JPS62222696A - 多層配線基板の製造方法 - Google Patents

多層配線基板の製造方法

Info

Publication number
JPS62222696A
JPS62222696A JP6497086A JP6497086A JPS62222696A JP S62222696 A JPS62222696 A JP S62222696A JP 6497086 A JP6497086 A JP 6497086A JP 6497086 A JP6497086 A JP 6497086A JP S62222696 A JPS62222696 A JP S62222696A
Authority
JP
Japan
Prior art keywords
wiring board
base metal
multilayer wiring
metal layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6497086A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0587038B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
藤原　彰夫
昭一 岩永
曽和　孝義
中 横野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6497086A priority Critical patent/JPS62222696A/ja
Publication of JPS62222696A publication Critical patent/JPS62222696A/ja
Priority to US07/281,879 priority patent/US4963512A/en
Publication of JPH0587038B2 publication Critical patent/JPH0587038B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP6497086A 1986-03-25 1986-03-25 多層配線基板の製造方法 Granted JPS62222696A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6497086A JPS62222696A (ja) 1986-03-25 1986-03-25 多層配線基板の製造方法
US07/281,879 US4963512A (en) 1986-03-25 1988-12-08 Method for forming conductor layers and method for fabricating multilayer substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6497086A JPS62222696A (ja) 1986-03-25 1986-03-25 多層配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS62222696A true JPS62222696A (ja) 1987-09-30
JPH0587038B2 JPH0587038B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-12-15

Family

ID=13273412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6497086A Granted JPS62222696A (ja) 1986-03-25 1986-03-25 多層配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS62222696A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011076386A (ja) * 2009-09-30 2011-04-14 Hosiden Corp 静電容量式タッチパネル及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011076386A (ja) * 2009-09-30 2011-04-14 Hosiden Corp 静電容量式タッチパネル及びその製造方法

Also Published As

Publication number Publication date
JPH0587038B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-12-15

Similar Documents

Publication Publication Date Title
JPH06112630A (ja) 回路配線パタ−ンの形成法
TWI357291B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN1798485B (zh) 多层印刷电路板及其制造方法
JP2023073270A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH10178271A (ja) 多層配線基板の製造方法および多層配線基板
JP2005109108A (ja) ビルドアッププリント配線板及びその製造方法
JPS62222696A (ja) 多層配線基板の製造方法
JP3585793B2 (ja) 両面薄膜配線基板の製造方法
JPH1079568A (ja) プリント配線板の製造方法
CN111447753A (zh) 一种线路板及其制造方法
TW592007B (en) Build-up circuit board with conductive barrier structure and method for fabricating the same
JPH02301187A (ja) 両面配線基板の製造方法
JPH03225894A (ja) プリント配線板の製造方法
JPS63153893A (ja) 多層プリント配線板
JP2023167062A (ja) プリント配線板およびその製造方法
JP2003258421A (ja) フレキシブルプリント配線板の製造方法
JPS59106191A (ja) スル−ホ−ルを有する配線基板製造方法
JP2000357311A (ja) フレクシャ及びその製造方法
JPH07302665A (ja) 接続部材の製造方法
JPS60142592A (ja) プリント回路板の製造法
JPS63187687A (ja) 印刷配線基板の製造方法
JP2004281835A (ja) プリント配線板及びその製造方法
JP2004014679A (ja) 積層用回路基板および積層回路
JP2002314229A (ja) フレキシブルプリント配線板の製造方法
JP2001094224A (ja) プリント配線板およびプリント配線板の製造方法