JPS621247B2 - - Google Patents

Info

Publication number
JPS621247B2
JPS621247B2 JP11060780A JP11060780A JPS621247B2 JP S621247 B2 JPS621247 B2 JP S621247B2 JP 11060780 A JP11060780 A JP 11060780A JP 11060780 A JP11060780 A JP 11060780A JP S621247 B2 JPS621247 B2 JP S621247B2
Authority
JP
Japan
Prior art keywords
chip
wafer
chips
semiconductor wafer
defective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11060780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5735333A (en
Inventor
Kimio Meguro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP11060780A priority Critical patent/JPS5735333A/ja
Publication of JPS5735333A publication Critical patent/JPS5735333A/ja
Publication of JPS621247B2 publication Critical patent/JPS621247B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP11060780A 1980-08-12 1980-08-12 Inspection equipment of semiconductor wafer Granted JPS5735333A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11060780A JPS5735333A (en) 1980-08-12 1980-08-12 Inspection equipment of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11060780A JPS5735333A (en) 1980-08-12 1980-08-12 Inspection equipment of semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS5735333A JPS5735333A (en) 1982-02-25
JPS621247B2 true JPS621247B2 (zh) 1987-01-12

Family

ID=14540116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11060780A Granted JPS5735333A (en) 1980-08-12 1980-08-12 Inspection equipment of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5735333A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06250768A (ja) * 1993-02-23 1994-09-09 Nec Corp キーボード装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0688859B2 (ja) * 1988-08-09 1994-11-09 株式会社ミツトヨ セラミックスのマーキング方法
JP2858983B2 (ja) * 1991-03-15 1999-02-17 山形日本電気株式会社 半導体ウェーハプロービング装置
JP2826388B2 (ja) * 1991-03-18 1998-11-18 山形日本電気株式会社 半導体ウェーハプロービング装置
JP2818551B2 (ja) * 1995-05-31 1998-10-30 山形日本電気株式会社 半導体ウェハのマーキング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06250768A (ja) * 1993-02-23 1994-09-09 Nec Corp キーボード装置

Also Published As

Publication number Publication date
JPS5735333A (en) 1982-02-25

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