JPS6226182B2 - - Google Patents

Info

Publication number
JPS6226182B2
JPS6226182B2 JP56083686A JP8368681A JPS6226182B2 JP S6226182 B2 JPS6226182 B2 JP S6226182B2 JP 56083686 A JP56083686 A JP 56083686A JP 8368681 A JP8368681 A JP 8368681A JP S6226182 B2 JPS6226182 B2 JP S6226182B2
Authority
JP
Japan
Prior art keywords
substrate
polycrystalline silicon
silicon layer
dioxide film
single crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56083686A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57197834A (en
Inventor
Akinobu Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EASTERN STEEL
Original Assignee
EASTERN STEEL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EASTERN STEEL filed Critical EASTERN STEEL
Priority to JP8368681A priority Critical patent/JPS57197834A/ja
Publication of JPS57197834A publication Critical patent/JPS57197834A/ja
Publication of JPS6226182B2 publication Critical patent/JPS6226182B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Recrystallisation Techniques (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Element Separation (AREA)
JP8368681A 1981-05-29 1981-05-29 Manufacture of insulated and isolated substrate Granted JPS57197834A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8368681A JPS57197834A (en) 1981-05-29 1981-05-29 Manufacture of insulated and isolated substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8368681A JPS57197834A (en) 1981-05-29 1981-05-29 Manufacture of insulated and isolated substrate

Publications (2)

Publication Number Publication Date
JPS57197834A JPS57197834A (en) 1982-12-04
JPS6226182B2 true JPS6226182B2 (enrdf_load_stackoverflow) 1987-06-08

Family

ID=13809369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8368681A Granted JPS57197834A (en) 1981-05-29 1981-05-29 Manufacture of insulated and isolated substrate

Country Status (1)

Country Link
JP (1) JPS57197834A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5225235A (en) * 1987-05-18 1993-07-06 Osaka Titanium Co., Ltd. Semiconductor wafer and manufacturing method therefor
US4925809A (en) * 1987-05-23 1990-05-15 Osaka Titanium Co., Ltd. Semiconductor wafer and epitaxial growth on the semiconductor wafer with autodoping control and manufacturing method therefor
JP7697397B2 (ja) * 2022-04-15 2025-06-24 信越半導体株式会社 ポリシリコンウェーハの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523862Y2 (enrdf_load_stackoverflow) * 1973-07-09 1977-01-27
FR2369912A1 (fr) * 1976-11-08 1978-06-02 Raychem Sa Nv Objet a reprise thermique

Also Published As

Publication number Publication date
JPS57197834A (en) 1982-12-04

Similar Documents

Publication Publication Date Title
US4567646A (en) Method for fabricating a dielectric isolated integrated circuit device
JP2699359B2 (ja) 半導体基板の製造方法
JPS6226182B2 (enrdf_load_stackoverflow)
JPS6155252B2 (enrdf_load_stackoverflow)
US5208167A (en) Method for producing SOI substrate
JPS6047239B2 (ja) 単結晶シリコン薄膜の製造方法
JPS60193324A (ja) 半導体基板の製造方法
JP2681420B2 (ja) 誘電体基板の製造方法
JPS61177742A (ja) 半導体装置
JP2722823B2 (ja) 多結晶Si膜の選択堆積方法
JPH05136060A (ja) 結晶薄膜の形成方法
JPH03292723A (ja) シリコン単結晶薄膜の作製方法
JPH0669024B2 (ja) 半導体装置の製造方法
JPS5939044A (ja) 絶縁分離集積回路用基板の製造方法
JP2683005B2 (ja) 誘電体分離基板の製造方法
JPS60198811A (ja) 半導体装置の製造方法
JPS6152983B2 (enrdf_load_stackoverflow)
JPH04307735A (ja) 半導体装置の製造方法
JP3206944B2 (ja) 半導体装置
JP2664458B2 (ja) 素子分離方法
JPS61174736A (ja) 誘電体分離基板の製造方法
JPS6079711A (ja) 半導体装置の製造方法
JPH0758197A (ja) 複合半導体基板及びその製造方法
JPS6155251B2 (enrdf_load_stackoverflow)
JPS6244412B2 (enrdf_load_stackoverflow)