JPH02140850U - - Google Patents
Info
- Publication number
- JPH02140850U JPH02140850U JP4881889U JP4881889U JPH02140850U JP H02140850 U JPH02140850 U JP H02140850U JP 4881889 U JP4881889 U JP 4881889U JP 4881889 U JP4881889 U JP 4881889U JP H02140850 U JPH02140850 U JP H02140850U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- electrodes
- protruding electrodes
- bonded
- sealant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4881889U JPH02140850U (tr) | 1989-04-27 | 1989-04-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4881889U JPH02140850U (tr) | 1989-04-27 | 1989-04-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02140850U true JPH02140850U (tr) | 1990-11-26 |
Family
ID=31565969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4881889U Pending JPH02140850U (tr) | 1989-04-27 | 1989-04-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02140850U (tr) |
-
1989
- 1989-04-27 JP JP4881889U patent/JPH02140850U/ja active Pending
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