JPS6211783B2 - - Google Patents

Info

Publication number
JPS6211783B2
JPS6211783B2 JP54172908A JP17290879A JPS6211783B2 JP S6211783 B2 JPS6211783 B2 JP S6211783B2 JP 54172908 A JP54172908 A JP 54172908A JP 17290879 A JP17290879 A JP 17290879A JP S6211783 B2 JPS6211783 B2 JP S6211783B2
Authority
JP
Japan
Prior art keywords
film
wiring
metal film
forming
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54172908A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5696845A (en
Inventor
Toshio Kurahashi
Chuichi Takada
Toshihiko Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17290879A priority Critical patent/JPS5696845A/ja
Publication of JPS5696845A publication Critical patent/JPS5696845A/ja
Publication of JPS6211783B2 publication Critical patent/JPS6211783B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP17290879A 1979-12-28 1979-12-28 Manufacture of semiconductor device Granted JPS5696845A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17290879A JPS5696845A (en) 1979-12-28 1979-12-28 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17290879A JPS5696845A (en) 1979-12-28 1979-12-28 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5696845A JPS5696845A (en) 1981-08-05
JPS6211783B2 true JPS6211783B2 (enrdf_load_stackoverflow) 1987-03-14

Family

ID=15950564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17290879A Granted JPS5696845A (en) 1979-12-28 1979-12-28 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5696845A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0828420B2 (ja) * 1986-04-09 1996-03-21 富士通株式会社 多層配線の形成方法
KR100593126B1 (ko) * 1999-12-29 2006-06-26 주식회사 하이닉스반도체 반도체 소자의 금속배선 형성방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4894866A (enrdf_load_stackoverflow) * 1972-03-15 1973-12-06

Also Published As

Publication number Publication date
JPS5696845A (en) 1981-08-05

Similar Documents

Publication Publication Date Title
JPH0669351A (ja) 多層金属配線構造のコンタクトの製造方法
JP2597396B2 (ja) シリコーンゴム膜のパターン形成方法
JPS6211783B2 (enrdf_load_stackoverflow)
JPH10312980A (ja) 半導体装置の製造方法
JPH10247661A (ja) ボンディング用構造の形成方法
JPH09306992A (ja) 半導体装置およびその製造方法
JPH065594A (ja) 半導体装置及びその製造方法
JPS5833854A (ja) 半導体装置の製造方法
JP2830636B2 (ja) 半導体装置の製造方法
JPH04287326A (ja) 半導体装置およびその製造方法
JPH0587973B2 (enrdf_load_stackoverflow)
KR100275949B1 (ko) 반도체장치의제조방법
JP2699389B2 (ja) 半導体装置の製造方法
JPS6378552A (ja) スル−ホ−ルの形成方法
JPH04250628A (ja) 半導体装置の製造方法
JPS5877246A (ja) 多層配線構造の形成方法
JPH01189939A (ja) 半導体集積回路
JPS596560A (ja) 半導体装置の製造方法
JPS61296722A (ja) 半導体装置の製造方法
JPS6227155B2 (enrdf_load_stackoverflow)
JPH0123944B2 (enrdf_load_stackoverflow)
JPH03209827A (ja) 多層配線型半導体集積回路装置
JPH02170553A (ja) 半導体装置の製造方法
JPS63312657A (ja) 半導体集積回路装置の製造方法
JPH05259112A (ja) 半導体装置の製造方法