JPS6173355A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6173355A
JPS6173355A JP19464484A JP19464484A JPS6173355A JP S6173355 A JPS6173355 A JP S6173355A JP 19464484 A JP19464484 A JP 19464484A JP 19464484 A JP19464484 A JP 19464484A JP S6173355 A JPS6173355 A JP S6173355A
Authority
JP
Japan
Prior art keywords
leads
resin
row
lead
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19464484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0469431B2 (enrdf_load_stackoverflow
Inventor
Tomio Yamada
富男 山田
Koichiro Satonaka
里中　孝一郎
Akiro Hoshi
星　彰郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP19464484A priority Critical patent/JPS6173355A/ja
Publication of JPS6173355A publication Critical patent/JPS6173355A/ja
Publication of JPH0469431B2 publication Critical patent/JPH0469431B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP19464484A 1984-09-19 1984-09-19 半導体装置 Granted JPS6173355A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19464484A JPS6173355A (ja) 1984-09-19 1984-09-19 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19464484A JPS6173355A (ja) 1984-09-19 1984-09-19 半導体装置

Publications (2)

Publication Number Publication Date
JPS6173355A true JPS6173355A (ja) 1986-04-15
JPH0469431B2 JPH0469431B2 (enrdf_load_stackoverflow) 1992-11-06

Family

ID=16327938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19464484A Granted JPS6173355A (ja) 1984-09-19 1984-09-19 半導体装置

Country Status (1)

Country Link
JP (1) JPS6173355A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09214120A (ja) * 1997-01-27 1997-08-15 Canon Inc 電子部品の半田付け方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5609574B2 (ja) * 2010-11-12 2014-10-22 三菱電機株式会社 方向性結合器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947567U (enrdf_load_stackoverflow) * 1972-08-02 1974-04-25
JPS55156459U (enrdf_load_stackoverflow) * 1980-02-20 1980-11-11
JPS58298U (ja) * 1981-06-24 1983-01-05 株式会社椿本チエイン 傘乾燥機

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947567U (enrdf_load_stackoverflow) * 1972-08-02 1974-04-25
JPS55156459U (enrdf_load_stackoverflow) * 1980-02-20 1980-11-11
JPS58298U (ja) * 1981-06-24 1983-01-05 株式会社椿本チエイン 傘乾燥機

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09214120A (ja) * 1997-01-27 1997-08-15 Canon Inc 電子部品の半田付け方法

Also Published As

Publication number Publication date
JPH0469431B2 (enrdf_load_stackoverflow) 1992-11-06

Similar Documents

Publication Publication Date Title
US6002167A (en) Semiconductor device having lead on chip structure
EP0628997B1 (en) Semiconductor device with small die pad and method of making same
US5471088A (en) Semiconductor package and method for manufacturing the same
US20010017410A1 (en) Mounting multiple semiconductor dies in a package
JPS61269345A (ja) 半導体装置
JPH05501176A (ja) 多段リード配列を持つリードフレーム
JP2003282809A (ja) 半導体装置およびその製造方法
US6134111A (en) Vertical surface mount apparatus with thermal carrier
EP0086724A2 (en) Integrated circuit lead frame with improved power dissipation
JPS6173355A (ja) 半導体装置
JP2002100722A (ja) 半導体装置
JPH0382148A (ja) 半導体装置
JPS6143457A (ja) 半導体装置
JPH11340400A (ja) 半導体装置およびその製造方法並びにそれに使用されるリードフレーム
JPS61237458A (ja) 樹脂封止型半導体装置
KR100321149B1 (ko) 칩사이즈 패키지
JP2504194B2 (ja) 樹脂封止型半導体装置の製造方法
JPS63208255A (ja) 電子装置
JPH1154685A (ja) 半導体装置およびそれに使用されるリードフレーム
US6472731B2 (en) Solder clad lead frame for assembly of semiconductor devices and method
JPH02278857A (ja) 樹脂封止型半導体装置
KR200235610Y1 (ko) 적층형반도체패키지
JP3419898B2 (ja) 半導体装置及びその製造方法
JPH0714951A (ja) 縦型表面実装樹脂封止型半導体装置
KR940004148B1 (ko) 소켓형 디바이스와 그 제조방법