JPS616832A - 実装体 - Google Patents

実装体

Info

Publication number
JPS616832A
JPS616832A JP59127005A JP12700584A JPS616832A JP S616832 A JPS616832 A JP S616832A JP 59127005 A JP59127005 A JP 59127005A JP 12700584 A JP12700584 A JP 12700584A JP S616832 A JPS616832 A JP S616832A
Authority
JP
Japan
Prior art keywords
aperture
lead group
flexible film
bent
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59127005A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0430741B2 (en:Method
Inventor
Kenzo Hatada
畑田　賢造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59127005A priority Critical patent/JPS616832A/ja
Publication of JPS616832A publication Critical patent/JPS616832A/ja
Publication of JPH0430741B2 publication Critical patent/JPH0430741B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59127005A 1984-06-20 1984-06-20 実装体 Granted JPS616832A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59127005A JPS616832A (ja) 1984-06-20 1984-06-20 実装体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59127005A JPS616832A (ja) 1984-06-20 1984-06-20 実装体

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP6256502A Division JP2568812B2 (ja) 1994-10-21 1994-10-21 実装体
JP6256503A Division JP2606673B2 (ja) 1994-10-21 1994-10-21 実装体

Publications (2)

Publication Number Publication Date
JPS616832A true JPS616832A (ja) 1986-01-13
JPH0430741B2 JPH0430741B2 (en:Method) 1992-05-22

Family

ID=14949322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59127005A Granted JPS616832A (ja) 1984-06-20 1984-06-20 実装体

Country Status (1)

Country Link
JP (1) JPS616832A (en:Method)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6223124A (ja) * 1985-07-23 1987-01-31 Sharp Corp フィルムキャリアｌｓｉ
JPH02132418A (ja) * 1988-07-11 1990-05-21 Toshiba Corp フレキシブル配線基板及びその製造方法及び電子部品
JPH04359443A (ja) * 1991-06-05 1992-12-11 Hitachi Cable Ltd Ｔａｂ用テープキャリア
JPH05283487A (ja) * 1992-04-03 1993-10-29 Mitsubishi Electric Corp 高周波信号用配線及びそのボンディング装置
US5398128A (en) * 1991-05-21 1995-03-14 Sharp Kabushiki Kaisha Wiring board for use in a liquid crystal panel and method of making including forming resin over slit before bending
KR100524484B1 (ko) * 1998-07-29 2006-01-12 삼성전자주식회사 엘시디 모듈

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51140174A (en) * 1975-05-28 1976-12-02 Sharp Kk Method of connecting flexible substrate and other devices
JPS538575U (en:Method) * 1976-07-07 1978-01-25
JPS5364248U (en:Method) * 1976-11-04 1978-05-30
JPS55166988A (en) * 1979-06-14 1980-12-26 Olympus Optical Co Flexible printed circuit board
JPS5775450A (en) * 1980-10-28 1982-05-12 Matsushita Electric Ind Co Ltd Manufacture of electronic circuit device
JPS58188684U (ja) * 1982-06-10 1983-12-15 セイコーエプソン株式会社 電子表示装置
JPS60216573A (ja) * 1984-04-12 1985-10-30 Seiko Epson Corp フレキシブル印刷配線板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51140174A (en) * 1975-05-28 1976-12-02 Sharp Kk Method of connecting flexible substrate and other devices
JPS538575U (en:Method) * 1976-07-07 1978-01-25
JPS5364248U (en:Method) * 1976-11-04 1978-05-30
JPS55166988A (en) * 1979-06-14 1980-12-26 Olympus Optical Co Flexible printed circuit board
JPS5775450A (en) * 1980-10-28 1982-05-12 Matsushita Electric Ind Co Ltd Manufacture of electronic circuit device
JPS58188684U (ja) * 1982-06-10 1983-12-15 セイコーエプソン株式会社 電子表示装置
JPS60216573A (ja) * 1984-04-12 1985-10-30 Seiko Epson Corp フレキシブル印刷配線板の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6223124A (ja) * 1985-07-23 1987-01-31 Sharp Corp フィルムキャリアｌｓｉ
JPH02132418A (ja) * 1988-07-11 1990-05-21 Toshiba Corp フレキシブル配線基板及びその製造方法及び電子部品
US5398128A (en) * 1991-05-21 1995-03-14 Sharp Kabushiki Kaisha Wiring board for use in a liquid crystal panel and method of making including forming resin over slit before bending
JPH04359443A (ja) * 1991-06-05 1992-12-11 Hitachi Cable Ltd Ｔａｂ用テープキャリア
JPH05283487A (ja) * 1992-04-03 1993-10-29 Mitsubishi Electric Corp 高周波信号用配線及びそのボンディング装置
KR100524484B1 (ko) * 1998-07-29 2006-01-12 삼성전자주식회사 엘시디 모듈

Also Published As

Publication number Publication date
JPH0430741B2 (en:Method) 1992-05-22

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term