JPS62104145A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS62104145A
JPS62104145A JP60245113A JP24511385A JPS62104145A JP S62104145 A JPS62104145 A JP S62104145A JP 60245113 A JP60245113 A JP 60245113A JP 24511385 A JP24511385 A JP 24511385A JP S62104145 A JPS62104145 A JP S62104145A
Authority
JP
Japan
Prior art keywords
case
corners
silicon gel
bonding
gel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60245113A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0418468B2 (enrdf_load_stackoverflow
Inventor
Yoshio Takagi
義夫 高木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60245113A priority Critical patent/JPS62104145A/ja
Publication of JPS62104145A publication Critical patent/JPS62104145A/ja
Publication of JPH0418468B2 publication Critical patent/JPH0418468B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60245113A 1985-10-31 1985-10-31 半導体装置 Granted JPS62104145A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60245113A JPS62104145A (ja) 1985-10-31 1985-10-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60245113A JPS62104145A (ja) 1985-10-31 1985-10-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS62104145A true JPS62104145A (ja) 1987-05-14
JPH0418468B2 JPH0418468B2 (enrdf_load_stackoverflow) 1992-03-27

Family

ID=17128814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60245113A Granted JPS62104145A (ja) 1985-10-31 1985-10-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS62104145A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6001918A (en) * 1997-07-10 1999-12-14 Dow Corning Toray Silicone Co., Ltd. Silicone gel composition for use as a sealant and a filler for electrical and electronic components and a gel prepared from this composition
US6001943A (en) * 1997-01-30 1999-12-14 Dow Corning Toray Silicone Co., Ltd. Silicone gel composition and silicone gel for use in sealing and filling of electrical and electronic parts
US7091580B2 (en) 2003-11-19 2006-08-15 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device
WO2015111409A1 (en) 2014-01-27 2015-07-30 Dow Corning Toray Co., Ltd. Silicone gel composition
WO2018056297A1 (ja) 2016-09-26 2018-03-29 東レ・ダウコーニング株式会社 硬化反応性シリコーンゲルおよびその用途
WO2018056298A1 (ja) 2016-09-26 2018-03-29 東レ・ダウコーニング株式会社 積層体、その製造方法および電子部品の製造方法
WO2018079678A1 (ja) 2016-10-31 2018-05-03 東レ・ダウコーニング株式会社 積層体および電子部品の製造方法
WO2019049950A1 (ja) 2017-09-11 2019-03-14 東レ・ダウコーニング株式会社 ラジカル反応性を有するシリコーンエラストマー硬化物およびその用途
US11396616B2 (en) 2017-04-06 2022-07-26 Dow Toray Co., Ltd. Liquid curable silicone adhesive composition, cured product thereof, and use thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167552U (enrdf_load_stackoverflow) * 1980-05-15 1981-12-11
JPS58121652A (ja) * 1981-12-11 1983-07-20 Fuji Electric Co Ltd 混成集積回路装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167552U (enrdf_load_stackoverflow) * 1980-05-15 1981-12-11
JPS58121652A (ja) * 1981-12-11 1983-07-20 Fuji Electric Co Ltd 混成集積回路装置

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6001943A (en) * 1997-01-30 1999-12-14 Dow Corning Toray Silicone Co., Ltd. Silicone gel composition and silicone gel for use in sealing and filling of electrical and electronic parts
US6001918A (en) * 1997-07-10 1999-12-14 Dow Corning Toray Silicone Co., Ltd. Silicone gel composition for use as a sealant and a filler for electrical and electronic components and a gel prepared from this composition
US7091580B2 (en) 2003-11-19 2006-08-15 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device
CN1307712C (zh) * 2003-11-19 2007-03-28 株式会社丰田自动织机 半导体器件
US10155852B2 (en) 2014-01-27 2018-12-18 Dow Corning Toray Co., Ltd. Silicone gel composition
WO2015111409A1 (en) 2014-01-27 2015-07-30 Dow Corning Toray Co., Ltd. Silicone gel composition
WO2018056297A1 (ja) 2016-09-26 2018-03-29 東レ・ダウコーニング株式会社 硬化反応性シリコーンゲルおよびその用途
WO2018056298A1 (ja) 2016-09-26 2018-03-29 東レ・ダウコーニング株式会社 積層体、その製造方法および電子部品の製造方法
KR20190046997A (ko) 2016-09-26 2019-05-07 다우 코닝 도레이 캄파니 리미티드 적층체, 이의 제조 방법 및 전자 부품의 제조 방법
KR20190051022A (ko) 2016-09-26 2019-05-14 다우 코닝 도레이 캄파니 리미티드 경화 반응성 실리콘 겔 및 이의 용도
US11279827B2 (en) 2016-09-26 2022-03-22 Dow Toray Co., Ltd. Curing reactive silicone gel and use thereof
WO2018079678A1 (ja) 2016-10-31 2018-05-03 東レ・ダウコーニング株式会社 積層体および電子部品の製造方法
KR20190080912A (ko) 2016-10-31 2019-07-08 다우 도레이 캄파니 리미티드 적층체 및 전자 부품 제조 방법
US10961419B2 (en) 2016-10-31 2021-03-30 Dow Toray Co., Ltd. Layered body and method for manufacturing electronic component
US11396616B2 (en) 2017-04-06 2022-07-26 Dow Toray Co., Ltd. Liquid curable silicone adhesive composition, cured product thereof, and use thereof
WO2019049950A1 (ja) 2017-09-11 2019-03-14 東レ・ダウコーニング株式会社 ラジカル反応性を有するシリコーンエラストマー硬化物およびその用途
US11981814B2 (en) 2017-09-11 2024-05-14 Dow Toray Co., Ltd. Cured silicone elastomer having radical reactivity and use of same

Also Published As

Publication number Publication date
JPH0418468B2 (enrdf_load_stackoverflow) 1992-03-27

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