JPS62158352A - Resin sealed semiconductor device - Google Patents

Abstract

PURPOSE:To improve packaging density, and to complete a function by also projecting a lead to at least one surface of upper and lower surfaces besides the surface of a resin seal body. CONSTITUTION:A semiconductor element 1 section is sealed by a resin sealing body 14 through resin-seal molding, and tie-bar 12b is cut off. Consequently, a resin-seal semiconductor device in which leads 12c are protruded from both side surfaces of the resin sealing body 14, leads 12d are projected from an upper surface and leads 12e are protruded from a lower surface is manufactured. Separate pads are connected by connecting the leads 12d projected from the upper surface by connecting wires on the upper surface of the semiconductor element 1. Accordingly, other electronic parts are connected to the leads 12d or 12e from the upper surface or the lower surface, thus increasing packaging density, then improving the function and performance of the semiconductor element.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a resin-sealed semiconductor device having leads extending in a plurality of directions from a resin-sealed body.

[Conventional technology]

The state of this type of conventional resin-sealed semiconductor device before resin sealing was as shown in Fig. M5. 2 is the lead frame,
A large number of leads 2c are connected to the tie bar 2b.

A semiconductor element 1 is die-bonded onto the die pad 2a of this lead frame 2 using Au-8L eutectic solder or the like. Each bonding pad (
(not shown) and each lead 20 are wire-bonded using thin metal wires 3.

This semiconductor element 1 portion is sealed with a resin molding body 4 as shown in FIG. 6 by resin molding. After this, tie bar 2b
When removed, a resin-sealed semiconductor device is obtained in which a large number of leads 2C extend horizontally from both sides of the resin-sealed body 4. These boards 2C can be bent downward if necessary. In this way, the leads 2c were brought out from three sides or three or four sides of the resin sealing body 4.

[Problem that the invention seeks to solve]

In the conventional resin-sealed semiconductor device as described above, lead 2
c could only be taken out from the side surface of the resin sealing body 4.

Recently, the functions required of semiconductor devices, especially integrated circuits, have become complex, high-performance, and high-grade, and it has become difficult to integrate all functions within a limited area. For this reason - 1. Resin-sealed semiconductor devices with one function and other semiconductor devices and electronic components with other functions had to be mounted and connected on a printed circuit board, which increased the area occupied. .

Further, connection wiring between separate pads on a semiconductor element is difficult in a limited space, and functionality is restricted.

This invention was made to solve these problems, and allows other semiconductor devices and electronic components to be connected on the top, increasing packaging density and expanding functionality. It is an object of the present invention to provide a semiconductor device in which connections between pads can be made freely outside the resin molding body. It extends outside of the sides and on at least one of the top and bottom surfaces.

[Effect]

In this invention, the lead is outside the side surface of the resin sealing body.
It is exposed on the top surface, the bottom surface, or both sides, and other semiconductor devices or electronic components can be connected thereto, and furthermore, the required length of the leads on the top surface or the bottom surface can be connected.

〔Example〕

FIG. 1 is a perspective view of an embodiment of a resin-sealed semiconductor device according to the present invention before being resin-sealed. Reference numeral 12 designates a lead frame, in which a large number of leads 12c are connected to tie bars 12b, and upper and lower lead leads 12d and 12e are bent and protruded. The semiconductor element 1 is die-bonded onto the die pad 12a of this lead frame 12 using Au-8i eutectic solder or the like. Each bonding pad (not shown) on the upper surface of the semiconductor element l and each lead 12c
The parts are wire-bonded with thin metal wires 3, respectively.

This semiconductor element 1 portion is sealed with a resin molding body 14 as shown in FIG. 2 by resin molding. After this, cut out the tie bar 12b. In this way, the leads 12c are brought out horizontally from both sides of the resin sealing body 14, and the leads 12c are brought out from the top surface.
2d is exposed, and a resin-sealed semiconductor device is obtained in which leads 12e are exposed from the bottom surface. Unnecessary portions of the side leads 12c may be cut off. Further, the lead 12c is bent downward as necessary.

FIG. 3 shows another embodiment of the present invention, in which leads 12c extending from both sides are bent downward, and leads 12d extend from the top surface of the semiconductor element 1. ) is the lead x2ati! coming out from the top! This can be done by connecting with the IT connection line.
Thereby, even if the semiconductor element 1 is small, it can be freely connected externally.

FIG. 4 shows another different embodiment of the present invention, in which a large number of leads 12c are taken out from both sides of the resin sealing body 14, and a lead 12f whose tip is bent horizontally is taken out from the top surface. There is.

In this way, the leads 12d come out from the upper surface or the lower surface,
By connecting other electronic components to 12f or 12e, the packaging density can be increased and the functionality of the semiconductor element can be increased.

Performance can be enhanced.

For example, the address bus and data bus of a microcomputer chip can be connected to the upper surface glue 1 of the resin molded body 14 of the device according to the present invention.
By connecting the memory element to the lead 12d on the top surface directly or via a connector such as a socket, the microcomputer function can be enhanced. Furthermore, the characteristics of the linear IC can be changed by replacing the memory elements connected to the leads 12d to 12f.

〔Effect of the invention〕

As described above, according to the present invention, since the leads are exposed outside the side surfaces of the resin molded body and on at least one of the top and bottom surfaces, the packaging density of semiconductor devices can be increased with a small occupied area. , the functionality will be enhanced. Further, even in the case of a semiconductor element in which connection between separate pads cannot be made, the functionality can be improved by freely connecting externally with leads on the upper or lower surface of the resin molded body.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an embodiment of a resin-sealed semiconductor device according to the present invention before being sealed with resin, FIG. 2 is a perspective view of the semiconductor device sealed with resin from the state shown in FIG. 1, and FIG. and the fourth factor is a perspective view of a resin-sealed semiconductor device showing other different embodiments of the present invention, a wcs diagram is a perspective view of a conventional semiconductor device before resin sealing, and FIG. 6 is a state shown in FIG. 5. This is the cause of strabismus in semiconductor devices sealed with resin.

Claims (1)

[Claims] A large number of leads extending from a side surface of a resin encapsulation body that encapsulates a semiconductor element mounted on a lead frame, and leads extending from at least one of the top and bottom surfaces of the resin encapsulation body. A resin-sealed semiconductor device comprising: