JPS62273725A - マスク合わせ精度評価用バ−ニアパタ−ン - Google Patents

マスク合わせ精度評価用バ−ニアパタ−ン

Info

Publication number
JPS62273725A
JPS62273725A JP61116660A JP11666086A JPS62273725A JP S62273725 A JPS62273725 A JP S62273725A JP 61116660 A JP61116660 A JP 61116660A JP 11666086 A JP11666086 A JP 11666086A JP S62273725 A JPS62273725 A JP S62273725A
Authority
JP
Japan
Prior art keywords
pattern
vernier
patterns
scale
main scale
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61116660A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04587B2 (enrdf_load_stackoverflow
Inventor
Hidemi Ishiuchi
秀美 石内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP61116660A priority Critical patent/JPS62273725A/ja
Publication of JPS62273725A publication Critical patent/JPS62273725A/ja
Publication of JPH04587B2 publication Critical patent/JPH04587B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP61116660A 1986-05-21 1986-05-21 マスク合わせ精度評価用バ−ニアパタ−ン Granted JPS62273725A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61116660A JPS62273725A (ja) 1986-05-21 1986-05-21 マスク合わせ精度評価用バ−ニアパタ−ン

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61116660A JPS62273725A (ja) 1986-05-21 1986-05-21 マスク合わせ精度評価用バ−ニアパタ−ン

Publications (2)

Publication Number Publication Date
JPS62273725A true JPS62273725A (ja) 1987-11-27
JPH04587B2 JPH04587B2 (enrdf_load_stackoverflow) 1992-01-08

Family

ID=14692741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61116660A Granted JPS62273725A (ja) 1986-05-21 1986-05-21 マスク合わせ精度評価用バ−ニアパタ−ン

Country Status (1)

Country Link
JP (1) JPS62273725A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02143544A (ja) * 1988-11-25 1990-06-01 Nec Corp 目合せ用バーニヤパターンを備えた半導体装置
KR20000045476A (ko) * 1998-12-30 2000-07-15 김영환 반도체소자의 테스트 패턴
JP2014154738A (ja) * 2013-02-12 2014-08-25 Toshiba Information Systems (Japan) Corp 半導体装置、積層ズレ測定装置及び積層ズレ測定方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02143544A (ja) * 1988-11-25 1990-06-01 Nec Corp 目合せ用バーニヤパターンを備えた半導体装置
US5017514A (en) * 1988-11-25 1991-05-21 Nec Corporation Method of manufacturing a semiconductor device using a main vernier pattern formed at a right angle to a subsidiary vernier pattern
KR20000045476A (ko) * 1998-12-30 2000-07-15 김영환 반도체소자의 테스트 패턴
JP2014154738A (ja) * 2013-02-12 2014-08-25 Toshiba Information Systems (Japan) Corp 半導体装置、積層ズレ測定装置及び積層ズレ測定方法

Also Published As

Publication number Publication date
JPH04587B2 (enrdf_load_stackoverflow) 1992-01-08

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