JPS4947567U - - Google Patents

Info

Publication number
JPS4947567U
JPS4947567U JP9146972U JP9146972U JPS4947567U JP S4947567 U JPS4947567 U JP S4947567U JP 9146972 U JP9146972 U JP 9146972U JP 9146972 U JP9146972 U JP 9146972U JP S4947567 U JPS4947567 U JP S4947567U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9146972U
Other languages
Japanese (ja)
Other versions
JPS5238915Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9146972U priority Critical patent/JPS5238915Y2/ja
Publication of JPS4947567U publication Critical patent/JPS4947567U/ja
Application granted granted Critical
Publication of JPS5238915Y2 publication Critical patent/JPS5238915Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP9146972U 1972-08-02 1972-08-02 Expired JPS5238915Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9146972U JPS5238915Y2 (enrdf_load_stackoverflow) 1972-08-02 1972-08-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9146972U JPS5238915Y2 (enrdf_load_stackoverflow) 1972-08-02 1972-08-02

Publications (2)

Publication Number Publication Date
JPS4947567U true JPS4947567U (enrdf_load_stackoverflow) 1974-04-25
JPS5238915Y2 JPS5238915Y2 (enrdf_load_stackoverflow) 1977-09-03

Family

ID=28280512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9146972U Expired JPS5238915Y2 (enrdf_load_stackoverflow) 1972-08-02 1972-08-02

Country Status (1)

Country Link
JP (1) JPS5238915Y2 (enrdf_load_stackoverflow)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5277376U (enrdf_load_stackoverflow) * 1975-12-09 1977-06-09
JPS57140747U (enrdf_load_stackoverflow) * 1981-02-27 1982-09-03
JPS5956751A (ja) * 1983-08-26 1984-04-02 Hitachi Ltd 半導体装置
JPS6173355A (ja) * 1984-09-19 1986-04-15 Hitachi Ltd 半導体装置
ITMI20111216A1 (it) * 2011-06-30 2012-12-31 St Microelectronics Srl Dispositivo elettronico di potenza ad elevata dissipazione di calore e stabilita?
US8723311B2 (en) 2011-06-30 2014-05-13 Stmicroelectronics S.R.L. Half-bridge electronic device with common heat sink on mounting surface
US8755188B2 (en) 2011-06-30 2014-06-17 Stmicroelectronics S.R.L. Half-bridge electronic device with common auxiliary heat sink
US8817475B2 (en) 2011-06-30 2014-08-26 Stmicroelectronics S.R.L. System with shared heatsink
US8837154B2 (en) 2011-06-30 2014-09-16 Stmicroelectronics S.R.L. System with stabilized heatsink
US9105598B2 (en) 2011-06-30 2015-08-11 Stmicroelectronics S.R.L. Package/heatsink system for electronic device
US9275943B2 (en) 2011-06-30 2016-03-01 Stmicroelectronics S.R.L. Power device having reduced thickness

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5277376U (enrdf_load_stackoverflow) * 1975-12-09 1977-06-09
JPS57140747U (enrdf_load_stackoverflow) * 1981-02-27 1982-09-03
JPS5956751A (ja) * 1983-08-26 1984-04-02 Hitachi Ltd 半導体装置
JPS6173355A (ja) * 1984-09-19 1986-04-15 Hitachi Ltd 半導体装置
ITMI20111216A1 (it) * 2011-06-30 2012-12-31 St Microelectronics Srl Dispositivo elettronico di potenza ad elevata dissipazione di calore e stabilita?
US8723311B2 (en) 2011-06-30 2014-05-13 Stmicroelectronics S.R.L. Half-bridge electronic device with common heat sink on mounting surface
US8755188B2 (en) 2011-06-30 2014-06-17 Stmicroelectronics S.R.L. Half-bridge electronic device with common auxiliary heat sink
US8817475B2 (en) 2011-06-30 2014-08-26 Stmicroelectronics S.R.L. System with shared heatsink
US8837154B2 (en) 2011-06-30 2014-09-16 Stmicroelectronics S.R.L. System with stabilized heatsink
US8837153B2 (en) 2011-06-30 2014-09-16 Stmicroelectronics S.R.L. Power electronic device having high heat dissipation and stability
US9105598B2 (en) 2011-06-30 2015-08-11 Stmicroelectronics S.R.L. Package/heatsink system for electronic device
US9275943B2 (en) 2011-06-30 2016-03-01 Stmicroelectronics S.R.L. Power device having reduced thickness
US9786516B2 (en) 2011-06-30 2017-10-10 Stmicroelectronics S.R.L. Power device having reduced thickness

Also Published As

Publication number Publication date
JPS5238915Y2 (enrdf_load_stackoverflow) 1977-09-03

Similar Documents

Publication Publication Date Title
FR2197656B1 (enrdf_load_stackoverflow)
JPS4947567U (enrdf_load_stackoverflow)
NO133124C (enrdf_load_stackoverflow)
JPS4995637A (enrdf_load_stackoverflow)
FR2183240B1 (enrdf_load_stackoverflow)
JPS5650499Y2 (enrdf_load_stackoverflow)
JPS5747169B2 (enrdf_load_stackoverflow)
JPS5245805Y2 (enrdf_load_stackoverflow)
JPS5240316B2 (enrdf_load_stackoverflow)
CS157405B1 (enrdf_load_stackoverflow)
FR2168901A2 (enrdf_load_stackoverflow)
CS157569B1 (enrdf_load_stackoverflow)
CS159086B1 (enrdf_load_stackoverflow)
CS160332B1 (enrdf_load_stackoverflow)
CS160809B1 (enrdf_load_stackoverflow)
JPS4979071A (enrdf_load_stackoverflow)
CS153963B1 (enrdf_load_stackoverflow)
CH569028A5 (enrdf_load_stackoverflow)
CH587806A5 (enrdf_load_stackoverflow)
CH561107A5 (enrdf_load_stackoverflow)
CH561373A5 (enrdf_load_stackoverflow)
CH562147A5 (enrdf_load_stackoverflow)
CH580680A5 (enrdf_load_stackoverflow)
CH569032A5 (enrdf_load_stackoverflow)
BG19848A1 (enrdf_load_stackoverflow)