JPS62104041A - ガラス封止形半導体装置の製造装置 - Google Patents
ガラス封止形半導体装置の製造装置Info
- Publication number
- JPS62104041A JPS62104041A JP24553885A JP24553885A JPS62104041A JP S62104041 A JPS62104041 A JP S62104041A JP 24553885 A JP24553885 A JP 24553885A JP 24553885 A JP24553885 A JP 24553885A JP S62104041 A JPS62104041 A JP S62104041A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- bonding
- substrate
- semi
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 238000001514 detection method Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims description 52
- 239000002184 metal Substances 0.000 claims description 52
- 230000002950 deficient Effects 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 33
- 229910000679 solder Inorganic materials 0.000 claims description 33
- 230000007246 mechanism Effects 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000003860 storage Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 9
- 210000000078 claw Anatomy 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 8
- 239000011120 plywood Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 claims 1
- 239000000047 product Substances 0.000 description 27
- 238000002788 crimping Methods 0.000 description 20
- 239000011265 semifinished product Substances 0.000 description 18
- 238000003384 imaging method Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 3
- 238000011179 visual inspection Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24553885A JPS62104041A (ja) | 1985-10-30 | 1985-10-30 | ガラス封止形半導体装置の製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24553885A JPS62104041A (ja) | 1985-10-30 | 1985-10-30 | ガラス封止形半導体装置の製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62104041A true JPS62104041A (ja) | 1987-05-14 |
| JPH0464460B2 JPH0464460B2 (enrdf_load_html_response) | 1992-10-15 |
Family
ID=17135185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24553885A Granted JPS62104041A (ja) | 1985-10-30 | 1985-10-30 | ガラス封止形半導体装置の製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62104041A (enrdf_load_html_response) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210115535A (ko) * | 2020-03-13 | 2021-09-27 | 주식회사 파워로직스 | 보호회로모듈 제조장치 |
-
1985
- 1985-10-30 JP JP24553885A patent/JPS62104041A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210115535A (ko) * | 2020-03-13 | 2021-09-27 | 주식회사 파워로직스 | 보호회로모듈 제조장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0464460B2 (enrdf_load_html_response) | 1992-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106486398B (zh) | 芯片贴装机、贴装方法及半导体器件的制造方法 | |
| JP2004311938A (ja) | マルチチップパッケージ用のダイ貼付と硬化インライン装置 | |
| KR102037948B1 (ko) | 다이 본딩 방법 및 장치 | |
| CN104160517A (zh) | 串行配线装置及配线方法以及太阳能电池模块制造装置及制造方法 | |
| TW202203333A (zh) | 物品之製造裝置、物品之製造方法、記錄媒體 | |
| WO2017124424A1 (zh) | 元件封装设备及其方法 | |
| JP2001068487A (ja) | チップボンディング方法及びその装置 | |
| JPS62104041A (ja) | ガラス封止形半導体装置の製造装置 | |
| CN115867017B (zh) | 一种细长柔性辅料自动贴装装置及制程工艺 | |
| JPH0675199A (ja) | 液晶パネル製造装置、位置決め装置および加工装置 | |
| JP2619123B2 (ja) | 半導体製造装置 | |
| CN116913793A (zh) | 一种igbt模块双上芯片贴片设备 | |
| US7655108B2 (en) | Display panel assembly apparatus and assembly method | |
| TWI753584B (zh) | 半導體封裝多重夾片黏合裝置及同裝置製造的半導體封裝 | |
| JP2950821B1 (ja) | ダイボンディング装置 | |
| JP2005311013A (ja) | ダイボンディング装置 | |
| KR100312744B1 (ko) | 씨에스피용 박막필름의 이송 및 클램프 장치 | |
| KR100740594B1 (ko) | 범프 형성 장치 | |
| KR100914986B1 (ko) | 칩 본딩 장비 | |
| JP2971180B2 (ja) | アウタリードボンディング装置 | |
| JP3287265B2 (ja) | チップのボンディング装置およびボンディング方法 | |
| JP3954250B2 (ja) | 部品装着方法 | |
| JP2754115B2 (ja) | ボンディング装置 | |
| JP3251235U (ja) | 集積回路デバイスパッケージング装置 | |
| JPS6122636A (ja) | マウント方法 |