JPS6211520B2 - - Google Patents

Info

Publication number
JPS6211520B2
JPS6211520B2 JP54137018A JP13701879A JPS6211520B2 JP S6211520 B2 JPS6211520 B2 JP S6211520B2 JP 54137018 A JP54137018 A JP 54137018A JP 13701879 A JP13701879 A JP 13701879A JP S6211520 B2 JPS6211520 B2 JP S6211520B2
Authority
JP
Japan
Prior art keywords
pallet
chip
chip element
plate
magazine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54137018A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5661194A (en
Inventor
Hitoshi Hasegawa
Masaaki Goto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13701879A priority Critical patent/JPS5661194A/ja
Priority to FR8022727A priority patent/FR2468285A1/fr
Priority to GB8034234A priority patent/GB2063227B/en
Priority to BR8006824A priority patent/BR8006824A/pt
Publication of JPS5661194A publication Critical patent/JPS5661194A/ja
Priority to MY8400337A priority patent/MY8400337A/xx
Publication of JPS6211520B2 publication Critical patent/JPS6211520B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP13701879A 1979-10-25 1979-10-25 Method of carrying chip element Granted JPS5661194A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP13701879A JPS5661194A (en) 1979-10-25 1979-10-25 Method of carrying chip element
FR8022727A FR2468285A1 (fr) 1979-10-25 1980-10-23 Procede et appareil pour monter des elements de circuit du type a broches sur une plaquette de circuit imprime
GB8034234A GB2063227B (en) 1979-10-25 1980-10-23 Method of mounting tip type circuit elements on a printed circuit board and apparatus for performing the same
BR8006824A BR8006824A (pt) 1979-10-25 1980-10-23 Processo para montar elementos de circuito em um painel de circuito impresso; e aparelho para a sua execucao
MY8400337A MY8400337A (en) 1979-10-25 1984-12-30 Method of mounting chip elements on a printed circuit board and apparatus for performing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13701879A JPS5661194A (en) 1979-10-25 1979-10-25 Method of carrying chip element

Publications (2)

Publication Number Publication Date
JPS5661194A JPS5661194A (en) 1981-05-26
JPS6211520B2 true JPS6211520B2 (zh) 1987-03-12

Family

ID=15188897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13701879A Granted JPS5661194A (en) 1979-10-25 1979-10-25 Method of carrying chip element

Country Status (5)

Country Link
JP (1) JPS5661194A (zh)
BR (1) BR8006824A (zh)
FR (1) FR2468285A1 (zh)
GB (1) GB2063227B (zh)
MY (1) MY8400337A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8201653A (nl) * 1982-04-21 1983-11-16 Philips Nv Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat.
US4722135A (en) * 1986-02-07 1988-02-02 General Electric Co. Apparatus for placing surface mounting devices on a printer circuit board
US4670981A (en) * 1986-03-17 1987-06-09 Nitto Kogyo Kabushiki Kaisha Method of mounting electronic parts on the predetermined positions of a printed circuit board
US4868974A (en) * 1987-09-01 1989-09-26 Sumitomo Electric Industries, Ltd. Chip mounting apparatus
US4985107A (en) * 1988-03-01 1991-01-15 Sci Systems, Inc. Component location device and method for surface-mount printed circuit boards
JP2020032512A (ja) * 2018-08-31 2020-03-05 日本電産株式会社 搬送用治具及びそれを備えた搬送装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1249067A (en) * 1969-03-12 1971-10-06 Int Computers Ltd Improvements in or relating to methods of connecting integrated circuit chips to printed circuit boards
JPS5537879B2 (zh) * 1973-10-15 1980-09-30
GB2017540B (en) * 1978-02-21 1982-08-18 Toko Inc Electronic component automatic insertion system and apparatus

Also Published As

Publication number Publication date
FR2468285B1 (zh) 1984-06-15
MY8400337A (en) 1984-12-31
GB2063227B (en) 1983-04-07
BR8006824A (pt) 1981-04-28
JPS5661194A (en) 1981-05-26
GB2063227A (en) 1981-06-03
FR2468285A1 (fr) 1981-04-30

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