式会社東芝 | 半導体装置 |
US4063973A (en) | 1975-11-10 | 1977-12-20 | Tokyo Shibaura Electric Co., Ltd. | Method of making a semiconductor device |
JPS5272162A (en) * | 1975-12-12 | 1977-06-16 | Toshiba Corp | Production of semiconductor device |
US4102715A (en) | 1975-12-19 | 1978-07-25 | Matsushita Electric Industrial Co., Ltd. | Method for diffusing an impurity into a semiconductor body |
FR2417853A1 (fr) | 1978-02-17 | 1979-09-14 | Thomson Csf | Procede de realisation d'un transistor de type mos et transistor realise selon ce procede |
JPS5586151A (en) | 1978-12-23 | 1980-06-28 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Manufacture of semiconductor integrated circuit |
JPS55128828A (en) * | 1979-03-28 | 1980-10-06 | Matsushita Electronics Corp | Manufacture of semiconductor device |
-
1980
- 1980-12-04 JP JP55171304A patent/JPS5795625A/ja active Granted
-
1981
- 1981-12-01 DE DE19813147535 patent/DE3147535A1/de active Granted
- 1981-12-03 US US06/327,190 patent/US4426234A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6427458A (en) * | 1987-07-22 | 1989-01-30 | Cubic Eng Kk | Healthy drink |
Also Published As
Publication number | Publication date |
---|---|
JPS5795625A (en) | 1982-06-14 |
US4426234A (en) | 1984-01-17 |
DE3147535A1 (de) | 1982-08-05 |
DE3147535C2 (en, 2012) | 1988-07-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4431460A (en) | Method of producing shallow, narrow base bipolar transistor structures via dual implantations of selected polycrystalline layer | |
Crowder | The influence of the amorphous phase on ion distributions and annealing behavior of group III and group V ions implanted into silicon | |
US4332627A (en) | Method of eliminating lattice defects in a semiconductor device | |
EP0193021A1 (en) | A method of forming an ion implanted gallium arsenide device | |
US3945856A (en) | Method of ion implantation through an electrically insulative material | |
JPS63166220A (ja) | 半導体装置の製造方法 | |
JPS6227727B2 (en, 2012) | ||
JPH0126171B2 (en, 2012) | ||
US3541676A (en) | Method of forming field-effect transistors utilizing doped insulators as activator source | |
US4050967A (en) | Method of selective aluminum diffusion | |
JP3249753B2 (ja) | 半導体素子の製造方法 | |
EP0219243A2 (en) | Process of manufacturing a bipolar transistor | |
JPH039612B2 (en, 2012) | ||
JPS6392030A (ja) | 半導体装置の製造方法 | |
US4210473A (en) | Process for producing a semiconductor device | |
JPS6125209B2 (en, 2012) | ||
JPS6142854B2 (en, 2012) | ||
JP3223748B2 (ja) | 多結晶シリコン薄膜のアモルファス化方法及びこのアモルファス化方法を用いた多結晶シリコン薄膜抵抗の製造方法 | |
JPH01151232A (ja) | 半導体装置の製造方法 | |
JPS5954222A (ja) | 半導体装置の製造方法 | |
Benyaich et al. | Realignment of As doped polycrystalline Si films by double step annealing | |
JPH02301132A (ja) | 半導体基板にアルミニウム拡散層を形成する方法 | |
JPS60149125A (ja) | 半導体基板への不純物添加方法 | |
JPS6255689B2 (en, 2012) | ||
JPS6129537B2 (en, 2012) |