JPH0222886A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To obtain a highly functional and a small mounting width hybrid integrated circuit by exposing part of other main surface of a printed board out of a resin seal portion and providing an electrode for external connection via a through hole. CONSTITUTION:There are provided on a main surface of a printed board 2 having through holes 4 a passive element chip 5 and an active element chip 8, and a resin sealing portion 3 for sealing these chips 5 and 8 and a metal wiring connecting these chips. In this hybrid integrated circuit, bumps 1 are provided on the rear surface side ends of three through holes 4 in the board 2 in place of a lead frame for external connection, and the resin sealing portion 3 seals the upper and the side surfaces of the board 2, and the bottom part thereof exposes the bumps 1. A solder resist layer 9 is formed on the rear surface of the board 2 except the region of bumps 1 and this board can be mounted directly to an external board. In this case, the mounting width can be made smaller, because the width l of the hybrid integrated circuit, the mounting width, is smaller than the conventional mounting width.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to hybrid integrated circuits.

[Conventional technology]

The hybrid integrated circuit is a hybrid integrated circuit in which a passive element chip 5 and an active element chip 8 are mounted on the upper surface of a printed wiring board 2 with external connection leads 10 tangentially connected on both sides, and are connected to circuit wiring 6 using bonding wires 7. An integrated circuit is formed and then sealed with a resin sealing portion 3a using a transfer molding method, a casting molding method, or the like.

Here, on the back side of the printed wiring board 2, - and through holes 4 are provided.
There was electrical wiring in some parts.

[Problem to be solved by the invention]

The conventional hybrid integrated circuit described above has only a terminal lead frame for external connection, so increasing the number of leads that serve as external connection terminals in order to increase the scale of the circuit configuration in response to higher functionality will result in a larger package. The drawback is that it prevents the miniaturization of a hybrid integrated circuit mounting board with a mounting width.

An object of the present invention is to provide a hybrid integrated circuit with high functionality and a small mounting width.

[Means to solve the problem]

The hybrid integrated circuit of the present invention includes a passive element chip and an active element chip placed on one main surface of a printed wiring board having a through hole, and metal wiring connecting the passive element chip and the active element chip. In the hybrid integrated circuit, at least a part of the other main surface of the printed wiring board is exposed from the resin sealing part, and an electrode for external connection is connected through the through hole. It is set up and configured.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a sectional view of an embodiment of the present invention.

In the hybrid integrated circuit, bumps 1 instead of lead frames for external connection are provided at the back end of three through holes 4 of a printed wiring board 2, and a resin sealing part 3 seals the top and side surfaces of the printed wiring board 2. The fish implement is similar to the conventional hybrid integrated circuit except that it is different from the resin sealing part 3a of FIG. 2 in that it is sealed and the bump 1 is exposed at the bottom.

A solder resist layer 9 is formed on the back surface of the printed wiring board 2 except for the bumps 1, so that it can be directly mounted on an external mounting board.

In this case, the width Q of the hybrid integrated circuit, which is the mounting width, is shorter than the mounting width of the conventional lead 10, so it is possible to reduce the mounting width.

〔Effect of the invention〕

As explained above, the present invention includes exposing at least a part of one main surface of a printed wiring board from a resin sealing part, providing electrodes or bumps for external connection, and further applying solder resist as necessary. By implementing the above, all the external connection terminals can be removed from the bottom surface of the package, resulting in a shortened mounting dimension and, as a result, the effect of enabling high-density mounting on an external mounting board.

Further, since the electrode ends for external connection can be easily provided from the printed wiring board, there is an effect that it is possible to easily cope with the increase in the number of bins.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of an example of a conventional hybrid integrated circuit. DESCRIPTION OF SYMBOLS 1... Bump, 2... Printed wiring board, 3... Resin sealing part, 4... Through hole, 5... Passive element chip, 6... Circuit wiring, 7... Bonding wire,
8...Active element chip. b Kyogori sword Hatako Kufu.

Claims (1)

[Claims] A resin sealing part that includes and seals a passive element chip and an active element chip placed on one main surface of a printed wiring board having a through hole, and metal wiring connecting between the passive element chip and the active element chip. In the hybrid integrated circuit, at least a part of the other main surface of the printed wiring board is exposed from the resin sealing part, and an electrode for external connection is provided through the through hole. Hybrid integrated circuit.