JPS621278B2 - - Google Patents
Info
- Publication number
- JPS621278B2 JPS621278B2 JP4950479A JP4950479A JPS621278B2 JP S621278 B2 JPS621278 B2 JP S621278B2 JP 4950479 A JP4950479 A JP 4950479A JP 4950479 A JP4950479 A JP 4950479A JP S621278 B2 JPS621278 B2 JP S621278B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- leadless
- printed wiring
- resin
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- 238000007639 printing Methods 0.000 claims description 19
- 239000003973 paint Substances 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- ITBPIKUGMIZTJR-UHFFFAOYSA-N [bis(hydroxymethyl)amino]methanol Chemical compound OCN(CO)CO ITBPIKUGMIZTJR-UHFFFAOYSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000010125 resin casting Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4950479A JPS55141734A (en) | 1979-04-20 | 1979-04-20 | Method for coating leadless part installed on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4950479A JPS55141734A (en) | 1979-04-20 | 1979-04-20 | Method for coating leadless part installed on printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55141734A JPS55141734A (en) | 1980-11-05 |
| JPS621278B2 true JPS621278B2 (ko) | 1987-01-12 |
Family
ID=12832958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4950479A Granted JPS55141734A (en) | 1979-04-20 | 1979-04-20 | Method for coating leadless part installed on printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55141734A (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58204546A (ja) * | 1982-05-25 | 1983-11-29 | Citizen Watch Co Ltd | Ｉｃの封止方法 |
| JPH07107952B2 (ja) * | 1985-09-19 | 1995-11-15 | 株式会社日立製作所 | 電子回路板 |
| JPH0695594B2 (ja) * | 1989-02-03 | 1994-11-24 | 日本レック株式会社 | 電気配線基板の表面実装に於ける電気部品の樹脂封止方法 |
| JP2008288250A (ja) * | 2007-05-15 | 2008-11-27 | Nec Electronics Corp | マルチチップパッケージ |
-
1979
- 1979-04-20 JP JP4950479A patent/JPS55141734A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55141734A (en) | 1980-11-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1128674A (en) | Method of mounting electronic components | |
| JPS6376396A (ja) | 回路素子の装着方法 | |
| JPS621278B2 (ko) | ||
| JPS6213840B2 (ko) | ||
| US20070119911A1 (en) | Method of forming a composite standoff on a circuit board | |
| JPS61500047A (ja) | 電子回路組立方法 | |
| DE4108667C2 (de) | Verbundanordnung aus einer metallischen Grundplatte und einer keramischen Leiterplatte sowie Verfahren zu deren Herstellung | |
| JPH02102563A (ja) | 半導体装置とその製法 | |
| JP2512496B2 (ja) | マスキング材の付着方法 | |
| JPS6339117B2 (ko) | ||
| JPH08213747A (ja) | 表面実装部品の実装方法 | |
| JPS599996A (ja) | 電子部品仮固定方法 | |
| US5151300A (en) | Method for forming a carbon resistance in a printed wiring board | |
| JPS6310599B2 (ko) | ||
| JPH025552Y2 (ko) | ||
| JPS60130887A (ja) | 基板に配線パタ−ンを形成する方法 | |
| JPH04299847A (ja) | ベアチップの封止方法 | |
| GB959425A (en) | Improvements in or relating to printed circuits for electronic and other electrical equipment | |
| JPS6252959B2 (ko) | ||
| JPS61101094A (ja) | 接着剤塗布パタ−ンによるチツプ部品仮止め接着方法 | |
| JPS59996B2 (ja) | 印刷配線板の製造方法 | |
| JPH04151893A (ja) | 電子部品の欠落防止方法 | |
| JPS62154692A (ja) | 印刷回路板の製造方法 | |
| JPS6174394A (ja) | リ−ドレス部品の半田付方法 | |
| JPS6181698A (ja) | 配線回路装置 |