JPH0469431B2 - - Google Patents

Info

Publication number
JPH0469431B2
JPH0469431B2 JP59194644A JP19464484A JPH0469431B2 JP H0469431 B2 JPH0469431 B2 JP H0469431B2 JP 59194644 A JP59194644 A JP 59194644A JP 19464484 A JP19464484 A JP 19464484A JP H0469431 B2 JPH0469431 B2 JP H0469431B2
Authority
JP
Japan
Prior art keywords
leads
lead
main surface
resin
lead arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59194644A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6173355A (ja
Inventor
Tomio Yamada
Koichiro Satonaka
Akiro Hoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP19464484A priority Critical patent/JPS6173355A/ja
Publication of JPS6173355A publication Critical patent/JPS6173355A/ja
Publication of JPH0469431B2 publication Critical patent/JPH0469431B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP19464484A 1984-09-19 1984-09-19 半導体装置 Granted JPS6173355A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19464484A JPS6173355A (ja) 1984-09-19 1984-09-19 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19464484A JPS6173355A (ja) 1984-09-19 1984-09-19 半導体装置

Publications (2)

Publication Number Publication Date
JPS6173355A JPS6173355A (ja) 1986-04-15
JPH0469431B2 true JPH0469431B2 (enrdf_load_stackoverflow) 1992-11-06

Family

ID=16327938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19464484A Granted JPS6173355A (ja) 1984-09-19 1984-09-19 半導体装置

Country Status (1)

Country Link
JP (1) JPS6173355A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101329611B1 (ko) * 2010-11-12 2013-11-15 미쓰비시덴키 가부시키가이샤 방향성 결합기

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09214120A (ja) * 1997-01-27 1997-08-15 Canon Inc 電子部品の半田付け方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5238915Y2 (enrdf_load_stackoverflow) * 1972-08-02 1977-09-03
JPS55156459U (enrdf_load_stackoverflow) * 1980-02-20 1980-11-11
JPS58298U (ja) * 1981-06-24 1983-01-05 株式会社椿本チエイン 傘乾燥機

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101329611B1 (ko) * 2010-11-12 2013-11-15 미쓰비시덴키 가부시키가이샤 방향성 결합기

Also Published As

Publication number Publication date
JPS6173355A (ja) 1986-04-15

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