JPS6161847U - - Google Patents
Info
- Publication number
- JPS6161847U JPS6161847U JP1984146667U JP14666784U JPS6161847U JP S6161847 U JPS6161847 U JP S6161847U JP 1984146667 U JP1984146667 U JP 1984146667U JP 14666784 U JP14666784 U JP 14666784U JP S6161847 U JPS6161847 U JP S6161847U
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- electrode
- diode chip
- integrated
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/404—Connecting portions
- H01L2224/40475—Connecting portions connected to auxiliary connecting means on the bonding areas
- H01L2224/40491—Connecting portions connected to auxiliary connecting means on the bonding areas being an additional member attached to the bonding area through an adhesive or solder, e.g. buffer pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Rectifiers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984146667U JPH0322925Y2 (tr) | 1984-09-28 | 1984-09-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984146667U JPH0322925Y2 (tr) | 1984-09-28 | 1984-09-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6161847U true JPS6161847U (tr) | 1986-04-25 |
JPH0322925Y2 JPH0322925Y2 (tr) | 1991-05-20 |
Family
ID=30704901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984146667U Expired JPH0322925Y2 (tr) | 1984-09-28 | 1984-09-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0322925Y2 (tr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01115183U (tr) * | 1988-01-28 | 1989-08-02 | ||
JPH0682862U (ja) * | 1991-03-14 | 1994-11-25 | 新電元工業株式会社 | ブリッジ型半導体装置 |
JP2009110981A (ja) * | 2007-10-26 | 2009-05-21 | Mitsubishi Electric Corp | 半導体モジュール |
JP2014072349A (ja) * | 2012-09-28 | 2014-04-21 | Sanken Electric Co Ltd | 半導体装置 |
JP2014072350A (ja) * | 2012-09-28 | 2014-04-21 | Sanken Electric Co Ltd | 半導体装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5177341A (ja) * | 1974-12-27 | 1976-07-05 | Furukawa Electric Co Ltd | Garasuhikaridensotaisogono setsuzokuhoho |
JPS5320945U (tr) * | 1976-07-30 | 1978-02-22 | ||
JPS5432075A (en) * | 1977-08-15 | 1979-03-09 | Nec Corp | Semiconductor device |
JPS5660024A (en) * | 1979-10-22 | 1981-05-23 | Hitachi Ltd | Composite type semiconductor device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5320945B2 (tr) * | 1973-01-30 | 1978-06-29 |
-
1984
- 1984-09-28 JP JP1984146667U patent/JPH0322925Y2/ja not_active Expired
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5177341A (ja) * | 1974-12-27 | 1976-07-05 | Furukawa Electric Co Ltd | Garasuhikaridensotaisogono setsuzokuhoho |
JPS5320945U (tr) * | 1976-07-30 | 1978-02-22 | ||
JPS5432075A (en) * | 1977-08-15 | 1979-03-09 | Nec Corp | Semiconductor device |
JPS5660024A (en) * | 1979-10-22 | 1981-05-23 | Hitachi Ltd | Composite type semiconductor device |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01115183U (tr) * | 1988-01-28 | 1989-08-02 | ||
JPH0682862U (ja) * | 1991-03-14 | 1994-11-25 | 新電元工業株式会社 | ブリッジ型半導体装置 |
JP2009110981A (ja) * | 2007-10-26 | 2009-05-21 | Mitsubishi Electric Corp | 半導体モジュール |
JP2014072349A (ja) * | 2012-09-28 | 2014-04-21 | Sanken Electric Co Ltd | 半導体装置 |
JP2014072350A (ja) * | 2012-09-28 | 2014-04-21 | Sanken Electric Co Ltd | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0322925Y2 (tr) | 1991-05-20 |
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