JPS6216018B2 - - Google Patents

Info

Publication number
JPS6216018B2
JPS6216018B2 JP5114082A JP5114082A JPS6216018B2 JP S6216018 B2 JPS6216018 B2 JP S6216018B2 JP 5114082 A JP5114082 A JP 5114082A JP 5114082 A JP5114082 A JP 5114082A JP S6216018 B2 JPS6216018 B2 JP S6216018B2
Authority
JP
Japan
Prior art keywords
wafer
alignment
probe
chip
probe needle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5114082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58169922A (ja
Inventor
Hiromichi Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5114082A priority Critical patent/JPS58169922A/ja
Publication of JPS58169922A publication Critical patent/JPS58169922A/ja
Publication of JPS6216018B2 publication Critical patent/JPS6216018B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP5114082A 1982-03-31 1982-03-31 オ−トプロ−バにおけるウエハ−のアライメント方法 Granted JPS58169922A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5114082A JPS58169922A (ja) 1982-03-31 1982-03-31 オ−トプロ−バにおけるウエハ−のアライメント方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5114082A JPS58169922A (ja) 1982-03-31 1982-03-31 オ−トプロ−バにおけるウエハ−のアライメント方法

Publications (2)

Publication Number Publication Date
JPS58169922A JPS58169922A (ja) 1983-10-06
JPS6216018B2 true JPS6216018B2 (enrdf_load_html_response) 1987-04-10

Family

ID=12878509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5114082A Granted JPS58169922A (ja) 1982-03-31 1982-03-31 オ−トプロ−バにおけるウエハ−のアライメント方法

Country Status (1)

Country Link
JP (1) JPS58169922A (enrdf_load_html_response)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065690B2 (ja) * 1983-07-19 1994-01-19 東京エレクトロン株式会社 半導体ウエハプローブ方法
JPS6024030A (ja) * 1983-07-19 1985-02-06 Telmec Co Ltd 半導体ウエハ測定方法
US4755746A (en) * 1985-04-24 1988-07-05 Prometrix Corporation Apparatus and methods for semiconductor wafer testing
US4943767A (en) * 1986-08-21 1990-07-24 Tokyo Electron Limited Automatic wafer position aligning method for wafer prober
JP2582256B2 (ja) * 1987-04-23 1997-02-19 東京エレクトロン株式会社 プロービング方法
JPH0748509B2 (ja) * 1987-04-28 1995-05-24 東京エレクトロン株式会社 プロ−ビング方法

Also Published As

Publication number Publication date
JPS58169922A (ja) 1983-10-06

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