JPS6193638A - ワイヤホンダ - Google Patents

ワイヤホンダ

Info

Publication number
JPS6193638A
JPS6193638A JP60212495A JP21249585A JPS6193638A JP S6193638 A JPS6193638 A JP S6193638A JP 60212495 A JP60212495 A JP 60212495A JP 21249585 A JP21249585 A JP 21249585A JP S6193638 A JPS6193638 A JP S6193638A
Authority
JP
Japan
Prior art keywords
wedge
bonding
wire
speed
pad electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60212495A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6224942B2 (enExample
Inventor
Kazuhisa Takashima
高島 一壽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60212495A priority Critical patent/JPS6193638A/ja
Publication of JPS6193638A publication Critical patent/JPS6193638A/ja
Publication of JPS6224942B2 publication Critical patent/JPS6224942B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/075
    • H10W70/682
    • H10W72/07141
    • H10W72/50
    • H10W72/5524
    • H10W72/932
    • H10W90/734
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP60212495A 1985-09-27 1985-09-27 ワイヤホンダ Granted JPS6193638A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60212495A JPS6193638A (ja) 1985-09-27 1985-09-27 ワイヤホンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60212495A JPS6193638A (ja) 1985-09-27 1985-09-27 ワイヤホンダ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP4902779A Division JPS55141736A (en) 1979-04-23 1979-04-23 Method for wirebonding and wirebonder

Publications (2)

Publication Number Publication Date
JPS6193638A true JPS6193638A (ja) 1986-05-12
JPS6224942B2 JPS6224942B2 (enExample) 1987-05-30

Family

ID=16623602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60212495A Granted JPS6193638A (ja) 1985-09-27 1985-09-27 ワイヤホンダ

Country Status (1)

Country Link
JP (1) JPS6193638A (enExample)

Also Published As

Publication number Publication date
JPS6224942B2 (enExample) 1987-05-30

Similar Documents

Publication Publication Date Title
EP0154579A3 (en) Lead wire bonding with increased bonding surface area
KR950009619B1 (ko) 반도체장치의 와이어 본딩방법
JP3329623B2 (ja) ワイヤボンディング装置およびワイヤボンディング方法
JP2506958B2 (ja) ワイヤボンディング装置
JPS6341215B2 (enExample)
JPH0713988B2 (ja) ワイヤボンディング方法
JPS6193638A (ja) ワイヤホンダ
US6871772B2 (en) Wire bonding apparatus
JP2676446B2 (ja) ワイヤボンディング方法
JP2001101636A (ja) ワイヤボンディング方法および装置
KR850000989B1 (ko) 와이어 본딩(Bonding) 방법
JPS6313344B2 (enExample)
JP3221191B2 (ja) ボンディング装置及びボンディング方法
JP2949891B2 (ja) ワイヤボンディング方法
JPS6246979B2 (enExample)
JP2524363B2 (ja) ワイヤボンディング装置
JPS6231822B2 (enExample)
JPS593850B2 (ja) 半導体ワイヤ−ボンディング装置
JPH01199442A (ja) ワイヤボンディング方法
JPS61105852A (ja) ワイヤボンダ
JPS58210629A (ja) ボンデイング方法及びその装置
JPH05326603A (ja) ワイヤボンダ
JP2998195B2 (ja) バンプボンディング装置およびバンプボンディング方法
JPS5917850B2 (ja) 自動ワイヤボンダ
JPH0153505B2 (enExample)